Development of interconnection techniques at room temperature for printed devices with a high form factor

2016 Fiscal Year Final Research Report

• Project/Area Number: 15K18060
• Research Category: Grant-in-Aid for Young Scientists (B)
• Allocation Type: Multi-year Fund
• Research Field: Electron device/Electronic equipment
• Research Institution: National Institute of Advanced Industrial Science and Technology
• Principal Investigator: Ken-ichi Nomura 国立研究開発法人産業技術総合研究所, フレキシブルエレクトロニクス研究センター, 主任研究員 (00580078)
• Project Period (FY): 2015-04-01 – 2017-03-31
• Keywords: フレキシブルデバイス / 印刷デバイス / 電極・配線 / 常温実装 / コネクタ

Outline of Final Research Achievements

Developments of a connector structure for flexible interconnection and a technique of electrode fabrication for mass production of the connectors have been performed for various printed/flexible devices. In particular, techniques of adhesive-assisted flexible interconnection without applying heat and transfer printing to form fine and thick electrodes on adhesives efficiently have been developed. Furthermore, circuit operation was successfully performed using the developed interconnection systems.

Free Research Field

印刷エレクトロニクス