Development of low-Ag solder alloy with excellent creep resistance utilizing constitutive equation

2017 Fiscal Year Final Research Report

• Project/Area Number: 15K18226
• Research Category: Grant-in-Aid for Young Scientists (B)
• Allocation Type: Multi-year Fund
• Research Field: Composite materials/Surface and interface engineering
• Research Institution: Osaka Research Institute of Industrial Science and Technology
• Principal Investigator: Hamada Naoyuki 地方独立行政法人大阪産業技術研究所, 和泉センター, 主任研究員 (90736282)
• Co-Investigator(Renkei-kenkyūsha): UESUGI Tokuteru 大阪府立大学, 大学院・工学研究科, 准教授 (10405342)
• Research Collaborator: HIGASHI Kenji 大阪府立大学, 大学院・工学研究科, 教授 (50173133) ; TAKIGAWA Yorinobu 大阪府立大学, 大学院・工学研究科, 准教授 (70382231) ; MORI Yuuki 大阪府立大学, 大学院・工学研究科, 大学院生
• Project Period (FY): 2015-04-01 – 2018-03-31
• Keywords: 鉛フリーはんだ / 固溶強化 / 低Agはんだ / Agレスはんだ

Outline of Final Research Achievements

In order to develop the low cost lead-free solder with excellent creep resistance, flow stress and thermal fatigue properties of Sn based alloys were investigated. It is clarified that Au was the most effective element to increase flow stress by solid solution hardening of Sn based binary alloys. Among Sn-Bi-Au ternary alloys, Sn-3Bi-0.01Au had excellent flow stress. Thermal shock test revealed that Sn-3Bi-0.01Au had the excellent thermal fatigue properties which were equivalent to those of Sn-3Ag-0.5Cu.

Free Research Field

材料工学