2016 Fiscal Year Annual Research Report
Ultra-Flexible "Ionic E-Skin" for Direct Communication Between Biological Systems and Electronics
Project/Area Number |
16F16348
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Research Institution | The University of Tokyo |
Principal Investigator |
染谷 隆夫 東京大学, 大学院工学系研究科(工学部), 教授 (90292755)
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Co-Investigator(Kenkyū-buntansha) |
ORDINARIO DAVID 東京大学, 大学院工学系研究科(工学部), 外国人特別研究員
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Project Period (FY) |
2016-11-07 – 2019-03-31
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Keywords | Bioelectronics / Ionic Sensing / Biological Sensing / Chemical Sensing / E-Skin / Organic Electronics / Flexible Electronics |
Outline of Annual Research Achievements |
The goal of the research project is to develop a new type of “e-skin” (referred to hereafter as ionic e-skin) that can bridge the gap between electronic and biological systems. The project commenced with the evaluation and testing of various materials for integration with flexible substrates. Currently, the project is still in its initial phases and has not had time to progress very far. Thus, as of now there are no published works (journals, books, conference proceedings, etc) resulting from the project. However, once material evaluation and selection has concluded the materials will next be integrated with flexible substrates. Once this happens, at least one journal publication can be expected from the project.
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Current Status of Research Progress |
Current Status of Research Progress
2: Research has progressed on the whole more than it was originally planned.
Reason
Presently, the research is focused on evaluating various materials for use with the flexible substrates that current “e-skins” are fabricated from. At the time of writing, materials as diverse as conducting polymers, inorganic thin films, and organic thin films have all been evaluated. Parameters that the materials are evaluated on include (but are not limited to): electrical properties, optical properties, mechanical properties, and biocompatibility. Once all possible candidates have been investigated, the best materials will be selected. In summary, the current research plan is proceeding as expected.
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Strategy for Future Research Activity |
Following the materials selection phase, the next step will be to integrate the best materials with ultra-flexible substrates. This is necessary due to the fact that current “e-skins” are inherently mechanically flexible; any materials that would be used to augment their functionality must therefore also be at least as mechanically flexible. This step will involve taking the selected materials, combining them with ultra-flexible substrates, and optimizing the resulting combination in such a manner where the performance of the integrated materials will be preserved as much as possible. Once this is accomplished, the next step will be to integrate the material with current “e-skins” in order to augment their functionality for ionic/biological/chemical sensing applications.
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