Development of chemical slicing method for Photovaltaic materials with low ker-loss and thin wafer thickness

2017 Fiscal Year Final Research Report

• Project/Area Number: 15K05736
• Research Category: Grant-in-Aid for Scientific Research (C)
• Allocation Type: Multi-year Fund
• Section: 一般
• Research Field: Production engineering/Processing studies
• Research Institution: Kindai University
• Principal Investigator: Murata Junji 近畿大学, 理工学部, 准教授 (70531474)
• Project Period (FY): 2015-04-01 – 2018-03-31
• Keywords: 切断加工 / エッチング / 太陽電池

Outline of Final Research Achievements

Novel abrasive free slicing method for photovoltaic materials has been developed to achieve damage free wafer surface with a low kerf loss. In this method, a chemical etchant is supplied to the material and the material surface is abraded by a wire tool. In this research, studies to improve a material removal rate, to achieve multi-wire processing, to scale up the material size, and to reduce the use of HF solution has been conducted. Although the material removal rate remain an issue, the multi-wire processing with lower kerf loss has been achieved, compared with the conventional mechanical machining. Further, an etching method employing an UV-assisted etching with optical fiber has been developed without using HF solution.

Free Research Field

精密加工