2006 Fiscal Year Final Research Report Summary
Restorative method for reducing polymerization contraction stress of resin composite restorations
Project/Area Number |
16591907
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Research Category |
Grant-in-Aid for Scientific Research (C)
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Allocation Type | Single-year Grants |
Section | 一般 |
Research Field |
Conservative dentistry
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Research Institution | Tokyo Medical and Dental University |
Principal Investigator |
YOSHIKAWA Takako Tokyo Medical and Dental University, Dept.of Restorative Sciences, Instructor, 大学院医歯学総合研究科, 助手 (00182733)
|
Project Period (FY) |
2004 – 2006
|
Keywords | polymerization / contraction / resin composite / curing method / marginal leakage / cavity wall adaptation |
Research Abstract |
Light-cured resin-based composites are widely used in clinical practice because of the esthetic advantages, ease of use, excellent bonding to tooth structure, and improved mechanical properties. However, the polymerization reaction of light-cured resin composites is faster than that of self-cured composites, which creates more gaps between the resin and cavity wall/floor than self-cured resin composites. The combination of a flexible adhesive such as Super-Bond D-Liner and the slow-start curing method would seem to be effective in enhancing marginal sealing and cavity wall adaptation even at short irradiation times. A flowable composite restoration in association with filled adhesive significantly increased marginal sealing and wall adaptation compared with unfilled adhesive. Increased C-factor contributes to negative effects on the bonded interface of an unfilled adhesive system such as Single adhesive. Increased C-factor contributes to negative effects on the bonded interface of an unfilled adhesive system such as Single Bond compared with a filled system such as Clearfil SE Bond system. To evaluate the correlation between bond strength and cavity wall adaptation. There was a poor correlation between bond strength and cavity wall adaptation. It would seem that the self-etch, filled adhesive system Clearfil SE Bond may afford some advantages with respect to attaining more reliable sealing and adaptation of resin composite to the cavity wall compared with total-etch, unfilled adhesive system Single bond regardless of composite type under thermal stress conditions.
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Research Products
(6 results)