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2006 Fiscal Year Final Research Report Summary

Measurement system of fluctuation map of strength and mechanical properties of nano-scale materials using nano-positioning technique

Research Project

Project/Area Number 16206013
Research Category

Grant-in-Aid for Scientific Research (A)

Allocation TypeSingle-year Grants
Section一般
Research Field Materials/Mechanics of materials
Research InstitutionTOHOKU UNIVERSITY

Principal Investigator

MIURA Hideo  Tohoku University, Graduate School of Engineering, Professor, 大学院工学研究科, 教授 (90361112)

Co-Investigator(Kenkyū-buntansha) GAO Wei  Tohoku University, Graduate School of Engineering, Associate Professor, 大学院工学研究科, 助教授 (70270816)
OGAWA Kazuhiro  Tohoku University, Graduate School of Engineering, Associate Professor, 大学院工学研究科, 助教授 (50312616)
SASAGAWA Kazuhiko  Hirosaki University, Department of Science and Engineering, Associate Professor, 理工学部, 助教授 (50250676)
Project Period (FY) 2004 – 2006
KeywordsStrength of nano-scale materials / Reliability / Thin Film / Analysis of Atomic Structure / Nano-Indentation / Semiconductor / Nano-scale Measurement / Nano-positioning
Research Abstract

The main purpose of this research is to develop a new measurement system that enables us to understand the reason for the fluctuation of the strength and mechanical properties of materials in nano-scale.
The mechanism of the fluctuation of various physical properties has been clarified for the functional materials used in such as semiconductor devices, high-temperature gas turbines considering the fluctuation of nano-scale crystallographic texture of the materials measured by our measurement system. Based on this research activity, it was found that the three-dimensional anisotropic mechanical properties appeared when the nano-scale texture consisted of fine columnar structure with weak grain boundaries. In addition, various point defects such as oxygen vacancies and interstitial carbon atoms caused serious decrease of band gap of high-k materials and thus deteriorated the electronic reliability of the material significantly. Since such point defects diffused in the materials rapidly, t … More he degraded sites were found to move easily even at room temperature. These analytically estimated results were confirmed by experiments using synchrotron-radiation photoemission spectroscopy at SPring-8. Furthermore, the degradation mechanism of high-temperature alloys used for a gas turbine system was made clear by applying quantum chemical molecular dynamics. The stress-induced anisotropic diffusion was found to occur in the alloys and to change the nano-scale texture of the materials from initially dispersed fine polycrystalline texture to the uni-axially aligned coarse texture. The predicted phenomenon was also validated by the synchrotron-radiation photoemission spectroscopy.
Finally, a new measurement system for detecting the fluctuation map of strength and mechanical properties of nano-scale materials using nano-positioning technique has been developed successfully. The spatial resolution of the measurement is 20 nm, and the resolution of the load is 1 nN. This system is a strong tool for explicating the fluctuation mechanism of strength and mechanical properties of highly functional materials. Less

  • Research Products

    (43 results)

All 2007 2006 2005 2004

All Journal Article (39 results) Book (2 results) Patent(Industrial Property Rights) (2 results)

  • [Journal Article] 銅めっき薄膜機械特性の微細組織依存性2007

    • Author(s)
      玉川 欣治
    • Journal Title

      材料(Journal of the Society of Materials Science, Japan) 56・11(印刷中)

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] Development of Evaluation Method for Estimating Stress-Induced Change in Drain Current in Deep- sub-micron MOSFETs2007

    • Author(s)
      Yukihiro Kumagai
    • Journal Title

      Journal of Solid Mechanics and Materials Engineering 1・1

      Pages: 93-101

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] 三次元フリップチップ実装構造における薄化チップの局所変形と残留応力2007

    • Author(s)
      三浦 英生
    • Journal Title

      (社)電子情報通信学会 信学技報 CPM2006-140

      Pages: 67-72

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] Micro-texture dependence of mechanical properties of electroplated copper thin films2007

    • Author(s)
      Kinji Tamakawa
    • Journal Title

      Journal of the Society of Materials Science, Japan vol.56, No.11(In print)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Development of Evaluation Method for Estimating Stress-Induced Change in Drain Current in Deep-sub-micron MOSFETs2007

    • Author(s)
      Yukihiro Kumagai
    • Journal Title

      Journal of Solid Mechanics and Materials Engineering Vol.1, No.1

      Pages: 93-101

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Local Deformation and Residual Stress of Thinned Stacked Silicon Chip Mounted Using Flip Chip Technology2007

    • Author(s)
      Hideo Miura
    • Journal Title

      IEICE Technical Report Vol.CPM2006-140

      Pages: 67-72

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] ナノスケールの材料力学2006

    • Author(s)
      三浦 英生
    • Journal Title

      日本機械学会論文集A編 72・717

      Pages: 595-601

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] Influence of Intrinsic Defects and Strain on Electronic Reliability of Gate Oxide films2006

    • Author(s)
      Ken Suzuki
    • Journal Title

      2006MRS (Materials Research Society) Spring Meeting 917E・E05-28(CDROM)

      Pages: 1-6

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] Quantum chemical molecular dynamics analysis of the effect of oxygen vacancies and strain on dielectric characteristic of HfO_2-x films2006

    • Author(s)
      Yuta Ito
    • Journal Title

      2006 International Conference on Simulation of Semiconductor Processes and Devices 1

      Pages: 150-153

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] フリップ実装構造における微小バンプ接続部の非破壊検査法の提案2006

    • Author(s)
      佐藤 祐規
    • Journal Title

      電子情報通信学会論文誌C J89-C・11

      Pages: 778-785

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] Residual Stress Distribution in Stacked LSI Chips Mounted by Flip Chip Technology2006

    • Author(s)
      Nobuki Ueta
    • Journal Title

      IEEE International Conference on Electronic Materials and Packaging

      Pages: 158-163

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] Fluctuation mechanism of Mechanical Properties of Electroplated Copper Thin Films Used for Three-Dimensional Electronic Modules2006

    • Author(s)
      Hideo Miura
    • Journal Title

      Asian Pacific Conference on Fracture and Strength of Materials (CDROM)

      Pages: 1-4

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] エレクトロニクス実装構造信頼性の分析・計測技術2006

    • Author(s)
      三浦 英生
    • Journal Title

      エレクトロニクス実装学会誌 9・3

      Pages: 152-156

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] Mechanics and Materials in Nano-Scale2006

    • Author(s)
      Hideo Miura
    • Journal Title

      Transactions of the Japan Society of Mechanical Engineers Vol.72, No.717A

      Pages: 595-601

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Influence of Intrinsic Defects and Strain on Electronic Reliability of Gate Oxide films2006

    • Author(s)
      Ken Suzuki
    • Journal Title

      2006 MRS (Materials Research Society) Spring Meeting Vol.917E, No.E05-28(CDROM)

      Pages: 1-6

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Quantum chemical molecular dynamics analysis of the effect of oxygen vacancies and strain on dielectric characteristic of HfO_<2-X> films2006

    • Author(s)
      Yuta Ito
    • Journal Title

      2006 International Conference on Simulation of Semiconductor Processes and Devices

      Pages: 150-153

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Proposal of a Non-destructive Inspection Method for Micro Bump Joints in Flip Chip Structures2006

    • Author(s)
      Yuki Sato
    • Journal Title

      The IEICE Transactions on Electronics Vol.J89-C, No.11

      Pages: 778-785

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Experimental Methods for Reliability Evaluation of Electronic Packages and Modules2006

    • Author(s)
      Hideo Miura
    • Journal Title

      Journal of Japan Institute of Electronics Packaging Vol.9, No.3

      Pages: 152-156

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] フリップ実装構造におけるSiチップ内の局所残留応力評価2005

    • Author(s)
      上田 啓貴
    • Journal Title

      電子情報通信学会論文誌C J88-C・11

      Pages: 859-865

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] Verification of Prediction Method for Electromigration Failure Using Angled Polycrystalline Line2005

    • Author(s)
      S.Uno
    • Journal Title

      Key Engineering Materials 297-300

      Pages: 263-268

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] 高速工具サーボによる大面積正弦波微細格子基準面の高精度創成2005

    • Author(s)
      田野 誠
    • Journal Title

      日本機械学会論文集C編 71・712

      Pages: 3602-3607

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] Characterization of oxide film formed on austenitic stainless steel by in-situ Micro Raman Spectroscopy2005

    • Author(s)
      A.Kai
    • Journal Title

      KEY ENGINEERING MATERIALS 297-300

      Pages: 2806-2812

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] Molecular-Dynamics Study of Interfacial Diffusion between High-permittivity Gate Dielectrics and Germanium Substrates2005

    • Author(s)
      Tomio Iwasaki
    • Journal Title

      Journal of Materials Research 20・5

      Pages: 1300-1307

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] Quantum Chemical Molecular Dynamics Analysis of the Effect of Intrinsic Defects and Strain on Dielectric Characteristic of Gate Oxide Films2005

    • Author(s)
      Ken Suzuki
    • Journal Title

      2005 International Conference on Simulation of Semiconductor Processes and Devices

      Pages: 327-330

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] NON-DESTRUCTIVE INSPECTION METHOD FOR DETECTIONG OPEN FAILURES IN FLIP CHIP STRUCTURES2005

    • Author(s)
      Yuhki Sato
    • Journal Title

      ASME Summer Heat Transfer Conference & InterPACK'05 IPACK2005-73109(CDROM)

      Pages: 1-6

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] Local Residual Stress in a Si Chip Mounted by Flip Chip Technology2005

    • Author(s)
      Nobuki Ueta
    • Journal Title

      The IEICE Transactions on Electronics Vol.J88-C, No.11

      Pages: 859-865

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Verification of Prediction Method for Electromigration Failure Using Angled Polycrystalline Line2005

    • Author(s)
      S.Uno
    • Journal Title

      Key Engineering Materials Vols.297-300

      Pages: 263-268

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] High-accuracy Fabrication of a Sinusoidal Grid surface Over a Large Area by Fast Tool Servo2005

    • Author(s)
      Makoto Tano
    • Journal Title

      Transactions of the Japan Society of Mechanical Engineers Vol.71, No.712C

      Pages: 3602-3607

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Characterization of oxide film formed on austenitic stainless steel by in-situ Micro Raman Spectroscopy2005

    • Author(s)
      Akira Kai
    • Journal Title

      KEY ENGINEERING MATERIALS Vols.297-300

      Pages: 2806-2812

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Molecular-Dynamics Study of Interfacial Diffusion between High-permittivity Gate Dielectrics and Germanium Substrates2005

    • Author(s)
      Tomio Iwasaki
    • Journal Title

      Journal of Materials Research Vol.20, No.5

      Pages: 1300-1307

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] NON-DESTRUCTIVE INSPECTION METHOD FOR DETECTIONG OPEN FAILURES IN FLIP CHIP STRUCTURES2005

    • Author(s)
      Yuhki Sato
    • Journal Title

      ASME Summer Heat Transfer Conference & InterPACK'05 No.IPACK2005-73109(CDROM)

      Pages: 1-6

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] A Surface Motor-Driven Planar Motion Stage Integrated with an XY□ Surface Encoder for Precision Positioning2004

    • Author(s)
      W.Gao
    • Journal Title

      Precision Engineering 28・3

      Pages: 329-337

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] Molecular-dynamics analysis of interfacial diffusion between high-permitivity gate dielectrics and silicon substrate2004

    • Author(s)
      T.Iwasaki
    • Journal Title

      Journal of Materials Research 19・4

      Pages: 1197-1202

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] Effect of Cerium and Silicon Additions to MCrAIY on the High-Temperature Oxidation Behavior and Bond Strength of Thermal Barrier Coatings2004

    • Author(s)
      M.Tanno
    • Journal Title

      Key Engineering Materials 261-263

      Pages: 1061-1066

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] Mechanical Reliability Issues of LSI Chips in Multi Devices Sub-assembly (MDS) Structures2004

    • Author(s)
      H.Miura
    • Journal Title

      Proceedings of 2004 ASME International Mechanical Engineering Congress and RD&D Expo IMECE-6250(CDROM)

      Pages: 1-6

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] A Surface Motor-Driven Planar Motion Stage Integrated with an XY□ Surface Encoder for Precision Positioning2004

    • Author(s)
      W.Gao
    • Journal Title

      Precision Engineering Vol.28, No.3

      Pages: 329-337

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Molecular-dynamics analysis of interfacial diffusion between high-permitivity gate dielectrics and silicon substrate2004

    • Author(s)
      T.Iwasaki
    • Journal Title

      Journal of Materials Research Vol.19, No.4

      Pages: 1197-1202

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Effect of Cerium and Silicon Additions to MCrAlY on the High-Temperature Oxidation Behavior and Bond Strength of Thermal Barrier Coatings2004

    • Author(s)
      M.Tanno
    • Journal Title

      Key Engineering Materials Vols.261-263

      Pages: 1061-1066

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Mechanical Reliability Issues of LSI Chips in Multi Devices Sub-assembly (MDS) Structures2004

    • Author(s)
      H.Miura
    • Journal Title

      Proceedings of 2004 ASME International Mechanical Engineering Congress and RD&D Expo No.IMECE-62500(CDROM)

      Pages: 1-6

    • Description
      「研究成果報告書概要(欧文)」より
  • [Book] 最新シリコンデバイスと結晶技術 -先端LSIが要求するウエーハ技術の現状-2005

    • Author(s)
      三浦 英生, 他27名
    • Total Pages
      330
    • Publisher
      REALIZE Science & Engineering
    • Description
      「研究成果報告書概要(和文)」より
  • [Book] Advanced Technology for Silicon Devices and Crystal Growth2005

    • Author(s)
      Hideo Miura, et al.
    • Total Pages
      330
    • Publisher
      REALIZE Science and Engineering
    • Description
      「研究成果報告書概要(欧文)」より
  • [Patent(Industrial Property Rights)] Semiconductor Device and Process for Producing The Same2005

    • Inventor(s)
      N. Ishi-tsuka, H. Miura, S. Ikeda
    • Industrial Property Rights Holder
      Renesas Technology Corp.
    • Industrial Property Number
      United State Patent, No. 20050196935
    • Filing Date
      2005-04-19
    • Acquisition Date
      2005-09-08
    • Description
      「研究成果報告書概要(和文)」より
  • [Patent(Industrial Property Rights)] 半導体装置およびその製造方法2004

    • Inventor(s)
      岩崎富生, 三浦英生, 石塚典男
    • Industrial Property Rights Holder
      ルネサステクノロジー(株)
    • Industrial Property Number
      米国特許 PO7141840号
    • Filing Date
      2004-07-30
    • Acquisition Date
      2006-11-28
    • Description
      「研究成果報告書概要(和文)」より

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Published: 2008-05-27  

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