2017 Fiscal Year Final Research Report
Fundamental study of liquid cooling methodology for layered electrical components and its optimization
| Project/Area Number |
15K05836
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Multi-year Fund |
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| Section | 一般 |
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| Research Field |
Thermal engineering
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| Research Institution | Toyama Prefectural University |
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Principal Investigator |
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| Research Collaborator |
HATAKEYAMA Tomoyuki
SEIKE Miho
HIROSE Ryohei
IIDA Keisuke
SCHIANO Thomas
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| Project Period (FY) |
2015-10-21 – 2018-03-31
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| Keywords | 電子機器冷却 / 熱流体シミュレーション |
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| Outline of Final Research Achievements |
The performance of the electronic equipment is greatly improving but the size of it becomes small. Layered structure of the electronic component is one of the key technology for achieving the both high performance and small size. However, the difficulty of the cooling in the layered structure will be the bottleneck for the future electronic equipment. This study aims to acquire the basic knowledge and technique of the cooling system which is suitable for the layered structure. Experimental system for evaluate the heat and fluid characteristics of the liquid cooling system has been established. Computational simulation system for reproduce the experimental result has been constructed using open-source software and supercomputers. Outcomes from this study can help the development and optimization of the thin liquid cooling system for the layered structure.
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| Free Research Field |
熱流体工学
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