Development of Integrated Health Management for High Reliability Electronics Based on Synchrotron Radiation Computed Tomography Technologies

2017 Fiscal Year Final Research Report

• Project/Area Number: 15K05708
• Research Category: Grant-in-Aid for Scientific Research (C)
• Allocation Type: Multi-year Fund
• Section: 一般
• Research Field: Materials/Mechanics of materials
• Research Institution: Toyama Industrial Technology Center,
• Principal Investigator: Sayama Toshihiko 富山県工業技術センター, その他部局等, 課長 (40416128)
• Co-Investigator(Kenkyū-buntansha): 森 孝男 富山県立大学, 工学部, 教授 (30275078) ; 釣谷 浩之 富山県工業技術センター, その他部局等, 主任研究員 (70416147)
• Co-Investigator(Renkei-kenkyūsha): UESUGI KENTARO 財団法人高輝度光科学研究センター, 利用研究促進部門イメージングチーム, 主席研究員 (80344399)
• Project Period (FY): 2015-04-01 – 2018-03-31
• Keywords: 信頼性設計 / 高密度実装 / マイクロ接合部 / X線マイクロCT / 放射光 / はんだ / 熱疲労 / 寿命評価

Outline of Final Research Achievements

In order to manage the strength reliability of the actual joints on printed circuit boards, a practical monitoring technique was investigated by applying synchrotron radiation laminography. The technique realized in-situ nondestructive monitoring of the joints through the fatigue process due to cyclic energization loading, in which the cracks initiate, propagate, and reach to failure, and then led to the integrated estimation of the fatigue lifetime. This result will widely contribute to the improvement of the reliability and the development of electronic equipment.

Free Research Field

機械材料・材料力学