2007 Fiscal Year Final Research Report Summary
Development of On-chip Nano-Scale Network Based on Communication Theory
Project/Area Number |
16206034
|
Research Category |
Grant-in-Aid for Scientific Research (A)
|
Allocation Type | Single-year Grants |
Section | 一般 |
Research Field |
Electron device/Electronic equipment
|
Research Institution | Tokyo Institute of Technology |
Principal Investigator |
MASU Kazuya Tokyo Institute of Technology, Integrated Research Institute, Professor (20157192)
|
Co-Investigator(Kenkyū-buntansha) |
ITO Hiroyuki Tokyo Institute of Technology, Precision and Intelligent Laboratory, Assistant Professor (40451992)
SATO Takashi Tokyo Institute of Technology, Integrated Research Institute, Professor (20431992)
AMAKAWA Shuhei Tokyo Institute of Technology, Integrated Research Institute, Assistant Professor (40431994)
ISHIDA Koichi Tokyo Institute of Technology, Integrated Research Institute, Assistant Professor (30431993)
|
Project Period (FY) |
2004 – 2007
|
Keywords | transmission line / integrated cirtcuit / nano interconnect / high speed signal propagation / low power consumption / system on chip / network on chip / wire length distribution |
Research Abstract |
Si CMOS has been scaled according to the "Scaling Concept" and have achieved high performance, low power consumption, and high functionality. The Si CMOS has become the most important hardware in ubiquitous network. In 2013, hundred million transistors will be integrated on a one chip of 20mm square using 35nm technology and the operating frequency is expected to be over 20GHz. The Si CMOS is progressing toward Nano Scale era. In this work, the signal propagation is recognized to be just communication, and we have developed global wiring technology. The novel analytic expression has been derived for wire length distribution ; the wire length distribution and cumulative number of interconnects of real 130nm and 90nm CMOS chip are well expressed by our new model. We have developed global wiring technology based on differential transmission line ; 0.27pJ/bit transmission has been successfully achieved on 1cm long interconnect, and mutli drop transmission line interconnect has been also developed for future network on-chip technology. Furthermore, novel FoM (Figure of Merit) has been proposed to compare the performance of various interconnects ; the conventional RC line, the RC line using CNT (Carbon Nano Tube), transmission line interconnect which has been developed in this work, optical interconnect, and wireless interconnect. As a results, the FoM of the transmission line interconnect has most superior in the range of several hundred micron to several mm. This means the transmission line has been the best solution for global wiring.
|
Research Products
(212 results)
-
-
-
-
-
-
[Journal Article] A Bidirectional- and Multi-Drop-Transmission-Line Interconnect for Multipoint-to-Multipoint On-Chip Communications2008
Author(s)
Hiroyuki, Ito, Makoto, Kimura, Kazuya, Washita, Takahiro, Ishii, Kenichi, Okada, Kazuya, Masu
-
Journal Title
IEEE Journal of Solid-State Circuits Vol. 43, No. 4
Pages: 1020-1029
Description
「研究成果報告書概要(欧文)」より
-
-
-
-
-
-
[Journal Article] On-Chip Yagi-Uda Antenna for Horizontal Wireless Signal Transmission in Stacked Multi Chip Packaging2007
Author(s)
Kazuma, Ohashi, Tackya, Yammouch, Makoto, Kimura, Hiroyuki, Ito, Kenichi, Okada, Kazuhisa, Itoi, Masakazu, Sato, Tatsuya, Ito, Ryozo, Yamauchi, Kazuya, Masu
-
Journal Title
Japanese Journal of Applied Physics Vol.46, No 4B
Pages: 2283-2286
Description
「研究成果報告書概要(欧文)」より
-
-
[Journal Article] Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology2007
Author(s)
Hiroyuki, Ito, Hideyuki, Sugita, Kenichi, Okada, Tatsuya, Ito, Kazuhisa, Itoi, Masakazu, Sato, Ryozo, Yamauchi, Kazuya, Masu
-
Journal Title
IEICE Transactions on Electronics Vol. E90-C, No.3
Pages: 641-643
Description
「研究成果報告書概要(欧文)」より
-
-
-
-
-
-
-
-
-
[Journal Article] On-Chip High-Q Variable Inductor Using Wafer-Level Chip-Scale Package Technology2006
Author(s)
Kenichi, Okada, Hirotaka, Sugawara, Hiroyuki, Ito, Kazuhisa, Itoi, Masakazu, Sato, Hiroshi, Abe, Tatsuya, Ito, Kazuya, Masu
-
Journal Title
IEEE Transactions on Electron Devices Vol. 53, No. 9
Pages: 2401-2406
Description
「研究成果報告書概要(欧文)」より
-
-
[Journal Article] Zero-Crosstalk Bus Line Structure for Global Interconnects in Si Ultra Large Scale Integration2006
Author(s)
Makoto, Kimura, Hiroyuki, Ito, Hideyuki, Sugita, Kenichi, Okada, Kazuya, Masu
-
Journal Title
Japanese Journal of Applied Physics Vol. 45, No. 6A
Pages: 4977-4981
Description
「研究成果報告書概要(欧文)」より
-
[Journal Article] Optimization Methodology of Layer Numbers with Circuit/Process Co-design2006
Author(s)
Takanori, Kyogoku, Junpei, Inoue, Hidenari, Nakashima, Takumi, Uezono, Kenichi, Okada, Kazuya, Masu
-
Journal Title
Japanese Journal of Applied Physics Vol. 45, No. 4A
Pages: 2476-2480
Description
「研究成果報告書概要(欧文)」より
-
-
-
-
-
-
-
-
-
-
[Journal Article] Evaluation of X Architecture Using Interconnect Length Distribution2005
Author(s)
Hidenari, Nakashima, Naohiro, Takagi, Junpei, Inoue, Kenichi, Okada, Kazuya, Masu
-
Journal Title
IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences Vol. E88-A, No. 12
Pages: 3437-3444
Description
「研究成果報告書概要(欧文)」より
-
[Journal Article] Wire Length Distribution Model for System LSI2005
Author(s)
Takanori Kyogoku, Junpei Inoue, Hidenari Nakashima, Takumi Uezono, Kenichi Okada, Kazuya Masu
-
Journal Title
IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences Vol. E88-A, No 12
Pages: 3445-3452
Description
「研究成果報告書概要(欧文)」より
-
-
-
-
-
-
-
-
-
-
-
-
[Presentation] LVDS-type On-Chip Transmision Line Interconnect with Passive Equalizers in 90 nm CMOS Process2008
Author(s)
Akiko, Mineyama, Hiroyuki, Ito, Takahiro, Ishii, Kenichi, Okada, Kazuya, Masu
Organizer
IEEE/ACM Asia and South Pacific Design Automation Conference (University LSI Design Contest)
Place of Presentation
Seoul, Korea
Year and Date
2008-01-22
Description
「研究成果報告書概要(欧文)」より
-
[Presentation] Small-Area CMOS RF Distributed Mixer Using Multi-Port Inductors2008
Author(s)
Susumu, Sadoshima, Satoshi, Fukuda, Tackya, Yammouch, Hiroyuki, Ito, Kenichi, Okada, Kazuya, Masu
Organizer
IEEE/ACM Asia and South Pacific Design Automation Conference (University LSI Design Contest)
Place of Presentation
Seoul, Korea
Year and Date
2008-01-22
Description
「研究成果報告書概要(欧文)」より
-
-
-
-
[Presentation] A Low-Power Low-Phase-Noise CMOS VCO using RF SiP Technology2007
Author(s)
K. Ohashi, Y. Ito, H. Ito, K. Okada, H. Hatakeyama, N. Ozawa, M. Sato, T. Aizawa, T. Ito, R. Yamauchi, and K. Masu
Organizer
Asia-Pacific Microwave Conference(APMC)
Place of Presentation
Bangkok, Thailand
Year and Date
2007-12-14
Description
「研究成果報告書概要(和文)」より
-
[Presentation] A Low-Power Low-Phase-Noise CMOS VCO using RF SiP Technology2007
Author(s)
Kazuma, Ohashi, Yusaku, Ito, Hiroyuki, Ito, Kenichi, Okada, Hideki, Hatakeyama, Naoyuki, Ozawa, Masakazu, Sato, Takuya, Aizawa, Tatsuya, Ito, Ryozo, Yamauchi, Kazuya, Masu
Organizer
Asia-Pacific Microwave Conference (APMC)
Place of Presentation
Bangkok, Thailand
Year and Date
2007-12-14
Description
「研究成果報告書概要(欧文)」より
-
-
-
-
[Presentation] A 5.2GHz CMOS Low Noise Amphfier with High-Q Inductors Embedded in Wafer-Level Chip-Scale Package2007
Author(s)
Satoshi, Fukuda, Hiroyuki, Ito, Kazuhisa, Itoi, Masakazu, Sato, Tatsuya, Ito, Ryozo, Yamauchi, Kenichi, Okada, Kazuya, Masu
Organizer
International Workshop on RF Integration Technology (RFIT)
Place of Presentation
Singapore
Year and Date
2007-12-10
Description
「研究成果報告書概要(欧文)」より
-
[Presentation] Wafer-level-packaging inductor with extremely high quality factor and its application to 5.8GHz LC-type voltage controlled oscillator2007
Author(s)
H. Hatakeyama, K. Okada, K. Ohashi, Y. Ito, N. Ozawa, M. Sato, T. Aizawa, T. Ito, R. Yamauchi, and K. Masu
Organizer
Advanced Metallization Conference, Asian Session(ADMETA)
Place of Presentation
Tokyo, Japan
Year and Date
2007-10-24
Description
「研究成果報告書概要(和文)」より
-
-
[Presentation] Wafer-level-packaging inductor with extremely high quality factor and its application to 5.8GHz LC-type voltage controlled oscillator2007
Author(s)
Hideki, Hatakeyama, Kenichi, Okada, Kazuma, Ohashi, Yusaku, Ito, Naoyuki, Ozawa, Masakazu, Sato, Takuya, Aizawa, Tatsuya, Ito, Ryozo, Yamauchi, Kazuya, Masu
Organizer
Advanced Metallization Conference, Asian Session (ADMETA)
Place of Presentation
Tokyo
Year and Date
2007-10-24
Description
「研究成果報告書概要(欧文)」より
-
-
-
-
[Presentation] Wafer-level-packaging inductor with extremely high quality factor and its application to 5.8GHz LC-type voltage controlled oscillator2007
Author(s)
H. Hatakeyama, K. Okada, K. Ohashi, Y. Ito, N. Ozawa, M. Sato, T. Aizawa, T. Ito, R. Yamauchi, and K. Masu
Organizer
Advanced Metallization Conference(AMC)
Place of Presentation
Albany, New York, USA
Year and Date
2007-10-09
Description
「研究成果報告書概要(和文)」より
-
-
-
[Presentation] Wafer-level-packaging inductor with extremely high quality factor and its application to 5.8GHz LC-type voltage controlled oscillator2007
Author(s)
Hideki, Hatakeyama, Kenichi, Okada, Kazuma, Ohashi, Yusaku, Ito, Naoyuki, Ozawa, Masakazu, Sato, Takuya, Aizawa, Tatsuya, Ito, Ryozo, Yamauchi, Kazuya, Masu
Organizer
Advanced Metallization Conference (AMC)
Place of Presentation
Albany, New York
Year and Date
2007-10-09
Description
「研究成果報告書概要(欧文)」より
-
-
-
-
[Presentation] A 0.49-6.50GHz Wideband LC-VCO with High-IRR in a 180 nm CMOS Technology2007
Author(s)
Yuka, Kobayashi, Kazuma, Ohashi, Yusaku, Ito, Hiroyuki, Ito, Kemchi, Okada, Kazuya, Masu
Organizer
International Conference on Solid State Devices and Materials (SSDM)
Place of Presentation
Tukuba
Year and Date
2007-09-08
Description
「研究成果報告書概要(欧文)」より
-
-
-
-
-
-
[Presentation] A Low-Latency and High-Power-Efficient On-Chip LVDS Transmission Line Interconnect for a RC Interconnect Alternative2007
Author(s)
Hiroyuki, Ito, Junki, Salta, Takahiro, Ishii, Hideyuki, Sugita, Kenichi, Okada, Kazuya, Masu
Organizer
IEEE International Interconnect Technology Conference (IITC)
Place of Presentation
San Francisco
Year and Date
2007-06-06
Description
「研究成果報告書概要(欧文)」より
-
-
[Presentation] Design of High-Density Interconnects for High-Speed Transmission2007
Author(s)
Wanlin, Fu, Makoto, Kimura, Kenichi, Okada, Jun, Sakai, Kazuya, Masu
Organizer
The 57th Electronic Components and Technology Conference (ECTC)
Place of Presentation
Reno, Nevada, USA
Year and Date
2007-05-30
Description
「研究成果報告書概要(欧文)」より
-
[Presentation] A MOS transistor-array for accurate measurement of subthreshold leakage variation2007
Author(s)
Takashi, Sato, Takumi, Uezono, Shiho, Hagiwara, Kemchi, Okada, Shuhei, Amakawa, Noriaki, Nakayama, Kazuya, Masu
Organizer
International Symposium on Quality Electronic Design (ISQED)
Place of Presentation
San Jose, California
Year and Date
2007-03-27
Description
「研究成果報告書概要(欧文)」より
-
-
[Presentation] Adaptable wire-length distribution with tunable occupation probability2007
Author(s)
Shuhei, Amakawa, Takumi, Uezono, Takashi, Sato, Kenichi, Okada, Kazuya, Masu
Organizer
International Workshop on System Level Interconnect Prediction (SLIP)
Place of Presentation
Austin, Texas
Year and Date
2007-03-17
Description
「研究成果報告書概要(欧文)」より
-
-
-
-
-
-
[Presentation] A Multi-Drop Transmission-Line Interconnect in Si LSI2007
Author(s)
Junki, Seita, Hiroyuki, Ito, Kenichi, Okada, Takashi, Sato, Kazuya, Masu
Organizer
Asia and South Pacific Design Automation Conference
Place of Presentation
Yokohama, Japan
Year and Date
2007-01-24
Description
「研究成果報告書概要(欧文)」より
-
-
[Presentation] Wideband CMOS LC-VCO Using Variable Inductor2007
Author(s)
Kazuma, Ohashi, Yusaku, Ito, Yoshiaki, Yoshihara, Kenichi, Okada, Kazuya, Masu
Organizer
Asia and South Pacific Design Automation Conference
Place of Presentation
Yokohama, Japan
Year and Date
2007-01-24
Description
「研究成果報告書概要(欧文)」より
-
-
-
-
-
[Presentation] On-Chip Yagi Antenna for Wireless Signal Transmission in Stacked MCP,2006
Author(s)
K. Ohashi, T. Yammouch, M. Kimura, H. Ito, K. Okada, K. Ishida, K. Itoi, M. Sato, T. Ito, and K. Masu
Organizer
International Conference on Solid State Devices and Materials(SSDM)
Place of Presentation
Yokohama
Year and Date
20060913-15
Description
「研究成果報告書概要(和文)」より
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
[Presentation] A 6.5-mW 5-Gbps On-Chip Differential Transmission Line Interconnect with a Low-Latency Asymmetric Tx in a 180nm CMOS Technology2006
Author(s)
Takahiro, shuii, Hiroyuki, Ito, Makoto, Kimura, Kenichi, Okada, Kazuya, Masu
Organizer
IEEE Asian Solid-State Circuits Conference (A-SSCC)
Place of Presentation
Hangzhou, China
Year and Date
2006-11-14
Description
「研究成果報告書概要(欧文)」より
-
-
-
-
-
-
-
-
[Presentation] On-Chip Yagi Antenna for Wireless Signal Transmission in Stacked MCP2006
Author(s)
Kazuma, Ohashi, Tackya, Yammouch, Makoto, Kimura, Hiroyuki, Ito, Kenichi, Okada, Koichi, Ishida, Kazuhisa, Itoi, Masakazu, Sato, Tatsuya, Ito, Kazuya, Masu
Organizer
International Conference on Solid State Devices and Materials (SSDM)
Place of Presentation
Yokohama
Year and Date
2006-09-13
Description
「研究成果報告書概要(欧文)」より
-
-
-
[Presentation] High-Crosstalk Robustness Transmission Line Interconnect in Si LSI using Zero-Crosstalk Structure2006
Author(s)
Makoto, Kimura, Hiroyuki, Ito, Hideyuki, Sugita, Kenichi, Okada, Kazuya, Masu
Organizer
IEEE Workshop on Signal Propagation on Interconnects (SPI)
Place of Presentation
Berhn-Mitte, Germany
Year and Date
2006-05-12
Description
「研究成果報告書概要(欧文)」より
-
-
-
-
-
-
-
[Presentation] Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology for One-Chip Wireless Communication Circuits2006
Author(s)
Junki, Seita, Hiroyuki, Ito, Hideyuki, Sugita, Kenichi, Okada, Tatsuya, Ito, Kazuhisa, Itoi, Masakazu, Sato, Kazuya, Masu
Organizer
IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems
Place of Presentation
San Diego
Year and Date
2006-01-18
Description
「研究成果報告書概要(欧文)」より
-
-
-
-
-
-
-
-
-
-
-
[Presentation] A Reconfigurable RF Circuit Architecture for Dynamic Power Reduction2005
Author(s)
Daisuke, Kawazoe, Hirotaka, Sugawara, Takeshi, Ito, Kenichi, Okada, Kazuya, Masu
Organizer
IEEE International Region 10 Conference, Melbourne
Place of Presentation
Australia
Year and Date
2005-11-24
Description
「研究成果報告書概要(欧文)」より
-
[Presentation] A 1. 3-2. 8 GHz Wide Range CMOS LC-VCO Using Variable Inductor2005
Author(s)
Yusaku, Ito, Yoshiaki, Yoshihara, Hirotaka, Sugawara, Kenichi, Okada, Kazuya, Masu
Organizer
IEEE Asian Solid-State Circuits Conference
Place of Presentation
Hsinchu, Taiwan
Year and Date
2005-11-02
Description
「研究成果報告書概要(欧文)」より
-
-
-
-
-
-
-
[Presentation] High-Density Differential Transmission Line Bus Structure for 65nm Technology2005
Author(s)
Makoto, Kimura, Hiroyuki, Ito, Hideyuki, Sugita, kenichi, Okada, Kazuya, Masu
Organizer
Advanced Metallization Conference 2005 (AMC)
Place of Presentation
Colorado Springs, Colorado
Year and Date
2005-09-27
Description
「研究成果報告書概要(欧文)」より
-
-
-
-
-
-
-
[Presentation] Wire Length Distribution Model Considering Core Utilization for System on Chip2005
Author(s)
Takanori, Kyogoku, Junpei, Inoue, Hidenari, Nakashima, Takumi, Uezono, Kenichi, Okada, Kazuya, Masu
Organizer
IEEE Computer Society Annual Symposium on VLSI
Place of Presentation
Tampa, Florida
Year and Date
2005-05-11
Description
「研究成果報告書概要(欧文)」より
-
-
-
-
-
-
-
-
-
-
[Presentation] Evaluation of On-Chip Transmission Line Interconnect Using Wire Length Distribution2005
Author(s)
Junpei, Inoue, Hiroyuki, Ito, Shinichiro, Gomi, Takanori, Kyogoku, Takumi, Uezono, Kenichi, Okada, Kazuya, Masu
Organizer
IEEE/ACM Asia South Pacific Design Automation Conference
Place of Presentation
Shanghai, China
Year and Date
2005-01-19
Description
「研究成果報告書概要(欧文)」より
-
-
-
[Presentation] High Density Bus Line Structure With Pseudo Differential Transmission Line in Si ULSI2004
Author(s)
Hiroyuki, Ito, Shinichiro, Gomi, Hideyuki, Sugita, Kenichi, Okada, Kazuya, Masu
Organizer
IEEE Asia-Pacific Microwave Conference
Place of Presentation
Delhi, India
Year and Date
2004-12-17
Description
「研究成果報告書概要(欧文)」より
-
-
-
[Presentation] On-Chip Transmission Line for Long Global Interconnects2004
Author(s)
Hiroyuki, Ito, Junpei, Inoue, Shinichiro, Gomi, Hideyuki, Sugita, Kenichi, Okada, Kazuya, Masu
Organizer
IEEE International Electron Devices Meeting (IEDM)
Place of Presentation
San Francisco
Year and Date
2004-12-15
Description
「研究成果報告書概要(欧文)」より
-
-
[Presentation] Optimization Methodology of Global Interconnect Structure2004
Author(s)
Junpei, Inoue, Hidenari, Nakashima, Takanori, Kyogoku, Takumi, Uezono, Kenichi, Okada, Kazuya, Masu
Organizer
International Conference on Microelectronics
Place of Presentation
Tunis
Year and Date
2004-12-07
Description
「研究成果報告書概要(欧文)」より
-
-
[Presentation] High Speed and Low Power On-Chip Micro Network Circuit with Differential Transmission Line2004
Author(s)
Shinichiro, Gomi, Kohichi, Nakamura, Hiroyuki, Ito, Hideyuki, Sugita, Kenichi, Okada, Kazuya, Masu
Organizer
International Symposium on System-on-Chip, Tampere
Place of Presentation
Finland
Year and Date
2004-11-18
Description
「研究成果報告書概要(欧文)」より
-
-
-
-
-
[Presentation] Wire Length Distribution of SoC considering Macro Block Shapes2004
Author(s)
Takanori, Kyogoku, Hidenari, Nakashima, Junpei, Inoue, Naohiro, Takagi, Hiyouko, Shinoki, Kenichi, Okada, Kazuya, Masu
Organizer
The Workshop on Synthesis And System Integration of Mixed Information Technologies
Place of Presentation
Kanazawa
Year and Date
2004-10-19
Description
「研究成果報告書概要(欧文)」より
-
[Presentation] Dynamic Reconfigurable RF Circuit Design2004
Author(s)
Kenichi, Okada, Yoshiaki, Yoshihara, Hirotaka, Sugawara, Kazuya, Masu
Organizer
The Workshop on Synthesis And System Integration of Mixed Information Technologies
Place of Presentation
Kanazawa
Year and Date
2004-10-19
Description
「研究成果報告書概要(欧文)」より
-
-
-
-
[Presentation] Differential Transmission Line Interconnect for High Speed and Low Power Global Wiring2004
Author(s)
Shinichiro, Gomi, Kohichi, Nakamura, Hiroyuki, Ito, Kenichi, Okada, Kazuya, Masu
Organizer
IEEE Custom Integrated Circuits Conference
Place of Presentation
Orland, Florida
Year and Date
2004-10-05
Description
「研究成果報告書概要(欧文)」より
-
-
-
-
[Presentation] CVS-Al/PVD-Al Flow Technology for Large Aspect Ratio Contact Hole Filling in Si ULSI Multilevel Interconnection2004
Author(s)
Kazuya, Masu, Manabu, Sakamoto, Masanobu, Hatanaka, Michio, Ishikawa, Yuji, Furumura
Organizer
Proceedings of the Seventh China-Japan Symposium on Thin Films
Place of Presentation
Chengdu, China
Year and Date
2004-09-20
Description
「研究成果報告書概要(欧文)」より
-
-
-
-
-
-
-
[Presentation] Twisted Differential Transmission Line Structure for EMI Noise Reduction at Global Interconnect in Si LSI2004
Author(s)
Hiroyuki, Ito, Shinichiro, Gomi, Hideyuki, Sugita, Kenichi, Okada, Kazuya, Masu
Organizer
International Conference on Solid State Devices and Materials, Funabori
Year and Date
2004-09-16
Description
「研究成果報告書概要(欧文)」より
-
[Presentation] High-Speed Transmission Circuit for Micro Network on Si ULSI2004
Author(s)
Shinichiro, Gomi, Kohichi, Nakamura, Hiroyuki, Ito, Hideyuki, Sugita, Kenichi, Okada, Kazuya, Masu
Organizer
International Conference on Solid State Devices and Materials, Funabori
Year and Date
2004-09-16
Description
「研究成果報告書概要(欧文)」より
-
[Presentation] in-vivo Wireless Communication System for Bio MEMS Sensors2004
Author(s)
Kenichi, Okada, Tomohiro, Yamada, Takumi, Uezono, Kazuya, Masu, Akio, Oki, Yasuhiro, Horiike
Organizer
International Conference on Solid State Devices and Materials, Funabori
Year and Date
2004-09-16
Description
「研究成果報告書概要(欧文)」より
-
[Presentation] Optimization Technique of Number of Interconnect Layers and Circuit Area Based on Wire Length Distribution2004
Author(s)
Takanori, Kyogoku, Junpei, Inoue, Hidenari, Nakashima, Kenichi, Okada, Kazuya, Masu
Organizer
International Conference on Solid State Devices and Materials, Funabori
Year and Date
2004-09-16
Description
「研究成果報告書概要(欧文)」より
-
-
-
[Presentation] High-Q Variable Inductor Using Redistributed Layers for Si RF Circuits2004
Author(s)
Hirotaka, Sugawara, Hiroyuki, Ito, Kenichi, Okada, Kazuhisa, Itoi, Masakazu, Sato, Hiroshi, Abe, Kazuya, Masu
Organizer
IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems
Place of Presentation
Atlanta
Year and Date
2004-09-08
Description
「研究成果報告書概要(欧文)」より
-
-
-
-
-
-
-
[Presentation] A Wide Tunable LC-VCO using Variable Inductor2004
Author(s)
Yoshiaki, Yoshihara, Hirotaka, Sugawara, Hiroyuki, Ito, Kenichi, Okada, Kazuya, Masu
Organizer
Workshop on Wireless Circuits and Systems, Vancouver
Place of Presentation
Canada
Year and Date
2004-05-21
Description
「研究成果報告書概要(欧文)」より
-