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2007 Fiscal Year Final Research Report Summary

Development of On-chip Nano-Scale Network Based on Communication Theory

Research Project

Project/Area Number 16206034
Research Category

Grant-in-Aid for Scientific Research (A)

Allocation TypeSingle-year Grants
Section一般
Research Field Electron device/Electronic equipment
Research InstitutionTokyo Institute of Technology

Principal Investigator

MASU Kazuya  Tokyo Institute of Technology, Integrated Research Institute, Professor (20157192)

Co-Investigator(Kenkyū-buntansha) ITO Hiroyuki  Tokyo Institute of Technology, Precision and Intelligent Laboratory, Assistant Professor (40451992)
SATO Takashi  Tokyo Institute of Technology, Integrated Research Institute, Professor (20431992)
AMAKAWA Shuhei  Tokyo Institute of Technology, Integrated Research Institute, Assistant Professor (40431994)
ISHIDA Koichi  Tokyo Institute of Technology, Integrated Research Institute, Assistant Professor (30431993)
Project Period (FY) 2004 – 2007
Keywordstransmission line / integrated cirtcuit / nano interconnect / high speed signal propagation / low power consumption / system on chip / network on chip / wire length distribution
Research Abstract

Si CMOS has been scaled according to the "Scaling Concept" and have achieved high performance, low power consumption, and high functionality. The Si CMOS has become the most important hardware in ubiquitous network. In 2013, hundred million transistors will be integrated on a one chip of 20mm square using 35nm technology and the operating frequency is expected to be over 20GHz. The Si CMOS is progressing toward Nano Scale era.
In this work, the signal propagation is recognized to be just communication, and we have developed global wiring technology. The novel analytic expression has been derived for wire length distribution ; the wire length distribution and cumulative number of interconnects of real 130nm and 90nm CMOS chip are well expressed by our new model. We have developed global wiring technology based on differential transmission line ; 0.27pJ/bit transmission has been successfully achieved on 1cm long interconnect, and mutli drop transmission line interconnect has been also developed for future network on-chip technology. Furthermore, novel FoM (Figure of Merit) has been proposed to compare the performance of various interconnects ; the conventional RC line, the RC line using CNT (Carbon Nano Tube), transmission line interconnect which has been developed in this work, optical interconnect, and wireless interconnect. As a results, the FoM of the transmission line interconnect has most superior in the range of several hundred micron to several mm. This means the transmission line has been the best solution for global wiring.

  • Research Products

    (212 results)

All 2008 2007 2006 2005 2004 Other

All Journal Article (44 results) (of which Peer Reviewed: 22 results) Presentation (167 results) Remarks (1 results)

  • [Journal Article] Application of Correlation-based Regression Analysis for Improvement of Power Distribution Network,",2008

    • Author(s)
      S. Hagiwara, T. Uezono, T. Sato, K. Masu
    • Journal Title

      IEICE Transactions on Fundamentals E91-A(4)4

      Pages: 951-956

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
  • [Journal Article] A Bidirectional-and Multi-Drop-Transmission-Line Interconnect for Multipoint-to-Multipoint On-Chip Communications2008

    • Author(s)
      H. Ito, M. Kimura, K. Miyashita, T. Ishii, K. Okada, K. Masu
    • Journal Title

      IEEE Journal of Solid-State Circuits 43(4)

      Pages: 1020-1029

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
  • [Journal Article] オンチップ伝送線路配線の期待と課題-True Scalingを可能とする次世代配線技術-2008

    • Author(s)
      益 一哉
    • Journal Title

      電子情報通信学会誌 91(3)

      Pages: 170-175

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
  • [Journal Article] Reconfigurable RF CMOS Circuit for Cognitive Radio(Invited Paper)2008

    • Author(s)
      K. MASU, K. OKADA
    • Journal Title

      IEICE Transactions on Communications E91-B(1)

      Pages: 10-13

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
  • [Journal Article] Application of Correlation-based Regression Analysis for Improvement of Power Distribution Network2008

    • Author(s)
      Shiho, Hagiwara, Takumi, Uezono, Takashi, Sato, Kazuya, Masu
    • Journal Title

      IEICE Transactions on Fundamentals Vol. E91-A, No. 4

      Pages: 951-956

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] A Bidirectional- and Multi-Drop-Transmission-Line Interconnect for Multipoint-to-Multipoint On-Chip Communications2008

    • Author(s)
      Hiroyuki, Ito, Makoto, Kimura, Kazuya, Washita, Takahiro, Ishii, Kenichi, Okada, Kazuya, Masu
    • Journal Title

      IEEE Journal of Solid-State Circuits Vol. 43, No. 4

      Pages: 1020-1029

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] On-Chip Transmission Line Interconnect : Toward True Scaling2008

    • Author(s)
      Kazuya, Masu
    • Journal Title

      Journal of IEICE Vol.91, No.3

      Pages: 170-175

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Reconfigurable RF CMOS Circuit for Cognitive Radio (Invited Paper)2008

    • Author(s)
      Kazuya, MASU, Kenichi, OKADA
    • Journal Title

      IEICE Transactions on Communications Vol. E91-B, No.1

      Pages: 10-13

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] On-Chip Yagi-Uda Antenna for Horizontal Wireless Signal Transmission in Stacked Multi Chip Packaging2007

    • Author(s)
      K. Ohashi, T. Yammouch, M. Kimura, H. Ito, K. Okada, K. Itoi, M. Sato, T. Ito, R. Yamauchi, and K. Masu
    • Journal Title

      Japanese Journal of Applied Physics 46(4B

      Pages: 2283-2286

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
  • [Journal Article] 高周波シリコンCMOS送受信システムチップ2007

    • Author(s)
      益 一哉、岡田健一
    • Journal Title

      電子情報通信学会誌 90(4)

      Pages: 276-282

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
  • [Journal Article] Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology2007

    • Author(s)
      H. Ito, H. Sugita, K. Okada, T. Ito, K. Itoi, M. Sato, R. Yamauchi, and K. Masu
    • Journal Title

      IEICE Transactions on Electronics E90-C(3)

      Pages: 641-643

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
  • [Journal Article] On-Chip Yagi-Uda Antenna for Horizontal Wireless Signal Transmission in Stacked Multi Chip Packaging2007

    • Author(s)
      Kazuma, Ohashi, Tackya, Yammouch, Makoto, Kimura, Hiroyuki, Ito, Kenichi, Okada, Kazuhisa, Itoi, Masakazu, Sato, Tatsuya, Ito, Ryozo, Yamauchi, Kazuya, Masu
    • Journal Title

      Japanese Journal of Applied Physics Vol.46, No 4B

      Pages: 2283-2286

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] RF CMOS Tx/Rx Circuit2007

    • Author(s)
      Kazuya, Masu, Kenichi, Okada
    • Journal Title

      Journal of IEICE Vol.90, No 4

      Pages: 276-282

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology2007

    • Author(s)
      Hiroyuki, Ito, Hideyuki, Sugita, Kenichi, Okada, Tatsuya, Ito, Kazuhisa, Itoi, Masakazu, Sato, Ryozo, Yamauchi, Kazuya, Masu
    • Journal Title

      IEICE Transactions on Electronics Vol. E90-C, No.3

      Pages: 641-643

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Statistical Modeling of a Via Distribution for Yield Estimation2006

    • Author(s)
      T. Uezono, K. Okada, and K. Masu
    • Journal Title

      IEICE Transactions on Fundamentals E89-A12

      Pages: 3579-3584

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
  • [Journal Article] On-Chip High-Q Variable Inductor Using Wafer-Level Chip-Scale Package Technology2006

    • Author(s)
      K. Okada, H. Sugawara, H. Ito, K. Itoi, M. Sato, H. Abe, T. Ito, and K. Masu
    • Journal Title

      IEEE Transactions on Electron Devices 53(9)

      Pages: 2401-2406

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
  • [Journal Article] Improvement of Variable Ratio of On-Chip Variable Inductors Using Side Shield2006

    • Author(s)
      T. Yammouch, H. Sugawara, K. Okada and K. Masu
    • Journal Title

      Japanese Journal of Applied Physics 45(7)

      Pages: 5720-5723

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
  • [Journal Article] Zero-Crosstalk Bus Line Structure for Global Interconnects in Si Ultra Large Scale Integration,2006

    • Author(s)
      M. Kimura, H. Ito, H. Sugita, K .Okada, and K. Masu
    • Journal Title

      Japanese Journal of Applied Physics 45(6A)

      Pages: 4977-4981

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
  • [Journal Article] Optimization Methodology of Layer Numbers with Circuit/Process Co-design2006

    • Author(s)
      T. Kyogoku, J. Inoue, H. Nakashima, T. Uezono, K. Okada, and K. Masu
    • Journal Title

      Japanese Journal of Applied Physics, 45(4A)

      Pages: 2476-2480

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
  • [Journal Article] Design of Reconfigurable RF CMOS Wireless Circuit2006

    • Author(s)
      K. Okada, Y. Yoshihara, H. Sugawara, and K. Masu
    • Journal Title

      IEICE Transactions on Electronics J89-C(7)

      Pages: 499-507

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
  • [Journal Article] RF Passive Components Using Metal Line on Si CMOS(Invited Paper).2006

    • Author(s)
      K. Masu, K. Okada, and H. Ito
    • Journal Title

      IEICE Transactions on Electronics, E89-C(6)

      Pages: 681-691

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
  • [Journal Article] Statistical Modeling of a Via Distribution for Yield Estimation2006

    • Author(s)
      Takumi, Uezono, Kenichi, Okada, Kazuya, Masu
    • Journal Title

      IEICE Transactions on Fundamentals vol.E89-A, no.12

      Pages: 3579-3584

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] On-Chip High-Q Variable Inductor Using Wafer-Level Chip-Scale Package Technology2006

    • Author(s)
      Kenichi, Okada, Hirotaka, Sugawara, Hiroyuki, Ito, Kazuhisa, Itoi, Masakazu, Sato, Hiroshi, Abe, Tatsuya, Ito, Kazuya, Masu
    • Journal Title

      IEEE Transactions on Electron Devices Vol. 53, No. 9

      Pages: 2401-2406

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Improvement of Variable Ratio of On-Chip Variable Inductors Using Side Shield2006

    • Author(s)
      Tackya, Yammouch, Hirotaka, Sugawara, Kenichi, Okada, Kazuya, Masu
    • Journal Title

      Japanese Journal of Applied Physics Vol. 45, No. 7

      Pages: 5720-5723

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Zero-Crosstalk Bus Line Structure for Global Interconnects in Si Ultra Large Scale Integration2006

    • Author(s)
      Makoto, Kimura, Hiroyuki, Ito, Hideyuki, Sugita, Kenichi, Okada, Kazuya, Masu
    • Journal Title

      Japanese Journal of Applied Physics Vol. 45, No. 6A

      Pages: 4977-4981

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Optimization Methodology of Layer Numbers with Circuit/Process Co-design2006

    • Author(s)
      Takanori, Kyogoku, Junpei, Inoue, Hidenari, Nakashima, Takumi, Uezono, Kenichi, Okada, Kazuya, Masu
    • Journal Title

      Japanese Journal of Applied Physics Vol. 45, No. 4A

      Pages: 2476-2480

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Design of Reconfigurable RF CMOS Wireless Circuit2006

    • Author(s)
      Kenichi, Okada, Yoshiaki, Yoshihara, Hirotaka, Sugawara, Kazuya, Masu
    • Journal Title

      IEICE Transactions on Electronics Vol. J89-C, No. 7

      Pages: 499-507

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] RF Passive Components Using Metal Line on Si CMOS2006

    • Author(s)
      Kazuya, Masu, Kenichi, Okada, Hiroyuki, Ito
    • Journal Title

      (Invited Paper), IEICE Transactions on Electronics vol. E89-C, no 6

      Pages: 681-691

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Circuit Performance Prediction Considering Core Utilization with Interconnect Length Distribution Model2005

    • Author(s)
      H. Nakashima, J. Inoue, K. Okada, and K. Masu
    • Journal Title

      IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences E88-A(12)

      Pages: 3358-3366

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
  • [Journal Article] Evaluation of X Architecture Using Interconnect Length Distribution2005

    • Author(s)
      H. Nakashima, N. Takagi, J. Inoue, K. Okada, and K. Masu
    • Journal Title

      IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences E88-A(12)

      Pages: 3437-3444

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
  • [Journal Article] , Wire Length Distribution Model for System LSI2005

    • Author(s)
      T. Kyogoku, J. Inoue, H. Nakashima, T. Uezono, K. Okada, and K. Masu
    • Journal Title

      IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences E88-A(12)

      Pages: 3445-3452

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
  • [Journal Article] "Small-Area Inductor for Silicon CMOS Chips2005

    • Author(s)
      H. Sugawara, K. Okada and K. Masu
    • Journal Title

      Japanese Journal of Applied Physics 44(4B)

      Pages: 2766-2769

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
  • [Journal Article] Twisted Differential Transmission Line Structure for Global Interconnect in Si LSI2005

    • Author(s)
      H. Ito, S. Gomi, H. Sugita, K. Okada, and K. Masu
    • Journal Title

      Japanese Journal of Applied Physics 44(4B)

      Pages: 2774-2779

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
  • [Journal Article] , Wide Tuning Range LC-VCO Using Variable Inductor for Reconfigurable RF Circuit2005

    • Author(s)
      Y. Yoshihara, H. Sugawara, H. Ito, K. Okada, and K. Masu
    • Journal Title

      IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences E88-A(2)

      Pages: 507-512

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
  • [Journal Article] Circuit Performance Prediction Considering Core Utilization with Interconnect Length Distribution Model2005

    • Author(s)
      Hidenari, Nakashima, Junpei, Inoue, Kenichi, Okada, Kazuya, Masu
    • Journal Title

      IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences Vol. E88-A, No. 12

      Pages: 3358-3366

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Evaluation of X Architecture Using Interconnect Length Distribution2005

    • Author(s)
      Hidenari, Nakashima, Naohiro, Takagi, Junpei, Inoue, Kenichi, Okada, Kazuya, Masu
    • Journal Title

      IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences Vol. E88-A, No. 12

      Pages: 3437-3444

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Wire Length Distribution Model for System LSI2005

    • Author(s)
      Takanori Kyogoku, Junpei Inoue, Hidenari Nakashima, Takumi Uezono, Kenichi Okada, Kazuya Masu
    • Journal Title

      IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences Vol. E88-A, No 12

      Pages: 3445-3452

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Small-Area Inductor for Silicon CMOS Chips2005

    • Author(s)
      Hirotaka Sugawara, Kemchi Okada and Kazuya Masu
    • Journal Title

      Japanese Journal of Applied Physics Vol. 44, No. 4B

      Pages: 2766-2769

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Twisted Differential Transmission Line Structure for Global Interconnect in Si LSI2005

    • Author(s)
      Hiroyuki Ito, Shinichiro Gomi, Hideyuki Sugita, Kenichi Okada, Kazuya Masu
    • Journal Title

      Japanese Journal of Applied Physics Vol 44, No. 4B

      Pages: 2774-2779

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] Wide Tuning Range LC-VCO Using Variable Inductor for Reconfigurable RF Circuit2005

    • Author(s)
      Yoshiaki Yoshihara, Hirotaka Sugawara, Hiroyuki Ito, Kenichi Okada, Kazuya Masu
    • Journal Title

      IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences Vol. E88-A, No. 2

      Pages: 507-512

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] , Inductance-Tuned LC-VCO for Reconfigurable RF Circuit Design2004

    • Author(s)
      Y. Yoshihara, Hiroraka Sugawara, H. Ito, K. Okada, and K. Masu
    • Journal Title

      IEICE EIectronics Express 1(7)

      Pages: 156-159

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
  • [Journal Article] High Density Differential Transmission Line Structure on Si ULSI2004

    • Author(s)
      H. Ito, K. Okada and K. Masu
    • Journal Title

      IEICE Transactions on Electronics E87-C(6)

      Pages: 942-948

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
  • [Journal Article] Inductance-Tuned LC-VCO for Reconfigurable RF Circuit Design2004

    • Author(s)
      Yoshiaki Yoshihara, Hiroraka Sugawara, Hiroyuki Ito, Kenichi Okada, Kazuya Masu
    • Journal Title

      IEICE Electronics Express Vol. 1, No. 7

      Pages: 156-159

    • Description
      「研究成果報告書概要(欧文)」より
  • [Journal Article] High Density Differential Transmission Line Structure on Si ULSI

    • Author(s)
      Hiroyuki Ito, Kenichi Okada, Kazuya Masu
    • Journal Title

      IEICE Transactions on Electronics Vol. E87-C, No 6

      Pages: 942-948

    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] "RF MEMS for Reconfigurable Radio, in Sunday Evening Panel 2(SE2)MEMS for Frequency Synthesis and Wireless RF Communications(on Life without Quartz Crystal)招待講演)2008

    • Author(s)
      K. Masu
    • Organizer
      The International Solid-State Circuits Conference 2008(ISSCC 2008)
    • Place of Presentation
      San Francisco
    • Year and Date
      2008-02-03
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] RF MEMS for Reconfigurable Radio, in Sunday Evening Panel 2 (SE2), MEMS for Frequency Synthesis and Wireless RF Communications (or Life without Quartz Crystal)2008

    • Author(s)
      Kazuya, Masu
    • Organizer
      The International Solid-State Circuits Conference 2008 (ISSCC 2008)
    • Place of Presentation
      San Francisco
    • Year and Date
      2008-02-03
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] LVDS-type On-Chip Transmision Line Interconnect with Passive Equalizers in 90 nm CMOS Process2008

    • Author(s)
      A. Mineyama, H. Ito, T. Ishii, K. Okada, K. Masu
    • Organizer
      IEEE/ACM Asia and South Pacific Design Automation Conference(University LSI Design Contest)
    • Place of Presentation
      Seoul, Korea,
    • Year and Date
      2008-01-22
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Small-Area CMOS RF Distributed Mixer Using Multi-Port Inductors2008

    • Author(s)
      S. Sadoshima, S. Fukuda, T. Yammouch, H. Ito, K. Okada, K. Masu
    • Organizer
      IEEE/ACM Asia and South Pacific Design Automation Conference(University LSI Design Contest)
    • Place of Presentation
      Seoul, Korea,
    • Year and Date
      2008-01-22
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] LVDS-type On-Chip Transmision Line Interconnect with Passive Equalizers in 90 nm CMOS Process2008

    • Author(s)
      Akiko, Mineyama, Hiroyuki, Ito, Takahiro, Ishii, Kenichi, Okada, Kazuya, Masu
    • Organizer
      IEEE/ACM Asia and South Pacific Design Automation Conference (University LSI Design Contest)
    • Place of Presentation
      Seoul, Korea
    • Year and Date
      2008-01-22
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Small-Area CMOS RF Distributed Mixer Using Multi-Port Inductors2008

    • Author(s)
      Susumu, Sadoshima, Satoshi, Fukuda, Tackya, Yammouch, Hiroyuki, Ito, Kenichi, Okada, Kazuya, Masu
    • Organizer
      IEEE/ACM Asia and South Pacific Design Automation Conference (University LSI Design Contest)
    • Place of Presentation
      Seoul, Korea
    • Year and Date
      2008-01-22
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Interconnect Design Issues of Nano CMOS(Invited Talk)2008

    • Author(s)
      K. Masu
    • Organizer
      Mini-Colloquia on Compact Modeling of Advance MOSFET Structures and Mixed Mode Applications
    • Place of Presentation
      New Delhi, India
    • Year and Date
      2008-01-05
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Interconnect Design Issues of Nano CMOS (Invited Talk)2008

    • Author(s)
      Kazuya, Masu
    • Organizer
      Mini-Colloquia on Compact Modeline of Advance MOSFET Structures and Mixed Mode Applications
    • Place of Presentation
      New Delhi, India.
    • Year and Date
      2008-01-05
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] A MOS transistor-array for accurate measurement of subthreshold leakage variation,2007

    • Author(s)
      T. Sato, T. Uezono, S. Hagiwara, K. Okada, S. Amakawa, N. Nakayama, and K. Masu
    • Organizer
      International Symposium on Quality Electronic Design(ISQED)
    • Place of Presentation
      San Jose, California
    • Year and Date
      20070327-
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] A Low-Power Low-Phase-Noise CMOS VCO using RF SiP Technology2007

    • Author(s)
      K. Ohashi, Y. Ito, H. Ito, K. Okada, H. Hatakeyama, N. Ozawa, M. Sato, T. Aizawa, T. Ito, R. Yamauchi, and K. Masu
    • Organizer
      Asia-Pacific Microwave Conference(APMC)
    • Place of Presentation
      Bangkok, Thailand
    • Year and Date
      2007-12-14
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] A Low-Power Low-Phase-Noise CMOS VCO using RF SiP Technology2007

    • Author(s)
      Kazuma, Ohashi, Yusaku, Ito, Hiroyuki, Ito, Kenichi, Okada, Hideki, Hatakeyama, Naoyuki, Ozawa, Masakazu, Sato, Takuya, Aizawa, Tatsuya, Ito, Ryozo, Yamauchi, Kazuya, Masu
    • Organizer
      Asia-Pacific Microwave Conference (APMC)
    • Place of Presentation
      Bangkok, Thailand
    • Year and Date
      2007-12-14
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] On-Chip Global Interconnect Using Transmission Line(Invited)2007

    • Author(s)
      K. Masu
    • Organizer
      The 2nd WorkS.p on Interconnect Design and Variablity(IDV2007)
    • Place of Presentation
      Bangalore, India
    • Year and Date
      2007-12-13
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] On-Chip Global Interconnect Using Transmission Line(Invited)2007

    • Author(s)
      Kazuya, Masu
    • Organizer
      Paper 2 of the Day 1, The 2nd Workshop on Interconnect Design and Variablity (IDV2007)
    • Place of Presentation
      Bangalore, India
    • Year and Date
      2007-12-13
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] A 5.2GHz CMOS Low Noise Amplifier with High-Q Inductors Embedded in Wafer-Level Chip-Scale Package2007

    • Author(s)
      S. Fukuda, H. Ito, K. Itoi, M. Sato, T. Ito, R. Yamauchi, K. Okada, and K. Masu
    • Organizer
      International Workshop on RF Integration Technology(RFIT)
    • Place of Presentation
      Singapore
    • Year and Date
      2007-12-10
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] A 5.2GHz CMOS Low Noise Amphfier with High-Q Inductors Embedded in Wafer-Level Chip-Scale Package2007

    • Author(s)
      Satoshi, Fukuda, Hiroyuki, Ito, Kazuhisa, Itoi, Masakazu, Sato, Tatsuya, Ito, Ryozo, Yamauchi, Kenichi, Okada, Kazuya, Masu
    • Organizer
      International Workshop on RF Integration Technology (RFIT)
    • Place of Presentation
      Singapore
    • Year and Date
      2007-12-10
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Wafer-level-packaging inductor with extremely high quality factor and its application to 5.8GHz LC-type voltage controlled oscillator2007

    • Author(s)
      H. Hatakeyama, K. Okada, K. Ohashi, Y. Ito, N. Ozawa, M. Sato, T. Aizawa, T. Ito, R. Yamauchi, and K. Masu
    • Organizer
      Advanced Metallization Conference, Asian Session(ADMETA)
    • Place of Presentation
      Tokyo, Japan
    • Year and Date
      2007-10-24
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] High Frequency Characteristics of On-Chip Wirings up to 110 GHz2007

    • Author(s)
      K. Miyashita, H. Ito, K. Okada, and K. Masu
    • Organizer
      Advanced Metallization Conference, Asian Session(ADMETA)
    • Place of Presentation
      Tokyo, Japan
    • Year and Date
      2007-10-24
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Wafer-level-packaging inductor with extremely high quality factor and its application to 5.8GHz LC-type voltage controlled oscillator2007

    • Author(s)
      Hideki, Hatakeyama, Kenichi, Okada, Kazuma, Ohashi, Yusaku, Ito, Naoyuki, Ozawa, Masakazu, Sato, Takuya, Aizawa, Tatsuya, Ito, Ryozo, Yamauchi, Kazuya, Masu
    • Organizer
      Advanced Metallization Conference, Asian Session (ADMETA)
    • Place of Presentation
      Tokyo
    • Year and Date
      2007-10-24
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] High Frequency Characteristics of On-Chip Wirings up to 110 GHz2007

    • Author(s)
      Kazuya, Miyashita, Hiroyuki, Ito, Kenichi, Okada, Kazuya, Masu
    • Organizer
      Advanced Metallization Conference, Asian Session (ADMETA)
    • Place of Presentation
      Tokyo
    • Year and Date
      2007-10-24
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Signal transmission through interconnects with repetitive loads2007

    • Author(s)
      S. Amakawa, H. Ito, and K. Masu
    • Organizer
      Advanced Metallization Conference, Asian Session(ADMETA)
    • Place of Presentation
      Tokyo, Japan
    • Year and Date
      2007-10-23
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Signal transmission through interconnects with repetitive loads2007

    • Author(s)
      Shuhei, Amakawa, Hiroyuki, Ito, Kazuya, Masu
    • Organizer
      Advanced Metallization Conference, Asian Session (ADMETA)
    • Place of Presentation
      Tokyo
    • Year and Date
      2007-10-23
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Wafer-level-packaging inductor with extremely high quality factor and its application to 5.8GHz LC-type voltage controlled oscillator2007

    • Author(s)
      H. Hatakeyama, K. Okada, K. Ohashi, Y. Ito, N. Ozawa, M. Sato, T. Aizawa, T. Ito, R. Yamauchi, and K. Masu
    • Organizer
      Advanced Metallization Conference(AMC)
    • Place of Presentation
      Albany, New York, USA
    • Year and Date
      2007-10-09
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] High Frequency Characteristics of On-Chip Wirings up to 110 GHz2007

    • Author(s)
      K. Miyashita, H. Ito, K. Okada, and K. Masu
    • Organizer
      Advanced Metallization Conference(AMC)
    • Place of Presentation
      Albany, New York, USA
    • Year and Date
      2007-10-09
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Signal transmission through interconnects with repetitive loads2007

    • Author(s)
      S. Amakawa, H. Ito, and K. Masu
    • Organizer
      Advanced Metallization Conference(AMC)
    • Place of Presentation
      Albany, New York, USA
    • Year and Date
      2007-10-09
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Wafer-level-packaging inductor with extremely high quality factor and its application to 5.8GHz LC-type voltage controlled oscillator2007

    • Author(s)
      Hideki, Hatakeyama, Kenichi, Okada, Kazuma, Ohashi, Yusaku, Ito, Naoyuki, Ozawa, Masakazu, Sato, Takuya, Aizawa, Tatsuya, Ito, Ryozo, Yamauchi, Kazuya, Masu
    • Organizer
      Advanced Metallization Conference (AMC)
    • Place of Presentation
      Albany, New York
    • Year and Date
      2007-10-09
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] High Frequency Characteristics of On-Chip Wirings up to 110 GHz2007

    • Author(s)
      Kazuya, Miyashita, Hiroyuki, Ito, Kenichi, Okada, Kazuya, Masu
    • Organizer
      Advanced Metallization Conference (AMC)
    • Place of Presentation
      Albany, New York
    • Year and Date
      2007-10-09
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Signal transmission through interconnects with repetitive loads2007

    • Author(s)
      Shuhei, Amakawa, Hiroyuki, Ito, Kazuya, Masu
    • Organizer
      Advanced Metallization Conference (AMC)
    • Place of Presentation
      Albany, New York
    • Year and Date
      2007-10-09
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] A 0.49-6.50GHz Wideband LC-VCO with High-IRR in a 180nm CMOS Technology,.2007

    • Author(s)
      Y. Kobayashi, K. Ohashi, Y. Ito, H. Ito, K. Okada, and K. Masu
    • Organizer
      International Conference on Solid State Devices and Materials(SSDM)
    • Place of Presentation
      Tukuba, Japan
    • Year and Date
      2007-09-08
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] A 0.49-6.50GHz Wideband LC-VCO with High-IRR in a 180 nm CMOS Technology2007

    • Author(s)
      Yuka, Kobayashi, Kazuma, Ohashi, Yusaku, Ito, Hiroyuki, Ito, Kemchi, Okada, Kazuya, Masu
    • Organizer
      International Conference on Solid State Devices and Materials (SSDM)
    • Place of Presentation
      Tukuba
    • Year and Date
      2007-09-08
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Weakness identification for effective repair of power distribution network, Sweden2007

    • Author(s)
      T. Sato, S. Hagiwara, T. Uezono, and K. Masu
    • Organizer
      17th International workshop on power and timing modeling, optimization and simulation(PATMOS)
    • Place of Presentation
      Goteborg, Sweden
    • Year and Date
      2007-09-04
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Weakness identification for effective repair of power distribution network2007

    • Author(s)
      Takashi, Sato, Shiho, Hagiwara, Takumi, Uezono, Kazuya, Masu
    • Organizer
      17th International workshop on power and timing modeling, optimization and simulation (PATMOS)
    • Place of Presentation
      Goteborg, Sweden
    • Year and Date
      2007-09-04
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] A 8-Gbps Low-Latency Multi-Drop On-Chip Transmission Line Interconnect With 1.2-mW Two-Way Transceivers2007

    • Author(s)
      H. Ito, M. Kimura, K. Okada, and K. Masu
    • Organizer
      IEEE Symposium on VLSI Circuits
    • Place of Presentation
      Kyoto, Japan
    • Year and Date
      2007-06-15
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] A 8-Gbps Low-Latency Multi-Drop On-Chip Transmission Line Interconnect with 1.2-mW Two-Way Transceivers2007

    • Author(s)
      Hiroyuki, Ito, Makoto, Kimura, Kenichi, Okada, Kazuya, Masu
    • Organizer
      IEEE Symposium on VLSI Circuits
    • Place of Presentation
      Kyoto
    • Year and Date
      2007-06-15
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] A Low-Latency and High-Power-Efficient On-Chip LVDS Transmission Line Interconnect for a RC Interconnect Alternative2007

    • Author(s)
      H. Ito, J. Seita, T. Ishii, H. Sugita, K. Okada, and K. Masu
    • Organizer
      IEEE International Interconnect Technology Conference(IITC)
    • Place of Presentation
      San Francisco, USA
    • Year and Date
      2007-06-06
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] A Low-Latency and High-Power-Efficient On-Chip LVDS Transmission Line Interconnect for a RC Interconnect Alternative2007

    • Author(s)
      Hiroyuki, Ito, Junki, Salta, Takahiro, Ishii, Hideyuki, Sugita, Kenichi, Okada, Kazuya, Masu
    • Organizer
      IEEE International Interconnect Technology Conference (IITC)
    • Place of Presentation
      San Francisco
    • Year and Date
      2007-06-06
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Design of High-Density Interconnects for High-Speed Transmission2007

    • Author(s)
      W. Fu, M. Kimura, K. Okada, J. Sakai, and K. Masu
    • Organizer
      The 57th Electronic Components and Technology Conference(ECTC)
    • Place of Presentation
      Reno, Nevada, USA,
    • Year and Date
      2007-05-30
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Design of High-Density Interconnects for High-Speed Transmission2007

    • Author(s)
      Wanlin, Fu, Makoto, Kimura, Kenichi, Okada, Jun, Sakai, Kazuya, Masu
    • Organizer
      The 57th Electronic Components and Technology Conference (ECTC)
    • Place of Presentation
      Reno, Nevada, USA
    • Year and Date
      2007-05-30
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] A MOS transistor-array for accurate measurement of subthreshold leakage variation2007

    • Author(s)
      Takashi, Sato, Takumi, Uezono, Shiho, Hagiwara, Kemchi, Okada, Shuhei, Amakawa, Noriaki, Nakayama, Kazuya, Masu
    • Organizer
      International Symposium on Quality Electronic Design (ISQED)
    • Place of Presentation
      San Jose, California
    • Year and Date
      2007-03-27
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] "Adaptable wire-length distribution with tunable occupation probability2007

    • Author(s)
      S. Amakawa, T. Uezono, T. Sato, K. Okada, and K. Masu
    • Organizer
      International Workshop on System Level Interconnect Prediction(SLIP)
    • Place of Presentation
      Austin, Texas
    • Year and Date
      2007-03-17
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Adaptable wire-length distribution with tunable occupation probability2007

    • Author(s)
      Shuhei, Amakawa, Takumi, Uezono, Takashi, Sato, Kenichi, Okada, Kazuya, Masu
    • Organizer
      International Workshop on System Level Interconnect Prediction (SLIP)
    • Place of Presentation
      Austin, Texas
    • Year and Date
      2007-03-17
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Improvement of power distribution network using correlation-based regression analysis2007

    • Author(s)
      S. Hagiwara, T. Uezono, T. Sato, and K. Masu
    • Organizer
      Great Lakes Symposium on VLSI(GLSVLSI)
    • Place of Presentation
      Stresa-Lago Maggiore, Italy
    • Year and Date
      2007-03-13
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Improvement of power distribution network using correlation-based regression analysis2007

    • Author(s)
      Shiho, Hagiwara, Takumi, Uezono, Takashi, Sato, Kazuya, Masu
    • Organizer
      Great Lakes Symposium on VLSI (GLSVLSI)
    • Place of Presentation
      Stresa-Lago Maggiore, Italy
    • Year and Date
      2007-03-13
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] A Multi-Drop Transmission-Line Interconnect in Si LSI2007

    • Author(s)
      J. Seita, H. Ito, K. Okada, T. Sato, and K. Masu
    • Organizer
      Asia and South Pacific Design Automation Conference(ASP-DAC)
    • Place of Presentation
      Yokohama, Japan
    • Year and Date
      2007-01-24
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Reconfigurable CMOS Low Noise Amplifier Using Variable Bias Circuit for Self Compensation2007

    • Author(s)
      S. Fukuda, D. Kawazoe, K. Okada, and K. Masu
    • Organizer
      Asia and South Pacific Design Automation Conference(ASP-DAC)
    • Place of Presentation
      Yokohama, Japan
    • Year and Date
      2007-01-24
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Wideband CMOS LC-VCO Using Variable Inductor2007

    • Author(s)
      K. Ohashi, Y. Ito, Y. Yoshihara, K. Okada, and K. Masu
    • Organizer
      Asia and South Pacific Design Automation Conference(ASP-DAC)
    • Place of Presentation
      Yokohama, Japan
    • Year and Date
      2007-01-24
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] A Multi-Drop Transmission-Line Interconnect in Si LSI2007

    • Author(s)
      Junki, Seita, Hiroyuki, Ito, Kenichi, Okada, Takashi, Sato, Kazuya, Masu
    • Organizer
      Asia and South Pacific Design Automation Conference
    • Place of Presentation
      Yokohama, Japan
    • Year and Date
      2007-01-24
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Reconfigurable CMOS Low Noise Amplifier Using Variable Bias Circuit for Self Compensation2007

    • Author(s)
      Satoshi, Fukuda, Daisuke, Kawazoe, Kenichi, Okada, Kazuya, Masu
    • Organizer
      Asia and South Pacific Design Automation Conference
    • Place of Presentation
      Yokohama, Japan
    • Year and Date
      2007-01-24
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Wideband CMOS LC-VCO Using Variable Inductor2007

    • Author(s)
      Kazuma, Ohashi, Yusaku, Ito, Yoshiaki, Yoshihara, Kenichi, Okada, Kazuya, Masu
    • Organizer
      Asia and South Pacific Design Automation Conference
    • Place of Presentation
      Yokohama, Japan
    • Year and Date
      2007-01-24
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Small-Area CMOS RF Distributed Mixer Using Multi-Port Inductors2007

    • Author(s)
      T. Yammouch, K. Okada, and K. Masu
    • Organizer
      2007 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems(SiRF)
    • Place of Presentation
      Long Beach, California,
    • Year and Date
      2007-01-10
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Small-Area CMOS RF Distributed Mixer Using Multi-Port Inductors2007

    • Author(s)
      Tackya, Yammouch, Kenichi, Okada, Kazuya, Masu
    • Organizer
      2007 Topical Meeting on Silicon Monohthic Integrated Circuits in RF Systems (SiRF)
    • Place of Presentation
      Long Beach, California
    • Year and Date
      2007-01-10
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Transmission Line Interconnect on Si CMOS LSI,(Invited Paper)2006

    • Author(s)
      K. Masu, K. Okada, and H. Ito
    • Organizer
      8th International Conference on Solid-State and Integrated-Circuit Technology
    • Place of Presentation
      Shanghai, China
    • Year and Date
      20061023-26
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Equivalent Circuit Model for On-Chip Variable Inductor2006

    • Author(s)
      T. Yammouch, K. Ishida, K. Okada, and K. Masu
    • Organizer
      International Conference on Solid State Devices and Materials(SSDM)
    • Place of Presentation
      Yokohama
    • Year and Date
      20060913-15
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] On-Chip Yagi Antenna for Wireless Signal Transmission in Stacked MCP,2006

    • Author(s)
      K. Ohashi, T. Yammouch, M. Kimura, H. Ito, K. Okada, K. Ishida, K. Itoi, M. Sato, T. Ito, and K. Masu
    • Organizer
      International Conference on Solid State Devices and Materials(SSDM)
    • Place of Presentation
      Yokohama
    • Year and Date
      20060913-15
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Estimation of Power Reduction by On-Chip Transmission Line for 45nm Technology2006

    • Author(s)
      K. Okada, T. Uezono, and K. Masu
    • Organizer
      International Workshop on Power and Timing Modeling, Optimization and Simulation(PATMOS)
    • Place of Presentation
      Montpellier, France,
    • Year and Date
      20060913-15
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] High-Crosstalk Robustness Transmission Line Interconnect in Si LSI using Zero-Crosstalk Structure2006

    • Author(s)
      M. Kimura, H. Ito, H. Sugita, K. Okada, and K. Masu
    • Organizer
      IEEE Workshop on Signal Propagation on Interconnects(SPI)
    • Place of Presentation
      Berlin-Mitte, Germany,
    • Year and Date
      20060510-12
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] A Loss Optimization Method Using WD Product for On-Chip Differential Transmission Line Design2006

    • Author(s)
      H. Ito, K. Okada, and K. Masu
    • Organizer
      IEEE Workshop on Signal Propagation on Interconnects(SPI)
    • Place of Presentation
      Berlin-Mitte, Germany,
    • Year and Date
      20060510-12
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] On-chip/Off-chip High Density Transmission Line Interconnect,(Invited Paper),2006

    • Author(s)
      K. Masu, K. Okada, and H. Ito
    • Organizer
      International Conference on Electronics Packaging(ICEP2006)
    • Place of Presentation
      Tokyo
    • Year and Date
      20060419-21
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Yield Estimation Considering Via Defects2006

    • Author(s)
      T. Uezono, K. Okada, and K.Masu
    • Organizer
      The Workshop on Synthesis And System Integration of Mixed Information Technologies,
    • Place of Presentation
      Nagoya
    • Year and Date
      20060403-04
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Via Distribution Model for Yield Estimation2006

    • Author(s)
      T. Uezono, K. Okada, and K. Masu
    • Organizer
      IEEE International Symposium on Quality Electronic Design(ISQED)
    • Place of Presentation
      San Jose,California
    • Year and Date
      20060328-19
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] On-chip signal transmission and interconnect for Si CMOS LSI,(Invited Paper)2006

    • Author(s)
      K. Masu, K. Okada, and H. Ito
    • Organizer
      IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems
    • Place of Presentation
      San Diego,California
    • Year and Date
      20060118-20
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology for One-Chip Wireless Communication Circuits2006

    • Author(s)
      J. Seita, H. Ito, H. Sugita, K. Okada, T. Ito, K. Itoi, M. Sato, and K. Masu
    • Organizer
      IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems
    • Place of Presentation
      San Diego, CA
    • Year and Date
      20060118-20
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] An Left Handed Material on Si CMOS Chip with Wafer Level Package Process2006

    • Author(s)
      J.-G. Kim, K. Okada, T. Yammouch, T. Sato, and K. Masu
    • Organizer
      IEEE Asia-Pacific Microwave Conference(APMC).
    • Place of Presentation
      Yokohama, Japan
    • Year and Date
      2006-12-14
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] An Left Handed Material on Si CMOS Chip with Wafer Level Package Process2006

    • Author(s)
      Jang-Gu, Kim, Kenichi, Okada, Tackya, Yammouch, Takashi, Sato, Kazuya, Masu
    • Organizer
      IEEE Asia-Pacific Microwave Conference (APMC)
    • Place of Presentation
      Yokohama
    • Year and Date
      2006-12-14
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] ADC-7GHz Small-Area Distributed Amplifier Using5-port Inductors in a 180nm Si CMOS Technology2006

    • Author(s)
      T. Ito, D. Kawazoe, K. Okada, and K. Masu
    • Organizer
      IEEE Asian Solid-State Circuits Conference(A-SSCC),
    • Place of Presentation
      Hangzhou, China
    • Year and Date
      2006-11-15
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] A 0.98 to 6.6GHz Tunable Wideband VCO in a 180nm CMOS Technology for Reconfigurable Radio Transceiver2006

    • Author(s)
      Y. Ito, H. Sugawara, K. Okada, and K. Masu
    • Organizer
      IEEE Asian Solid-State Circuits Conference(A-SSCC)
    • Place of Presentation
      Hangzhou, China
    • Year and Date
      2006-11-15
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] A DC-7GHz Small-Area Distributed Amplifier Using 5-port Inductors in a 180nm Si CMOS Technology2006

    • Author(s)
      Takeshi, Ito, Daisuke, Kawazoe, Kenichi, Okada, Kazuya, Masu
    • Organizer
      IEEE Asian Solid-State Circuits Conference (A-SSCC)
    • Place of Presentation
      Hangzhou, China
    • Year and Date
      2006-11-15
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] A 0.98 to 6.6GHz Tunable Wideband VCO in a 180nm CMOS Technology for Reconfigurable Radio Transceiver2006

    • Author(s)
      Yusaku, Ito, Hirotaka, Sugawara, Kenichi, Okada, Kazuya, Masu
    • Organizer
      IEEE Asian Solid-State Circuits Conference (A-SSCC)
    • Place of Presentation
      Hangzhou, China
    • Year and Date
      2006-11-15
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] A 6.5-mW5-Gbps On-Chip Differential Transmission Line Interconnect with a Low-Latency Asymmetric Tx in a 180nm CMOS Technology2006

    • Author(s)
      T. Ishii, H. Ito, M. Kimura, K. Okada, and K. Masu
    • Organizer
      IEEE Asian Solid-State Circuits Conference(A-SSCC)
    • Place of Presentation
      Hangzhou, China
    • Year and Date
      2006-11-14
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] A 6.5-mW 5-Gbps On-Chip Differential Transmission Line Interconnect with a Low-Latency Asymmetric Tx in a 180nm CMOS Technology2006

    • Author(s)
      Takahiro, shuii, Hiroyuki, Ito, Makoto, Kimura, Kenichi, Okada, Kazuya, Masu
    • Organizer
      IEEE Asian Solid-State Circuits Conference (A-SSCC)
    • Place of Presentation
      Hangzhou, China
    • Year and Date
      2006-11-14
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Transmission Line Interconnect on Si CMOS LSI2006

    • Author(s)
      Kazuya, Masu, Kenichi, Okada, Hiroyuki, Ito
    • Organizer
      (Invited Paper), 8th International Conference on Solid-State and Integrated-Circuit Technology
    • Place of Presentation
      Shanghai, China.
    • Year and Date
      2006-10-24
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] On-Chip Differential-Transmission-Line(DTL)Interconnect for 22nm Technology2006

    • Author(s)
      K. Okada, H. Ito, and K. Masu
    • Organizer
      Advanced Metallization Conference(AMC)
    • Place of Presentation
      San Diego, CA
    • Year and Date
      2006-10-17
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] On-Chip Differential-Transmission-Line(DTL) Interconnect for 22nm Technology2006

    • Author(s)
      Kenichi, Okada, Hiroyuki, Ito, Kazuya, Masu
    • Organizer
      Advanced Metallization Conference (AMC)
    • Place of Presentation
      San Diego, CA
    • Year and Date
      2006-10-17
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] On-Chip Differential-Transmission-Line(DTL)Interconnect for 22nm Technology2006

    • Author(s)
      K. Okada, H. Ito, and K. Masu
    • Organizer
      Advanced Metallization Conference, Asian Session(ADMETA),
    • Place of Presentation
      Tokyo,
    • Year and Date
      2006-09-27
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] On-Chip Differential-Transmission-Line(DTL) Interconnect for 22nm Technology2006

    • Author(s)
      Kenichi, Okada, Hiroyuki, Ito, Kazuya, Masu
    • Organizer
      Advanced Metallization Conference, Asian Session (ADMETA)
    • Place of Presentation
      Tokyo
    • Year and Date
      2006-09-27
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Estimation of Power Reduction by On-Chip Transmission Line for 45nm Technology2006

    • Author(s)
      Kenichi, Okada, Takumi, Uezono, Kazuya, Masu
    • Organizer
      International Workshop on Power and Timing Modeling, Optimization and Simulation (PATMOS)
    • Place of Presentation
      Montpellier, France
    • Year and Date
      2006-09-14
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Equivalent Circuit Model for On-Chip Variable Inductor2006

    • Author(s)
      Tackya, Yammouch, Koichi, Ishida, Kenichi, Okada, Kazuya, Masu
    • Organizer
      International Conference on Solid State Devices and Materials (SSDM)
    • Place of Presentation
      Yokohama
    • Year and Date
      2006-09-13
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] On-Chip Yagi Antenna for Wireless Signal Transmission in Stacked MCP2006

    • Author(s)
      Kazuma, Ohashi, Tackya, Yammouch, Makoto, Kimura, Hiroyuki, Ito, Kenichi, Okada, Koichi, Ishida, Kazuhisa, Itoi, Masakazu, Sato, Tatsuya, Ito, Kazuya, Masu
    • Organizer
      International Conference on Solid State Devices and Materials (SSDM)
    • Place of Presentation
      Yokohama
    • Year and Date
      2006-09-13
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Reconfigurable CMOS Low Noise Amplifier for Self Compensation2006

    • Author(s)
      D. Kawazoe, H. Sugawara, T. Ito, K. Okada, and K. Masu
    • Organizer
      , IEEE International Symposium on Circuits and Systems(ISCAS)
    • Place of Presentation
      Kos, Greece,
    • Year and Date
      2006-05-23
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Reconfigurable CMOS Low Noise Amplifier for Self Compensation2006

    • Author(s)
      Daisuke, Kawazoe, Hirotaka, Sugawara, Takeshi, Ito, Kenichi, Okada, Kazuya, Masu
    • Organizer
      IEEE International Symposium on Circuits and Systems (ISCAS)
    • Place of Presentation
      Kos/Greece
    • Year and Date
      2006-05-23
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] High-Crosstalk Robustness Transmission Line Interconnect in Si LSI using Zero-Crosstalk Structure2006

    • Author(s)
      Makoto, Kimura, Hiroyuki, Ito, Hideyuki, Sugita, Kenichi, Okada, Kazuya, Masu
    • Organizer
      IEEE Workshop on Signal Propagation on Interconnects (SPI)
    • Place of Presentation
      Berhn-Mitte, Germany
    • Year and Date
      2006-05-12
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] A Loss Optimization Method Using WD Product for On-Chip Differential Transmission Line Design2006

    • Author(s)
      Hiroyuki, Ito, Kenichi, Okada, Kazuya, Masu
    • Organizer
      IEEE Workshop on Signal Propagation on Interconnects (SPI)
    • Place of Presentation
      Berlin-Mitte, Germany
    • Year and Date
      2006-05-10
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] On-chip/Off-chip High Density Transmission Line Interconnect2006

    • Author(s)
      Kazuya, Masu, Kenichi, Okada, Hiroyuki, Ito
    • Organizer
      (Invited Paper), International Conference on Electronics Packaging (ICEP2006), Tokyo, Japan
    • Place of Presentation
      Tokyo
    • Year and Date
      2006-04-20
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Power Reduction Using On-Chip Transmission Line for 45nm technology2006

    • Author(s)
      K. Okada, T. Uezono, and K. Masu
    • Organizer
      The Workshop on Synthesis And System Integration of Mixed Information Technologies
    • Place of Presentation
      Nagoya
    • Year and Date
      2006-04-03
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Yield Estimation Considering Via Defects2006

    • Author(s)
      Takumi, Uezono, Kenichi, Okada, Kazuya, Masu
    • Organizer
      The Workshop on Synthesis And System Integration of Mixed Information Technologies
    • Place of Presentation
      Nagoya
    • Year and Date
      2006-04-03
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Via Distribution Model for Yield Estimation2006

    • Author(s)
      Takumi, Uezono, Kenichi, Okada, Kazuya, Masu
    • Organizer
      IEEE International Symposium on Quality Electronic Design
    • Place of Presentation
      San Jose, California
    • Year and Date
      2006-03-28
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] On-chip signal transmission and interconnect for Si CMOS LSI2006

    • Author(s)
      Kazuya, Masu, Kenichi, Okada, Hiroyuki, Ito
    • Organizer
      (Invited Paper), IEEE Topical Meeting on Silicon. Monolithic Integrated Circuits in RF Systems
    • Place of Presentation
      San Diego, California
    • Year and Date
      2006-01-19
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology for One-Chip Wireless Communication Circuits2006

    • Author(s)
      Junki, Seita, Hiroyuki, Ito, Hideyuki, Sugita, Kenichi, Okada, Tatsuya, Ito, Kazuhisa, Itoi, Masakazu, Sato, Kazuya, Masu
    • Organizer
      IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems
    • Place of Presentation
      San Diego
    • Year and Date
      2006-01-18
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Reconfigurable RF Circuit Design for Multi-Function and Self-Compensation2005

    • Author(s)
      K. Okada, H. Sugawara D. Kawazoe, Y. Ito, and K. Masu
    • Organizer
      International Symposium on Advanced Reconfigurable Systems, .
    • Place of Presentation
      Kyoto
    • Year and Date
      20051215-16
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Gbps Signal Transmission on Si CMOS ULSI,(keynote lecture)2005

    • Author(s)
      K. Masu
    • Organizer
      International Conference on Electronics Materials and Packaging(EMAP2005)
    • Place of Presentation
      Tokyo, Japan
    • Year and Date
      20051210-14
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] A Reconfigurable RF Circuit Architecture for Dynamic Power Reduction2005

    • Author(s)
      D. Kawazoe, H. Sugawara, T. Ito, K. Okada, and K. Masu
    • Organizer
      IEEE International Region 10 Conference.
    • Place of Presentation
      Melbourne, Australia
    • Year and Date
      20051121-24
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] 4 Gbps On-Chip Interconnection using Differential Transmission Line2005

    • Author(s)
      H. Ito, H. Sugita, K. Okada, and K. Masu
    • Organizer
      IEEE Asian Solid-State Circuits Conference(A-SSCC)
    • Place of Presentation
      Hsinchu, Taiwan,
    • Year and Date
      20051101-03
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] A 1.3-2.8 GHz Wide Range CMOSLC-VCO Using Variable Inductor2005

    • Author(s)
      Y. Ito, Y. Yoshihara, H. Sugawara, K. Okada, and K. Masu
    • Organizer
      IEEE Asian Solid-State Circuits Conference(A-SSCC)
    • Place of Presentation
      Hsinchu, Taiwan
    • Year and Date
      20051101-03
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Reconfigurable CMOS LNA for Software Defined Radio Using Variable Inductor2005

    • Author(s)
      H. Sugawara, Y. Yoshihara, K. Okada, and K. Masu
    • Organizer
      IEEE MTT-S European Microwave Conference
    • Place of Presentation
      Paris, France
    • Year and Date
      20051004-06
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] On-Chip Variable Inductor using MOSFET Switches2005

    • Author(s)
      K. D. Pham, K. Okada, and K. Masu
    • Organizer
      IEEE MTT-S European Microwave Conference
    • Place of Presentation
      Paris, France
    • Year and Date
      20051004-06
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] A Large Variable Ration On-Chip Inductor with Spider Legs Shield2005

    • Author(s)
      T. Yammouch, H. Sugawara, K. Okada, and K. Masu
    • Organizer
      International Conference on Solid State Devices and Materials(SSDM)
    • Place of Presentation
      Kobe, Japan
    • Year and Date
      20050913-15
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Reconfigurable RF Circuit Design for Multi-Function and Self-Compensation2005

    • Author(s)
      Kenichi, Okada, Hirotaka, Sugawara, Daisuke, Kawazoe, Yusaku, Ito, Kazuya, Masu
    • Organizer
      International Symposium on Advanced Reconfigurable Systems
    • Place of Presentation
      Kyoto
    • Year and Date
      2005-12-15
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Gbps Signal Transmission on Si CMOS ULSI (keynote lecture)2005

    • Author(s)
      Kazuya, Masu
    • Organizer
      International Conference on Electronics Materials and Packaging (EMAP2005)
    • Place of Presentation
      Tokyo, Japan
    • Year and Date
      2005-12-13
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] A Reconfigurable RF Circuit Architecture for Dynamic Power Reduction2005

    • Author(s)
      Daisuke, Kawazoe, Hirotaka, Sugawara, Takeshi, Ito, Kenichi, Okada, Kazuya, Masu
    • Organizer
      IEEE International Region 10 Conference, Melbourne
    • Place of Presentation
      Australia
    • Year and Date
      2005-11-24
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] A 1. 3-2. 8 GHz Wide Range CMOS LC-VCO Using Variable Inductor2005

    • Author(s)
      Yusaku, Ito, Yoshiaki, Yoshihara, Hirotaka, Sugawara, Kenichi, Okada, Kazuya, Masu
    • Organizer
      IEEE Asian Solid-State Circuits Conference
    • Place of Presentation
      Hsinchu, Taiwan
    • Year and Date
      2005-11-02
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] 4 Gbps On-Chip Interconnection using Differential Transmission Line2005

    • Author(s)
      Hiroyuki, Ito, Hideyuki, Sugita, Kenichi, Okada, Kazuya, Masu
    • Organizer
      IEEE Asian Solid-State Circuits Conference
    • Place of Presentation
      Hsinchu, Taiwan
    • Year and Date
      2005-11-01
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] High-Density Differential Transmission Line Bus Structure for 65nm Technology2005

    • Author(s)
      M. Kimura, H. Ito, H. Sugita, K. Okada, and K. Masu
    • Organizer
      Advanced Metallization Conference Asian Session(ADMETA)
    • Place of Presentation
      Tokyo
    • Year and Date
      2005-10-13
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] High-Density Differential Transmission Line Bus Structure for 65nm Technology2005

    • Author(s)
      Makoto, Kimura, Hiroyuki, Ito, Hideyuki, Sugita, kenichi, Okada, Kazuya, Masu
    • Organizer
      Advanced Metallization Conference Asian Session (ADMFTA)
    • Place of Presentation
      Tokyo
    • Year and Date
      2005-10-13
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] On-Chip Variable Inductor using MOSFET Switches2005

    • Author(s)
      Khoa Dang, Pham, Kenichi, Okada, Kazuya, Masu
    • Organizer
      IEEE MTT-S European Microwave Conference
    • Place of Presentation
      Paris
    • Year and Date
      2005-10-06
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Reconfigurable CMOS LNA for Software Defined Radio Using Variable Inductor2005

    • Author(s)
      Hirotaka, Sugawara, Yoshiaki, Yoshihara, Kenichi, Okada, Kazuya, Masu
    • Organizer
      IEEE MTT-S European Microwave Conference
    • Place of Presentation
      Paris
    • Year and Date
      2005-10-04
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] High-Density Differential Transmission Line Bus Structure for 65nm Technology2005

    • Author(s)
      M. Kimura, H. Ito, H. Sugita, K. Okada, and K. Masu
    • Organizer
      Advanced Metallization Conference 2005(AMC)
    • Place of Presentation
      Colorado Springs, Colorado
    • Year and Date
      2005-09-27
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] High-Density Differential Transmission Line Bus Structure for 65nm Technology2005

    • Author(s)
      Makoto, Kimura, Hiroyuki, Ito, Hideyuki, Sugita, kenichi, Okada, Kazuya, Masu
    • Organizer
      Advanced Metallization Conference 2005 (AMC)
    • Place of Presentation
      Colorado Springs, Colorado
    • Year and Date
      2005-09-27
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Zero-Crosstalk Bus Line Structure for Global Interconnects in Si ULSI2005

    • Author(s)
      M. Kimura, H. Ito, H. Sugita, K. Okada, and K. Masu
    • Organizer
      International Conference on Solid State Devices and Materials(SSDM)
    • Place of Presentation
      Kobe, Japan
    • Year and Date
      2005-09-15
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Zero-Crosstalk Bus Line Structure for Global Interconnects in Si ULSI2005

    • Author(s)
      Makoto, Kimura, Hiroyuki, Ito, Hideyuki, Sugita, Kenichi, Okada, Kazuya, Masu
    • Organizer
      International Conference on Solid State Devices and Materials
    • Place of Presentation
      Kobe
    • Year and Date
      2005-09-15
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] A Large Variable Ration On-Chip Inductor with Spider Legs Shield2005

    • Author(s)
      Tackya, Yammouch, Hirotaka, Sugawara, Kenichi, Okada, Kazuya, Masu
    • Organizer
      International Solid State Devices and Materials
    • Place of Presentation
      Kobe
    • Year and Date
      2005-09-14
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Development of Differential Transmission Line Interconnect IP for High-Speed Global Interconnect2005

    • Author(s)
      H. Ito, K. Okada, and K. Masu
    • Organizer
      Circuit Exhibition of European Solid-State Device Research Conference and European Solid-State Circuits Conference
    • Place of Presentation
      ,Grenoble, France
    • Year and Date
      2005-09-12
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Development of Differential Transmission Line Interconnect IP for High-Speed Global Interconnect2005

    • Author(s)
      H. Ito, K. Okada, K. Masu
    • Organizer
      Circuit Exhibition of European Solid-State Device Research Conference and European Solid-State Circuits Conference Poster 26
    • Place of Presentation
      Grenoble
    • Year and Date
      2005-09-12
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Wire Length Distribution Model Considering Core Utilization for System on Chip2005

    • Author(s)
      T. Kyogoku, J. Inoue, H. Nakashima, T. Uezono, K. Okada and K. Masu
    • Organizer
      IEEE Computer Society Annual Symposium on VLSI
    • Place of Presentation
      Tampa, Florida,
    • Year and Date
      2005-05-11
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Wire Length Distribution Model Considering Core Utilization for System on Chip2005

    • Author(s)
      Takanori, Kyogoku, Junpei, Inoue, Hidenari, Nakashima, Takumi, Uezono, Kenichi, Okada, Kazuya, Masu
    • Organizer
      IEEE Computer Society Annual Symposium on VLSI
    • Place of Presentation
      Tampa, Florida
    • Year and Date
      2005-05-11
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] On-Wafer Measurement of Pseudo Differential Transmission Line for Global Interconnect in Si LSI,2005

    • Author(s)
      H. Sugita, H. Ito, S. Gomi, K. Okada, and K. Masu
    • Organizer
      International Meeting for Future of Electron Devices
    • Place of Presentation
      Kyoto
    • Year and Date
      2005-04-12
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] On-Wafer Measurement of Pseudo Differential Transmission Line for Global Interconnect in Si LSI2005

    • Author(s)
      Hideyuki, Sugita, Hiroyuki, Ito, Shinichiro, Gomi, Kenichi, Okada, Kazuya, Masu
    • Organizer
      International Meeting for Future of Electron Devices
    • Place of Presentation
      Kyoto
    • Year and Date
      2005-04-12
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Prediction of Delay Time for Future LSI Using On-Chip Transmission Line Interconnects2005

    • Author(s)
      T. Uezono, J. Inoue, T. Kyogoku, K. Okada, and K. Masu
    • Organizer
      IEEE International Workshop on System Level Interconnect Prediction
    • Place of Presentation
      San Francisco, CA
    • Year and Date
      2005-04-02
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Prediction of Delay Time for Future LSI Using On-Chip Transmission Line Interconnects2005

    • Author(s)
      Takumi, Uezono, Junpei, Inoue, Takanori, Kyogoku, Kenichi, Okada, Kazuya, Masu
    • Organizer
      IEEE International Workshop on System Level Interconnect Prediction
    • Place of Presentation
      San Francisco
    • Year and Date
      2005-04-02
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Topics relating to CMOS Circuits: Transmission Line and CMOS Reconfigurable Circuit Technology Inteterconnect2005

    • Author(s)
      K. Masu
    • Organizer
      6th Workshop and IEEE EDS Mini-colloquia on Nanometer CMOS Technology(WIMNACT)
    • Place of Presentation
      Hsinchu, Taiwan
    • Year and Date
      2005-01-21
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] A Dynamic Reconfigurable RF Circuit Architecture2005

    • Author(s)
      K. Okada, Y. Yoshihara, H. Sugawara, and K. Masu
    • Organizer
      IEEE/ACM Asia South Pacific Design Automation Conference(ASP-DAC)
    • Place of Presentation
      Shanghai, China
    • Year and Date
      2005-01-21
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Topics relating to CMOS Circuits : Transmission Line and CMOS Reconfigurable Circuit Technology Inteterconnect2005

    • Author(s)
      Kazuya, Masu
    • Organizer
      6th Workshop and IEEE EDS Mini-colloquia on Nanometer CMOS Technology (WIMNACT)
    • Place of Presentation
      Hsinchu, Taiwan
    • Year and Date
      2005-01-21
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] A Dynamic Reconfigurable RF Circuit Architecture2005

    • Author(s)
      Kenichi, Okada, Yoshiaki, Yoshihara, Hirotaka, Sugawara, Kazuya, Masu
    • Organizer
      IEEE/ACM Asia South Pacific Design Automation Conference
    • Place of Presentation
      Shanghai, China
    • Year and Date
      2005-01-21
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Evaluation of On-Chip Transmission Line Interconnect Using Wire Length Distribution2005

    • Author(s)
      J. Inoue, H. Ito, S. Gomi, T. Kyogoku, T. Uezono, K. Okada, and K. Masu
    • Organizer
      IEEE/ACM Asia South Pacific Design Automation Conference(ASP-DAC)
    • Place of Presentation
      Shanghai, China
    • Year and Date
      2005-01-19
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Evaluation of On-Chip Transmission Line Interconnect Using Wire Length Distribution2005

    • Author(s)
      Junpei, Inoue, Hiroyuki, Ito, Shinichiro, Gomi, Takanori, Kyogoku, Takumi, Uezono, Kenichi, Okada, Kazuya, Masu
    • Organizer
      IEEE/ACM Asia South Pacific Design Automation Conference
    • Place of Presentation
      Shanghai, China
    • Year and Date
      2005-01-19
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] High Density Bus Line Structure With Pseudo Differential Transmission Line in Si ULSI2004

    • Author(s)
      H. Ito, S. Gomi, H. Sugita, K. Okada, and K. Masu
    • Organizer
      IEEE Asia-Pacific Microwave Conference(APMC)
    • Place of Presentation
      Delhi, lndia
    • Year and Date
      2004-12-17
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Small Area Inductor for Silicon CMOS Chip2004

    • Author(s)
      H. Sugawara, K. Okada and K. Masu
    • Organizer
      IEEE Asia-Pacific Microwave Conference(APMC)
    • Place of Presentation
      Delhi, lndia
    • Year and Date
      2004-12-17
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] High Density Bus Line Structure With Pseudo Differential Transmission Line in Si ULSI2004

    • Author(s)
      Hiroyuki, Ito, Shinichiro, Gomi, Hideyuki, Sugita, Kenichi, Okada, Kazuya, Masu
    • Organizer
      IEEE Asia-Pacific Microwave Conference
    • Place of Presentation
      Delhi, India
    • Year and Date
      2004-12-17
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Small Area Inductor for Silicon CMOS Chip2004

    • Author(s)
      Hirotaka, Sugawara, Kenichi, Okada, Kazuya, Masu
    • Organizer
      IEEE Asia-Pacific Microwave Conference
    • Place of Presentation
      Delhi, India
    • Year and Date
      2004-12-17
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] On-Chip Transmission Line for Long Global Interconnects2004

    • Author(s)
      H. Ito, J. Inoue, S. Gomi, H. Sugita, K. Okada, and K. Masu
    • Organizer
      IEEE International Electron Devices Meeting(IEDM)
    • Place of Presentation
      San Francisco
    • Year and Date
      2004-12-15
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] On-Chip Transmission Line for Long Global Interconnects2004

    • Author(s)
      Hiroyuki, Ito, Junpei, Inoue, Shinichiro, Gomi, Hideyuki, Sugita, Kenichi, Okada, Kazuya, Masu
    • Organizer
      IEEE International Electron Devices Meeting (IEDM)
    • Place of Presentation
      San Francisco
    • Year and Date
      2004-12-15
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Optimization Methodology of Global Interconnect Structure,2004

    • Author(s)
      J. Inoue, H. Nakashima, T. Kyogoku, T. Uezono, K. Okada, and K. Masu
    • Organizer
      International Conference on Microelectronics
    • Place of Presentation
      Tunis
    • Year and Date
      2004-12-07
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Optimization Methodology of Global Interconnect Structure2004

    • Author(s)
      Junpei, Inoue, Hidenari, Nakashima, Takanori, Kyogoku, Takumi, Uezono, Kenichi, Okada, Kazuya, Masu
    • Organizer
      International Conference on Microelectronics
    • Place of Presentation
      Tunis
    • Year and Date
      2004-12-07
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] High Speed and Low Power On-Chip Micro Network Circuit with Differential Transmission Line2004

    • Author(s)
      S. Gomi, K. Nakamura, H. Ito, H. Sugita, K. Okada, and K. Masu
    • Organizer
      International Symposium on System-on-Chip,
    • Place of Presentation
      Tampere, Finland
    • Year and Date
      2004-11-18
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] High Speed and Low Power On-Chip Micro Network Circuit with Differential Transmission Line2004

    • Author(s)
      Shinichiro, Gomi, Kohichi, Nakamura, Hiroyuki, Ito, Hideyuki, Sugita, Kenichi, Okada, Kazuya, Masu
    • Organizer
      International Symposium on System-on-Chip, Tampere
    • Place of Presentation
      Finland
    • Year and Date
      2004-11-18
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Pseudo Differential Transmission Line Structure on Si ULSI2004

    • Author(s)
      H. Sugita, H. Ito, S. Gomi, K. Okada, and K. Masu
    • Organizer
      Advanced Metallization Conference(AMC)
    • Place of Presentation
      San Diego, CA
    • Year and Date
      2004-10-19
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] ″Wire Length Distribution of SoC considering Macro Block Shapes2004

    • Author(s)
      T. Kyogoku, H. Nakashima, J. Inoue, N. Takagi, H. Shinoki, K. Okada and K. Masu
    • Organizer
      The Workshop on Synthesis And System Integration of Mixed Information Technologies
    • Place of Presentation
      Kanazawa
    • Year and Date
      2004-10-19
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Dynamic Reconfigurable RF Circuit Design2004

    • Author(s)
      K. Okada, Y. Yoshihara, H. Sugawara, and K. Masu
    • Organizer
      The Workshop on Synthesis And System Integration of Mixed Information Technologies,
    • Place of Presentation
      Kanazawa
    • Year and Date
      2004-10-19
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Pseudo Differential Transmission Line Structure on Si ULSI2004

    • Author(s)
      Hideyuki, Sugita, Hiroyuki, Ito, Shinichiro, Gomi, Kenichi, Okada, Kazuya, Masu
    • Organizer
      Advanced Metallization Conference (AMC)
    • Place of Presentation
      San Diego
    • Year and Date
      2004-10-19
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Wire Length Distribution of SoC considering Macro Block Shapes2004

    • Author(s)
      Takanori, Kyogoku, Hidenari, Nakashima, Junpei, Inoue, Naohiro, Takagi, Hiyouko, Shinoki, Kenichi, Okada, Kazuya, Masu
    • Organizer
      The Workshop on Synthesis And System Integration of Mixed Information Technologies
    • Place of Presentation
      Kanazawa
    • Year and Date
      2004-10-19
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Dynamic Reconfigurable RF Circuit Design2004

    • Author(s)
      Kenichi, Okada, Yoshiaki, Yoshihara, Hirotaka, Sugawara, Kazuya, Masu
    • Organizer
      The Workshop on Synthesis And System Integration of Mixed Information Technologies
    • Place of Presentation
      Kanazawa
    • Year and Date
      2004-10-19
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] ″Wide-Range RF Variable Inductor on Si CMOS Chip with MEMS Actuator2004

    • Author(s)
      H. Sugawara, Y. Yoshihara, H. Ito, K. Okada, and K. Masu
    • Organizer
      IEEE European Microwave Conference(EuMC),
    • Place of Presentation
      Amsterdam
    • Year and Date
      2004-10-13
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Wide-Range RF Variable Inductor on Si CMOS Chip with MEMS Actuator2004

    • Author(s)
      Hirotaka Sugawara, Yoshiaki Yoshihara, Hiroyuki Ito, Kenichi Okada, Kazuya Masu
    • Organizer
      IEEE European Microwave Conference (EuMC)
    • Place of Presentation
      Amsterdam
    • Year and Date
      2004-10-13
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Differential Transmission Line Interconnect for High Speed and Low Power Global Wiring2004

    • Author(s)
      S. Gomi, K. Nakamura, H. Ito, K. Okada, and K. Masu
    • Organizer
      IEEE Custom Integrated Circuits Conference(CICC)
    • Place of Presentation
      Orland, Florida
    • Year and Date
      2004-10-05
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Differential Transmission Line Interconnect for High Speed and Low Power Global Wiring2004

    • Author(s)
      Shinichiro, Gomi, Kohichi, Nakamura, Hiroyuki, Ito, Kenichi, Okada, Kazuya, Masu
    • Organizer
      IEEE Custom Integrated Circuits Conference
    • Place of Presentation
      Orland, Florida
    • Year and Date
      2004-10-05
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Pseudo Differential Transmission Line Structure on Si ULSI2004

    • Author(s)
      H. Sugita, H. Ito, S. Gomi, K. Okada, and K. Masu
    • Organizer
      Advanced Metallization Conference Asian Session(ADMETA)
    • Place of Presentation
      Tokyo
    • Year and Date
      2004-09-28
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Pseudo Differential Transmission Line Structure on Si ULSI2004

    • Author(s)
      Hideyuki, Sugita, Hiroyuki, Ito, Shinichiro, Gomi, Kenichi, Okada, Kazuya, Masu
    • Organizer
      Advanced Metallization Conference Asian Session (ADMETA)
    • Place of Presentation
      Tokyo
    • Year and Date
      2004-09-28
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] CVD-Al/PVD-Al Flow technology for Large Aspect Ratio Contact Hole Filling in Si ULSI Multilevel Interconnection,2004

    • Author(s)
      K. Masu, Manabu Sakamoto, Masanobu Hatanaka, Michio Ishikawa, and Yuji Furumura,
    • Organizer
      The Seventh China-Japan Symposium on Thin Films
    • Place of Presentation
      Chengdu, China
    • Year and Date
      2004-09-20
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] CVS-Al/PVD-Al Flow Technology for Large Aspect Ratio Contact Hole Filling in Si ULSI Multilevel Interconnection2004

    • Author(s)
      Kazuya, Masu, Manabu, Sakamoto, Masanobu, Hatanaka, Michio, Ishikawa, Yuji, Furumura
    • Organizer
      Proceedings of the Seventh China-Japan Symposium on Thin Films
    • Place of Presentation
      Chengdu, China
    • Year and Date
      2004-09-20
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Small Area Snake Inductor on Si RF CMOS Chip2004

    • Author(s)
      H. Sugawara, K. Okada and K. Masu
    • Organizer
      International Conference on Solid State Devices and Materials(SSDM)
    • Place of Presentation
      Funabori
    • Year and Date
      2004-09-16
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Twisted Differential Transmission Line Structure for EMI Noise Reduction at Global Interconnect in Si LSI2004

    • Author(s)
      H. Ito, S. Gomi, H. Sugita, K. Okada, and K. Masu
    • Organizer
      International Conference on Solid State Devices and Materials(SSDM)
    • Place of Presentation
      Funabori
    • Year and Date
      2004-09-16
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] High-Speed Transmission Circuit for Micro Network on Si ULSI2004

    • Author(s)
      S. Gomi, K. Nakamura, H. Ito, H. Sugita, K. Okada, and K, Masu
    • Organizer
      International Conference on Solid State Devices and Materials(SSDM)
    • Place of Presentation
      Funabori
    • Year and Date
      2004-09-16
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] in-vivo Wireless Communication System for Bio MEMS Sensors,2004

    • Author(s)
      K. Okada, T. Yamada, T. Uezono, K. Masu, A. Oki, and Y. Horiike
    • Organizer
      International Conference on Solid State Devices and Materials(SSDM)
    • Place of Presentation
      Funabori
    • Year and Date
      2004-09-16
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Optimization Technique of Number of Interconnect Layers and Circuit Area Based on Wire Length Distribution2004

    • Author(s)
      T. Kyogoku, J. Inoue, H. Nakashima, K. Okada, and K. Masu
    • Organizer
      International Conference on Solid State Devices and Materials(SSDM)
    • Place of Presentation
      Funabori
    • Year and Date
      2004-09-16
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Small Area Snake Inductor on Si RF CMOS Chip2004

    • Author(s)
      Hirotaka, Sugawara, Kenichi, Okada, Kazuya, Masu
    • Organizer
      International Conference on Solid State Devices and Materials, Funabori
    • Year and Date
      2004-09-16
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Twisted Differential Transmission Line Structure for EMI Noise Reduction at Global Interconnect in Si LSI2004

    • Author(s)
      Hiroyuki, Ito, Shinichiro, Gomi, Hideyuki, Sugita, Kenichi, Okada, Kazuya, Masu
    • Organizer
      International Conference on Solid State Devices and Materials, Funabori
    • Year and Date
      2004-09-16
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] High-Speed Transmission Circuit for Micro Network on Si ULSI2004

    • Author(s)
      Shinichiro, Gomi, Kohichi, Nakamura, Hiroyuki, Ito, Hideyuki, Sugita, Kenichi, Okada, Kazuya, Masu
    • Organizer
      International Conference on Solid State Devices and Materials, Funabori
    • Year and Date
      2004-09-16
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] in-vivo Wireless Communication System for Bio MEMS Sensors2004

    • Author(s)
      Kenichi, Okada, Tomohiro, Yamada, Takumi, Uezono, Kazuya, Masu, Akio, Oki, Yasuhiro, Horiike
    • Organizer
      International Conference on Solid State Devices and Materials, Funabori
    • Year and Date
      2004-09-16
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] Optimization Technique of Number of Interconnect Layers and Circuit Area Based on Wire Length Distribution2004

    • Author(s)
      Takanori, Kyogoku, Junpei, Inoue, Hidenari, Nakashima, Kenichi, Okada, Kazuya, Masu
    • Organizer
      International Conference on Solid State Devices and Materials, Funabori
    • Year and Date
      2004-09-16
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] High-Q Variable Inductor Using Redistributed Layers for Si RF Circuits2004

    • Author(s)
      H. Sugawara, H. Ito, K. Okada, K. Itoi, M. Sato, H. Abe and K. Masu
    • Organizer
      IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems
    • Place of Presentation
      Atlanta, GA
    • Year and Date
      2004-09-08
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] A Wide Tuning Range CMOS VCO using Variable Inductor2004

    • Author(s)
      Y. Yoshihara, H. Sugawara, H. lto, K. Okada and K. Masu
    • Organizer
      IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems
    • Place of Presentation
      Atlanta, GA
    • Year and Date
      2004-09-08
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] High-Q Variable Inductor Using Redistributed Layers for Si RF Circuits2004

    • Author(s)
      Hirotaka, Sugawara, Hiroyuki, Ito, Kenichi, Okada, Kazuhisa, Itoi, Masakazu, Sato, Hiroshi, Abe, Kazuya, Masu
    • Organizer
      IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems
    • Place of Presentation
      Atlanta
    • Year and Date
      2004-09-08
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] A Wide Tuning Range CMOS VCO using Variable Inductor2004

    • Author(s)
      Yoshiaki, Yoshihara, Hirotaka, Sugawara, Hiroyuki, Ito, Kenichi, Okada, Kazuya, Masu
    • Organizer
      IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems
    • Place of Presentation
      Atlanta
    • Year and Date
      2004-09-08
    • Description
      「研究成果報告書概要(欧文)」より
  • [Presentation] High Speed and Low Power Global Interconnect IP with Differential Transmission Line and Driver-Receiver Circuits2004

    • Author(s)
      S. Gomi, K. Nakamura, H. Ito, K. Okada and K. Masu
    • Organizer
      IEEE Asia-Pacific Conference on Advanced System Integrated Circuits
    • Place of Presentation
      Fukuoka
    • Year and Date
      2004-08-05
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Differential Transmission Line Structure for Over 10 Gbps Signal Transmission at Global Interconnect in Si ULSI2004

    • Author(s)
      H. Ito, S. Gomi, H. Sugita, K. Okada, and K. Masu
    • Organizer
      IEEE Asia-Pacific Conference on Advanced System Integrated Circuits Designer Forum
    • Place of Presentation
      Fukuoka
    • Year and Date
      2004-08-05
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Reconfigurable RF Circuit Design for Multi-band Wireless Chip2004

    • Author(s)
      Y. Yoshihara, H. Sugawara, H. lto, K. Okada, and K. Masu
    • Organizer
      IEEE Asia-Pacific Conference on Advanced System Integrated Circuits Designer Forum
    • Place of Presentation
      Fukuoka
    • Year and Date
      2004-08-05
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] Near Field Communication Chip using PIM for Bio Sensor2004

    • Author(s)
      K. Okada, T. Yamada, T. Uezono, K. Masu, A. Oki, and Y. Horiike
    • Organizer
      IEEE Asia-Pacific Conference on Advanced System Integrated Circuits Designer Forum
    • Place of Presentation
      Fukuoka
    • Year and Date
      2004-08-05
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] A Wide Tunable LC-VCO using Variable Inductor2004

    • Author(s)
      Y. Yoshihara, H. Sugawara, H. lto, K. Okada and K. Masu
    • Organizer
      Workshop on Wireless Circuits and Systems,
    • Place of Presentation
      Vancouver, Canada
    • Year and Date
      2004-05-21
    • Description
      「研究成果報告書概要(和文)」より
  • [Presentation] A Wide Tunable LC-VCO using Variable Inductor2004

    • Author(s)
      Yoshiaki, Yoshihara, Hirotaka, Sugawara, Hiroyuki, Ito, Kenichi, Okada, Kazuya, Masu
    • Organizer
      Workshop on Wireless Circuits and Systems, Vancouver
    • Place of Presentation
      Canada
    • Year and Date
      2004-05-21
    • Description
      「研究成果報告書概要(欧文)」より
  • [Remarks] 「研究成果報告書概要(和文)」より

    • URL

      http://masu-www.pi.titech.ac.jp/

URL: 

Published: 2010-02-04  

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