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2005 Fiscal Year Final Research Report Summary

Integrated Reliability Evaluation and Design for Advanced 3D Electronics Packaging

Research Project

Project/Area Number 15360048
Research Category

Grant-in-Aid for Scientific Research (B)

Allocation TypeSingle-year Grants
Section一般
Research Field Materials/Mechanics of materials
Research InstitutionYokohama National University

Principal Investigator

YU Qiang  Yokohama National University, Faculty of Engineering, Assistant Professor, 大学院・工学研究院, 助教授 (80242379)

Co-Investigator(Kenkyū-buntansha) SHIRATORI Masaki  Yokohama National University, Faculty of Engineering, Professor, 大学院・工学研究院, 教授 (60017986)
SHIBUTANI Tadahiro  Yokohama National University, Faculty of Engineering, Research Associate, 大学院・工学研究院, 助手 (10332644)
Project Period (FY) 2003 – 2005
KeywordsElectronics packaging / Reliability Evaluation / Integrated Reliability Design / Solder Joints / Influence of the design factors / Clustering analysis / Response Surface Method / Database for Fatigue Life
Research Abstract

It is forecast that high-density packaging, including 3D packaging, will become a main surface mount technology because of a need in the high-frequency areas of high-speed signal transmission. In the 3D packaging technology, an integrated design that unites the technology of semiconductor design, substrate design and equipment design is necessary. In addition, it is necessary to shorten the development time by completing the design at an early design stage in order to dominate technological competition. Additionally, due to the environmental problems associated with lead, the movement to establish regulations for the removal of lead and the use of lead-free solder material to replace Sn-Pb solder are growing rapidly now. With such new 3D packaging technology and design concepts, the reliability assessment and establishment of design techniques are very important factors.
In this paper, reliability assessment and design problems, which must be solved before lead-free solder can be used in practical applications, are examined using analytical and experimental methods. Through this study, reliability assessment and design problems, which have become very important in practical applications of lead-free solder, are shown, and solutions for these problems are proposed. As a result of this study, it is possible to improve the reliability of lead-free solder joints and the efficiency of reliability assessments as well as to reduce production costs by shortening the design period.

  • Research Products

    (16 results)

All 2005 2004

All Journal Article (16 results)

  • [Journal Article] Electrostatically Actuated Micromirror Array Assembled by Using Solder Flip Chip Bonding and Electro-Thermal Fuse-Away Tethers2005

    • Author(s)
      石川浩嗣, 三木隆弘, 間宮宏樹, 干強
    • Journal Title

      エレクトロニクス実装学会誌 8・2

      Pages: 108-115

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] ナノスクラッチ試験によるSi3N4/Cu薄膜界面損傷機構2005

    • Author(s)
      澁谷忠弘, 干強, 白鳥正樹, 赤井武志
    • Journal Title

      日本機械学会論文集(A編) 71・706

      Pages: 884-890

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] 実装信頼性評価・設計におけるシミュレーション技術とその応用2005

    • Author(s)
      干強, 白鳥正樹
    • Journal Title

      電子情報通信学会論文誌C Vol.J88-C・11

      Pages: 851-858

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] Fatigue reliability evaluation for Sn-Zn-Bi and Sn-Zn lead-free solder joints2005

    • Author(s)
      Qiang Yu, Jae-Chul Jin, Do-Seop Kim, Masaki Shiratori
    • Journal Title

      Materials Transactions 46・11

      Pages: 2316-2321

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] The assessment of influence of the design factors on the reliability of BGA solder joints2005

    • Author(s)
      Jae-Chul Jin, Qiang Yu, Tadahiro Shibutani, Hirokazu Abe, Masaki Shiratori
    • Journal Title

      Key Engineering Materials 297-300

      Pages: 1822-1827

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] Electrostatically Actuated Micromirror Array Assembled by Using Solder Flip Chip Bonding and Electro-Thermal Fuse-Away Tethers2005

    • Author(s)
      Koji Ishikawa, Takahiro Miki, Hiroki Mamiya, Qiang Yu
    • Journal Title

      Journal of Japan Institute of Electronics Packaging Vol.8, No.2

      Pages: 108-115

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Mechanism of Damage Process on the Si3N4/Cu Interface in Nanoscratch Test2005

    • Author(s)
      Tadahiro Shibutani, Qiang Yu, Masaki Shiratori, Takeshi Akai
    • Journal Title

      Transactions of the JSME Vol.71, No.706

      Pages: 884-890

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Simulation Technologies and Applications for Reliability Assessment and Design of Electronics Packaging2005

    • Author(s)
      Qiang Yu, Masaki Shiratori
    • Journal Title

      IEICE Transactions on Electronics Vol.J88-C, No.11

      Pages: 851-858

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Fatigue reliability evaluation for Sn-Zn-Bi and Sn-Zn lead-free solder joints2005

    • Author(s)
      Qiang Yu, Jae-Chul Jin, Do-Seop Kim, Masaki Shiratori
    • Journal Title

      Materials Transactions Vol.46, No.11

      Pages: 2316-2321

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] The assessment of influence of the design factors on the reliability of BGA solder joints2005

    • Author(s)
      Jae-Chul Jin, Qiang Yu, Tadahiro Shibutani, Hirokazu Abe, Masaki Shiratori
    • Journal Title

      Key Engineering Materials Vols.297-300

      Pages: 1822-1827

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] 鉛フリーはんだ接合部の応力・非線形ひずみ振幅評価に及ぼす硬化則の影響2004

    • Author(s)
      金道燮, 干強, 澁谷忠弘, 白烏正樹
    • Journal Title

      エレクトロニクス実装学会誌 7-2

      Pages: 161-169

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] 階層的クラスタリングに基づく応答曲面法2004

    • Author(s)
      影山雄介, 干強
    • Journal Title

      日本機械学会論文集(A編) 70・695

      Pages: 953-961

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] 多層サブミクロン薄膜における界面コーナー部はく離発生条件の破壊力学的評価2004

    • Author(s)
      澁谷忠弘, 干強, 白鳥正樹, 鶴賀哲
    • Journal Title

      材料 53・8

      Pages: 850-855

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] Nonlinear Behavior Study on Effect of Hardening Rule of Lead Free Solder Joint2004

    • Author(s)
      Do-Seop Kim, Qiang Yu, Tadahiro Shibutani, Masaki Shiratori
    • Journal Title

      Journal of Japan Institute of Electronics Packaging Vol.7, No.2

      Pages: 161-169

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Response Surface Method Using Hierarchical Clustering2004

    • Author(s)
      Yusuke Kageyama, Qiang Yu
    • Journal Title

      Transactions of the JSME Vol.70, No.695

      Pages: 953-961

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Evaluation of Crack Initiation at the Corner of the Interface between Sub-Micron Films on the Basis of Fracture Mechanics Concept2004

    • Author(s)
      Tadahiro Shibutani, Qiang Yu, Masaki Shiratori, Tetsu Tsuruga
    • Journal Title

      J.Soc.Mat.Sci.Japan Vol.53, No.8

      Pages: 850-855

    • Description
      「研究成果報告書概要(欧文)」より

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Published: 2007-12-13  

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