2004 Fiscal Year Final Research Report Summary
Development to Determine The Components of Plane Stress Using Whole Diffraction Ring.
| Project/Area Number |
14550088
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Materials/Mechanics of materials
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| Research Institution | Musashi Institute of Technology |
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Principal Investigator |
OHYA Shin-ichi Musashi Institute of Technology, Faculty of Engineering, Professor, 工学部, 教授 (80120864)
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| Co-Investigator(Kenkyū-buntansha) |
HAGIWARA Yoshihiko Musashi Institute of Technology, Faculty of Engineering, Professor, 工学部, 教授 (70061546)
AKITA Koichi Musashi Institute of Technology, Faculty of Engineering, Professor, 工学部, 助教授 (10231820)
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| Project Period (FY) |
2002 – 2004
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| Keywords | X-ray stress measurement / Diffraction ring / Position sensitive detector / Multi-regression analysis / Plane stress components |
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| Research Abstract |
X-ray stress measuring technique is effective nondestructive tool to measure residual stresses and applied stresses in polycrystalline materials with sufficient reliability. Most popular X-ray stress measurement method is the sin^2Ψ method by which the lattice strains at the various angles of Ψ, between the normal of a diffraction plane and normal of a specimen surface, linearly depend on sin^2Ψ. The stress in the direction of Ψ-inclination is determined from strains at the various Ψ angles using theory of elasticity. The sin^2Ψ method is widely used as laboratory technique and the field measurement. In the field measurement, there is mainly a difficult case in the measurement by the sin^2Ψ method because of constraint of space for Ψ-inclination.
By the way, in former time, the cos α method using flat pinhole camera containing X-ray film has been proposed. This method is that the plane stress components, σ_x,σ_y,τ_<xy>, are determined by using the whole diffraction ring obtained at only a Ψ angle according to back-reflection of X-rays. This method has the advantage that misalignment of specimen hardly influences for measured stress and that there are a little spatial constraint in measuring stress. However, the cosa method using X-ray film has a problem that measured stresses are influenced by the determination accuracy of incident X-ray position.
In this study, new principle of stress measurement using whole diffraction ring was proposed. And stress analyzer based on the new method was developed. As a result, it was clarified that this analyzer enables to measure plane stress components. And this method can sufficiently contribute to study on material science and use for field stress measurement. This investigation was presented in The 7^<th> International Conference of Residual Stresses on June in 2004,the high evaluation was obtained for degree of useful of this method.
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