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2017 Fiscal Year Annual Research Report

Establishment of Scientific Basis of the Strength and Reliability of Materials Based on the Order of Atom Arrangement and Its Application to the Explication of the Degradation Process of Materials

Research Project

Project/Area Number 16H06357
Research InstitutionTohoku University

Principal Investigator

三浦 英生  東北大学, 工学研究科, 教授 (90361112)

Co-Investigator(Kenkyū-buntansha) 鈴木 研  東北大学, 工学研究科, 准教授 (40396461)
Project Period (FY) 2016-05-31 – 2021-03-31
Keywords機械材料・材料力学 / ナノマイクロ材料力学 / 材料損傷 / 原子拡散 / 結晶粒界品質
Outline of Annual Research Achievements

本年度は前年度開発した微細組織変化観察システムを用いた高温強度試験システムを完成させた.大気中あるいは様々なガス環境中で微小試験片を用いた高温疲労・クリープ試験を実施できる実験システムを開発した.微小試験片は電子顕微鏡観察室内に導入可能なサイズとした.試験片サイズを小さくすることで様々な負荷状態を容易に制御できることが期待される.試験片の温度は赤外線集中加熱炉を応用することで室温から1100℃まで制御可能である.治工具をセラミック化することで更なる高温環境下での実験も可能になるものと考えている.
本強度試験システムを開発する最大の利点は,高温高負荷環境における組織変化をIn-situで観察でき,試験中の応力ひずみ状態もモニタできるので,任意の損傷状態で試験を停止することが可能であり,電子顕微鏡観察と合わせ体系的,系統的な試験評価が可能になることである.特に今後の耐熱合金使用環境の過酷化(高温,高負荷)を考えると,これまでの安定亀裂成長域における亀裂進展速度評価に基づく寿命評価は困難になることが容易に想定され,亀裂の発生から急速破断に至る破壊現象が多発することが懸念される.亀裂の発生,言い換えると材料の初期損傷過程において,これまで述べてきたような強化組織の崩壊(消失)を伴う微細組織変化が関与する場合には,材料の初期強度評価に基づく寿命設計,評価は極論すると意味がなくなる.したがって,主要合金の500℃以上の高温高負荷環境における強化機構(主として分散析出強化組織)の変化の有無を定量的に解明することは,各種機器の安全安心運転,長期信頼性維持による機器ライフコストの削減には必要不可欠である.本微細組織変化,主要構成元素拡散可視化機能を有する高温材料強度評価システムの開発は,今後の材料強度研究における新たな基盤技術になるものと確信している.

Current Status of Research Progress
Current Status of Research Progress

2: Research has progressed on the whole more than it was originally planned.

Reason

当初予定通り微細組織変化観察システムを用いた高温強度試験システムを完成させた.大気中あるいは様々なガス環境中で微小試験片を用いた高温疲労・クリープ試験を実施できる実験システムを開発した.微小試験片は電子顕微鏡観察室内に導入可能なサイズである.試験片サイズを小さくすることで様々な負荷状態を容易に制御できることが期待される.試験片の温度は赤外線集中加熱炉を応用することで室温から1100℃まで制御可能である.本強度試験システムを開発する最大の利点は,高温高負荷環境における組織変化をIn-situで観察でき,試験中の応力ひずみ状態もモニタできるので,任意の損傷状態で試験を停止することが可能であり,電子顕微鏡観察と合わせ体系的,系統的な試験評価が可能になることである.
本開発設備を応用し,各種耐熱合金の劣化損傷支配メカニズムが機械的応力と温度の重畳作用による異方的原子増速拡散現象に基づく微視組織変化であることを実証し,国内外の学会等で公表し高い評価を受けている.代表的な受賞は,科学技術分野の文部科学大臣賞,米国電気電子学会(IEEE)のBest Student Paper Award,日本機械学会大学院学生独創研究賞などである.
以上の研究進捗状況から,概ね順調に進展していると判断した.

Strategy for Future Research Activity

次年度は開発した試験システムを活用して,今後応用が期待される各種耐熱合金の高温高負荷環境における材料初期損傷評価に取り組む.代表的な材料としてはNi基超合金,Cr-Mo鋼等を候補材料として考えている.これらの材料は分散析出強化組織からなるもので,その強化組織の崩壊過程の解明は,各種エネルギー機器,化学プラント,航空宇宙機器等の安全安心確保には必須課題である.高温域における疲労限の消失は,機器の長期信頼性設計においては深刻な課題であり,現象の定量的な解明と使用環境の制御指針の構築は最重要課題と言ってよい.これまで材料の寿命評価は前述したように亀裂進展速度に注目した研究が集中的になされており,初期損傷に関しては体系的な研究はほとんどなされていない. 特に使用環境における強化組織の消失は想定されていない.高温高負荷環境では,亀裂の発生が急速破断に到る危険性が極めて高く,安定亀裂成長域が全寿命に占める割合は非常に小さくなるものと考えている.したがって,亀裂の発生までの初期損傷過程が全寿命を支配することになり,この初期損傷過程の支配メカニズムの解明は早急に実現する必要がある.原子の拡散経路として結晶粒界の存在は知られているが,この粒界拡散は粒界の品質によって局所的に著しい分布が存在していることを明らかにした.結晶粒界において表面粗さが著しく変化している状況が明らかであり,かつその変動幅には局所的に大きな相違がある.この相違は結晶粒界の品質に起因しているものと申請者等は考えており,その仮説を本実験システムで実証していきたいと考えている.

  • Research Products

    (33 results)

All 2018 2017 Other

All Int'l Joint Research (1 results) Journal Article (7 results) (of which Peer Reviewed: 7 results,  Open Access: 7 results) Presentation (23 results) (of which Int'l Joint Research: 23 results,  Invited: 6 results) Remarks (1 results) Funded Workshop (1 results)

  • [Int'l Joint Research] 北京科学技術大学/Tsinghua University(中国)

    • Country Name
      CHINA
    • Counterpart Institution
      北京科学技術大学/Tsinghua University
  • [Journal Article] Stress-Induced Change of the Microstructure and Strength of Modified 9Cr-1Mo Steel Under Fatigue and Creep Loadings at Elevated Temperatures2017

    • Author(s)
      Taichi Shinozaki, Ken Suzuki, Hideo Miura
    • Journal Title

      ASME 2017 International Mechanical Engineering Congress and Exposition

      Volume: 9 Pages: V009T12A070; 7

    • DOI

      10.1115/IMECE2017-70494

    • Peer Reviewed / Open Access
  • [Journal Article] Mechanical Stress Monitoring Sensor for 3-D Module During Manufacturing and Operation2017

    • Author(s)
      Koki Isobe, Ken Suzuki and Hideo Miura
    • Journal Title

      ASME 2017 International Mechanical Engineering Congress and Exposition

      Volume: 10 Pages: V010T13A015; 7

    • DOI

      V009T12A070; 7

    • Peer Reviewed / Open Access
  • [Journal Article] Crystallinity-Induced Variation of the Yield Strength of Electroplated Copper Thin Films2017

    • Author(s)
      Yifan Luo, Kunio Tei, Ken Suzuki, Hideo Miura
    • Journal Title

      ASME 2017 International Mechanical Engineering Congress and Exposition

      Volume: 9 Pages: V009T12A034; 7

    • DOI

      10.1115/IMECE2017-70302

    • Peer Reviewed / Open Access
  • [Journal Article] Largely Deformable and Highly Sensitive Strain Sensor Using Carbon Nanomaterials2017

    • Author(s)
      Kanji Yumoto, Ken Suzuki and Hideo Miura
    • Journal Title

      ASME 2017 International Mechanical Engineering Congress and Exposition

      Volume: 10 Pages: V010T13A024; 6

    • DOI

      10.1115/IMECE2017-70388

    • Peer Reviewed / Open Access
  • [Journal Article] Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections2017

    • Author(s)
      Takeru Kato; Ken Suzuki; Hideo Miura
    • Journal Title

      Journal of Electronic Packaging

      Volume: 139(2) Pages: 020911-1-7

    • DOI

      10.1115/1.4036442

    • Peer Reviewed / Open Access
  • [Journal Article] Highly Sensitive Strain Sensor Using Dumbbell-Shape Graphene Nanoribbon2017

    • Author(s)
      Qinqiang Zhang, Meng Yang, Ken Suzuki and Hideo Miura
    • Journal Title

      ASME 2017 International Mechanical Engineering Congress and Exposition

      Volume: 10 Pages: V010T13A013; 8

    • DOI

      10.1115/IMECE2017-70318

    • Peer Reviewed / Open Access
  • [Journal Article] Degradation of the Strength of Grains and Grain Boundaries of Ni-Base Superalloy under Creep and Creep-Fatigue Loadings2017

    • Author(s)
      Takuya Murakoshi, Hayato Sakamoto, Taichi Shinozaki, Ken Suzuki and Hideo Miura
    • Journal Title

      Key Engineering Materials

      Volume: 754 Pages: 31-34

    • Peer Reviewed / Open Access
  • [Presentation] Variation of the Strength of a Grain and a Grain Boundary Caused by Atomic-Scale Crystallinity2018

    • Author(s)
      Hideo Miura
    • Organizer
      1st CityU-TU Joint Workshop on Advanced Materials and Manufacture
    • Int'l Joint Research / Invited
  • [Presentation] Atomic-scale structural control of Graphene nano-ribbon for smart sensor applications2017

    • Author(s)
      Hideo Miura
    • Organizer
      2nd Inteanational Nanotechnology Conference & Expo
    • Int'l Joint Research / Invited
  • [Presentation] Local Crystallinity-Induced Deterioration of the Lifetime of Thin-Film Interconnections2017

    • Author(s)
      Hideo Miura
    • Organizer
      IEEE International Interconnect Technology Conference
    • Int'l Joint Research / Invited
  • [Presentation] ATOMIC SCALE DEGRADATION OF THE INITIAL STRENGTHENED MICRO TEXTURE OF HEAT-RESISTANT ALLOYS UNDER CREEP AND FATIGUE LOADINGS2017

    • Author(s)
      Miura H
    • Organizer
      14th International Conference on Fracture
    • Int'l Joint Research / Invited
  • [Presentation] Evaluation of atomic scale damages of advanced materials based on the order of atom arrangement2017

    • Author(s)
      Hideo Miura
    • Organizer
      11th International Conference on Advanced Materials and Processing, Research & Reviews
    • Int'l Joint Research / Invited
  • [Presentation] Lifetime Estimation of Thin-Film Interconnections Based on Their Crystallinity2017

    • Author(s)
      Hideo Miura
    • Organizer
      19th International Conference on Electronics Materials and Packaging
    • Int'l Joint Research / Invited
  • [Presentation] Effect of the crystallinity on the grain boundary diffusion of copper atoms in electroplated copper thin-film interconnections2017

    • Author(s)
      K.Suzuki
    • Organizer
      SOLID STATE DEVICES AND MATERIALS
    • Int'l Joint Research
  • [Presentation] STRESS-INDUCED ACCELERATION OF THE CHANGE OF MICROSTRUCTURE OF NI-BASE SUPERALLOY CM247LC2017

    • Author(s)
      Ken Suzuki
    • Organizer
      ASME2017 International Mechanical Engineering Congress and Exposition
    • Int'l Joint Research
  • [Presentation] EVALUATION OF DAMAGE EVOLUTION IN NICKEL-BASE HEAT-RESISTANT ALLOY UNDER CREEP-FATIGUE LOADING CONDITIONS2017

    • Author(s)
      Ken Suzuki
    • Organizer
      International Mechanical Engineering Congress and Exposition
    • Int'l Joint Research
  • [Presentation] Crystallinity-Induced Variation of the Yield Strength of Electroplated Copper Thin Films2017

    • Author(s)
      Yifan Luo
    • Organizer
      ASME2017 International Mechanical Engineering Congress and Exposition
    • Int'l Joint Research
  • [Presentation] CREEP-DAMAGE-INDUCED DETERIORATION OF THE STRENGTH OF NI-BASE SUPERALLOY DUE TO THE CHANGE OF ITS MICROSTRUCTURE2017

    • Author(s)
      Hayato Sakamoto
    • Organizer
      ASME2017 International Mechanical Engineering Congress and Exposition
    • Int'l Joint Research
  • [Presentation] HIGHLY SENSITIVE STRAIN SENSOR USING DUMBBELL-SHAPE GRAPHENE NANORIBBON2017

    • Author(s)
      Qinqiang Zhang
    • Organizer
      ASME2017 International Mechanical Engineering Congress and Exposition
    • Int'l Joint Research
  • [Presentation] MECHANICAL STRESS MONITORING SENSOR FOR 3-D MODULE DURING MANUFACTURING AND OPERATION2017

    • Author(s)
      Koki Isobe
    • Organizer
      ASME2017 International Mechanical Engineering Congress and Exposition
    • Int'l Joint Research
  • [Presentation] LARGELY DEFORMABLE AND HIGHLY SENSITIVE STRAIN SENSOR USING CARBON NANOMATERIALS2017

    • Author(s)
      Kanji Yumoto
    • Organizer
      ASME2017 International Mechanical Engineering Congress and Exposition
    • Int'l Joint Research
  • [Presentation] STRESS-INDUCED CHANGE OF THE MICROSTRUCTURE AND STRENGTH OF MODIFIED 9CR-1MO STEEL UNDER FATIGUE AND CREEP LOADINGS AT ELEVATED TEMPERATURES2017

    • Author(s)
      Taichi Shinozaki
    • Organizer
      International Mechanical Engineering Congress and Exposition
    • Int'l Joint Research
  • [Presentation] Proposal of Highly sensitive pressure sensor using Graphene Nano-Ribbon2017

    • Author(s)
      Zhi Wang
    • Organizer
      19th International Conference on Electronics Materials and Packaging
    • Int'l Joint Research
  • [Presentation] Development of a Flexible and Highly Sensitive Tactile Sensor Using Multi-Walled Carbon Nanotubes2017

    • Author(s)
      Ryusaku Osada
    • Organizer
      19th International Conference on Electronics Materials and Packaging
    • Int'l Joint Research
  • [Presentation] Electronic band structure analyses of dumbbell-shape graphene nanoribbon for highly sensitive and stable strain sensors2017

    • Author(s)
      Qinqiang Zhang
    • Organizer
      19th International Conference on Electronics Materials and Packaging
    • Int'l Joint Research
  • [Presentation] Evaluation of the strength of bicrystal copper structure obtained from electroplated copper thin films2017

    • Author(s)
      Yifan Luo
    • Organizer
      19th International Conference on Electronics Materials and Packaging
    • Int'l Joint Research
  • [Presentation] Development of High-Quality Graphene Nano-Ribbon Fabrication Process for High Sensitivity Strain Sensor2017

    • Author(s)
      Ryohei Nakagawa
    • Organizer
      12th International Microsystems, Packaging, Assembly and Circuits Technology conference
    • Int'l Joint Research
  • [Presentation] Relationship between mechanical properties and micro texture of electroplated gold thin films2017

    • Author(s)
      Yutaro Nakoshi
    • Organizer
      12th International Microsystems, Packaging, Assembly and Circuits Technology conference
    • Int'l Joint Research
  • [Presentation] Crystallinity control of the electroplated copper thin film interconnections for advanced electronic devices2017

    • Author(s)
      Ryota Mizuno
    • Organizer
      2th International Microsystems, Packaging, Assembly and Circuits Technology conference
    • Int'l Joint Research
  • [Presentation] Evaluation of the relationship between the tensile strength of a grain boundary in electroplated copper thin films and the crystallinity of the grain boundary using micro tensile test2017

    • Author(s)
      Guoxiong Zheng
    • Organizer
      12th International Microsystems, Packaging, Assembly and Circuits Technology conference
    • Int'l Joint Research
  • [Remarks] 東北大学 三浦・鈴木研究室

    • URL

      http://www.miura.rift.mech.tohoku.ac.jp

  • [Funded Workshop] 1st CityU-TU Joint Workshop on Advanced Materials and Manufacture2018

URL: 

Published: 2018-12-17   Modified: 2022-04-28  

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