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2018 Fiscal Year Annual Research Report

Establishment of Scientific Basis of the Strength and Reliability of Materials Based on the Order of Atom Arrangement and Its Application to the Explication of the Degradation Process of Materials

Research Project

Project/Area Number 16H06357
Research InstitutionTohoku University

Principal Investigator

三浦 英生  東北大学, 工学研究科, 教授 (90361112)

Co-Investigator(Kenkyū-buntansha) 鈴木 研  東北大学, 工学研究科, 准教授 (40396461)
Project Period (FY) 2016-05-31 – 2021-03-31
Keywords機械材料・材料力学 / ナノマイクロ材料力学 / 材料損傷 / 原子拡散 / 結晶粒界品質
Outline of Annual Research Achievements

多結晶構造材料の高温劣化損傷が,結晶粒界近傍の転位と原子空孔の集積に伴う粒界強度の著しい低下で引き起こされていることを電子顕微鏡観察と量子分子動力学解析で定量的に解明した.特に高温高負荷環境で発生する粒界割れは,負荷と直交する,結晶品質の大きく異なる結晶粒で構成される粒界で発生すること,これは結晶皮質の高い(強度の低い)結晶内で発生した転位が粒界近傍に集積し,結果として発生する大量の原子空孔による強度低下により生じる現象であることを定量的に明らかにした.原子配列の秩序性の評価指標である,電子線後方散乱解析から得られるIQ値と粒界強度の間には明確な正の相関があること,粒界割れが発生する臨界IQ値が材料ごとに存在していることなども定量的に明らかにした.これにより,原子配列の秩序性の定量的評価という新たな概念を材料強度研究に導入することで,材料の劣化損傷の可視化だけでなく,破壊のクライテリアを定量的に解明することができることを耐熱合金のみならず半導体用の配線材料でも確認実証することができた.また,従来活用されてこなかったEBSD分析におけるIQ値の有効利用を実現するための試験片の表面処理および電子顕微鏡の観察条件の最適化手法も確立することで,安定して汎用的に使用できる結晶品質評価手法も確立できた.これらは当初の研究計画を着実に遂行し完成させたもので,当初の研究目標を予定通り完了できたものと考えている.
また,白色光源を用い,材料表面からの反射スペクトル分布を詳細に分析することで,材料表面に存在している元素や酸化物などを同定する技術を開発した.近年開発されたハイパースペクトルカメラを応用することで,材料表面の元素分布を各元素固有の反射スペクトルからサブマイクロメーターの分解能で可視化することに成功した.

Current Status of Research Progress
Current Status of Research Progress

1: Research has progressed more than it was originally planned.

Reason

研究計画調書に記載した当初3年間の研究目標である,光学反射光のスペクトル分析技術を応用した材料表面の原子拡散を伴う組織変化および関連する劣化損傷の可視化技術は,光学系の見直しは発生したものの,当初予定通り完成させることができた.Ni基超合金を対象に,サブマイクロメータオーダーの分散強化組織を大気中で鮮明に観察できることを実証するとともに,主要構成元素ごとの固有スペクトルのデータベース化,各種代表的酸化物の固有スペクトルのデータベース化も完了し,構成元素の異方的拡散現象による微細組織の変化と,酸化による材料組成の変化をサブマイクロメータの空間分解能で,大気中で観察できる技術を確立した.また,塑性変形の進行に伴う材料表面粗さの変化はスペクトルの形状には影響せず,強度のみが単調に変化することも確認したので,材料の劣化損傷に強い影響を持つ,1)微細組織変化,2)酸化物の成長,3)塑性変形の進行等を,反射スペクトルの詳細分析により大気中で観察評価する基本技術を予定通り開発することに成功した.
さらに当初研究計画調書では明確には記載していなかった,本技術の有機材料系への展開について,カーボンナノマテリアルであるカーボンナノチューブやグラフェンの電子物性に及ぼす原子配列の秩序性の乱れ(炭素六員環の変形)の影響を検討したところ,ひずみの作用により電気伝導特性が金属伝導特性から半導体伝導特性の間で周期的に変動することを見出し,新たな超高感度ひずみセンサ開発への展望も拓け,新たな研究課題としての取り組みも始まっている.
研究成果は国内外の学会賞等の受賞や国際学会からの基調講演,招待講演依頼などを通し継続的に高く評価されており,少なくても当初の目標に向けて順調に研究が進展しており、予定どおりの成果が見込まれる,あるいは当初目標以上の成果が期待できる水準で研究活動が推移しているものと考えている.

Strategy for Future Research Activity

今後は開発した原子配列の秩序性変化に基づく各種材料の高温劣化損傷挙動の支配因子メカニズム解明を集中的に推進する.特にNi基超合金において明らかになった特定結晶粒界への原子空孔や転位の異常集積と結果として生じている粒界強度の著しい減少機構を物理化学的に解明し,その劣化挙動を応力(ひずみ)依存の増速拡散現象(活性化エネルギーの低下)という視点から定式化する.本評価手法を他の耐熱合金や半導体デバイス用薄膜配線材料等にも適用し,開発手法の汎用性も実証していく.また計算科学の分野である量子分子動力学解析や第一原理解析なども活用し,単なる実験データベースに止まらず,様々な実働負荷環境で生じる劣化損傷の進行を定量的に予測する評価手法の構築にも挑戦する.従来の疲労損傷とクリープ損傷を独自に規格化し,単純和として評価する線形損傷則では評価できなかった高温クリープ疲労損傷を定量的に評価できる新たな評価手法の構築を目指す.

  • Research Products

    (38 results)

All 2019 2018 Other

All Int'l Joint Research (1 results) Journal Article (11 results) (of which Int'l Joint Research: 2 results,  Peer Reviewed: 11 results,  Open Access: 11 results) Presentation (25 results) (of which Int'l Joint Research: 23 results,  Invited: 6 results) Remarks (1 results)

  • [Int'l Joint Research] 北京科学技術大学/浙江大学(中国)

    • Country Name
      CHINA
    • Counterpart Institution
      北京科学技術大学/浙江大学
  • [Journal Article] Effects of crystallinity on mechanical properties of electroplated gold thin films used for three-dimensional electronic packaging2019

    • Author(s)
      Yutaro Nakoshi, Ken Suzuki and Hideo Miura
    • Journal Title

      Japanese Journal of Applied Physics

      Volume: 58 Pages: SBBC04-1-7

    • DOI

      10.7567/1347-4065/ab00f4

    • Peer Reviewed / Open Access
  • [Journal Article] Degradation of the Strength of a Grain Boundary in Ni-Base Superalloy Under Creep-Fatigue Loading2018

    • Author(s)
      Wataru Suzuki, Akari Sawase, Ken Suzuki, *Hideo Miura
    • Journal Title

      Structural Integrity

      Volume: 5 Pages: 227-232

    • DOI

      10.1007/978-3-319-91989-8_49

    • Peer Reviewed / Open Access
  • [Journal Article] Degradation of the Strength of a Grain and a Grain Boundary due to the Accumulation of the Structural Defects of Crystal2018

    • Author(s)
      Guoxiong Zheng, Yifan Luo and Hideo Miura
    • Journal Title

      Mechanics of Solids, Structures, and Fluids

      Volume: 9 Pages: V012T11A004-1-6

    • DOI

      10.1115/IMECE2018-87264

    • Peer Reviewed / Open Access
  • [Journal Article] Disappearance of Strengthened Micro Texture of Modified 9Cr-1Mo Steel Caused by Stress-Induced Acceleration of Atomic Diffusion at Elevated Temperatures2018

    • Author(s)
      Yifan Luo, Hideo Miura
    • Journal Title

      Mechanics of Solids, Structures, and Fluids

      Volume: 9 Pages: V009T12A055-1-6

    • DOI

      10.1115/IMECE2018-87368

    • Peer Reviewed / Open Access
  • [Journal Article] Disappearance of Martensitic Strengthened-Micro-Texture in Modified 9Cr-1Mo Steel Caused by Stress-Induced Acceleration of Atomic Diffusion at Elevated Temperatures2018

    • Author(s)
      Taichi Shinozaki, Ken Suzuki, and Hideo Miura
    • Journal Title

      Key Engineering Materials

      Volume: 774 Pages: 31-35

    • DOI

      10.4028/www.scientific.net/KEM.774.31

    • Peer Reviewed / Open Access
  • [Journal Article] Crystallinity-Induced Variation of the Electronic Characteristics of Electroplated Gold Thin Films2018

    • Author(s)
      Yutaro Nakoshi, Hideo Miura
    • Journal Title

      Materials: Genetics to Structures

      Volume: 12 Pages: V012T11A005-1-7

    • DOI

      10.1115/IMECE2018-87278

    • Peer Reviewed / Open Access
  • [Journal Article] Coarsening of nanoscale (Ti,Mo)C precipitates in different ferritic matrixes2018

    • Author(s)
      Lei Cheng, Qingwu Cai, Wei Yu, Jinlong Lv, Hideo Miura,
    • Journal Title

      Materials Characterization

      Volume: 142 Pages: 195-202

    • DOI

      10.1016/j.matchar.2018.05.034

    • Peer Reviewed / Open Access / Int'l Joint Research
  • [Journal Article] Area-Arrayed Graphene Nano-Ribbon-Base Strain Sensor2018

    • Author(s)
      Ryohei Nakagawa, Zhi, Wang, Ken Suzuki
    • Journal Title

      Micro- and Nano-Systems Engineering and Packaging

      Volume: 10 Pages: V010T13A008-1-6

    • DOI

      10.1115/IMECE2018-87277

    • Peer Reviewed / Open Access
  • [Journal Article] Development of a Flexible Tactile Sensor Using Area-Arrayed Bundle Structures of Multi-Walled Carbon Nanotubes2018

    • Author(s)
      Ryusaku Osada, Ken Suzuki
    • Journal Title

      Micro- and Nano-Systems Engineering and Packaging

      Volume: 10 Pages: V010T13A002-1-6

    • DOI

      10.1115/IMECE2018-87275

    • Peer Reviewed / Open Access
  • [Journal Article] Superdense microbands strengthening of textured low alloy ferritic steel2018

    • Author(s)
      Lei Cheng, Qingwu Cai, Jinlong Lv, Wei Yu, Hideo Miura,
    • Journal Title

      Journal of Alloys and Compounds

      Volume: 746 Pages: 482-489

    • DOI

      10.1016/j.jallcom.2018.02.297

    • Peer Reviewed / Open Access / Int'l Joint Research
  • [Journal Article] Effect of Defects on the Grain and Grain Boundary Strength in Polycrystalline Copper Thin Films2018

    • Author(s)
      Ken Suzuki, Yiqing Fan, Yifan Lio, Hideo Miura
    • Journal Title

      Simulation of Semiconductor Processes and Devices

      Volume: 2018 Pages: 88-91

    • DOI

      10.1109/SISPAD.2018.8551672

    • Peer Reviewed / Open Access
  • [Presentation] めっき銅薄膜配線の機械特性とEM耐性の結晶粒界品質依存性2019

    • Author(s)
      三浦 英生
    • Organizer
      日本電子情報通信学会シリコン材料・デバイス材料研究会
    • Invited
  • [Presentation] Variation of the Lifetime of Interconnections Due to the Crystallinity of Grain Boundaries in Thin-Film Interconnections2018

    • Author(s)
      Hideo Miura
    • Organizer
      IEEE 20th International Conference on Electronic Materials And Packaging
    • Int'l Joint Research / Invited
  • [Presentation] 原子配列の秩序性に基づく多結晶金属材料強度評価技術の開発とめっき銅薄 膜への応用2018

    • Author(s)
      鈴木 研
    • Organizer
      日本電子情報通信学会シリコン材料・デバイス材料研究会
    • Invited
  • [Presentation] Quantitative Characterization of the Crystallinity of Polycrystalline Materials by Applying Electron Back-Scatter Diffraction2018

    • Author(s)
      Hideo Miura
    • Organizer
      22nd International Conference on Advanced Materials and Nanotechnology
    • Int'l Joint Research / Invited
  • [Presentation] Crystallinity-induced Variation of the Strength of a Grain and a Grain Boundary2018

    • Author(s)
      Hideo Miura
    • Organizer
      EUROPEAN ADVANCED MATERIALS CONGRESS
    • Int'l Joint Research / Invited
  • [Presentation] Degradation of the strength of a grain boundary in Ni-base superalloy under creep-fatigue loading2018

    • Author(s)
      Hideo Miura
    • Organizer
      1st International Conference on Theoretical, Applied, Experimental
    • Int'l Joint Research / Invited
  • [Presentation] Bending Deformation-Induced Drastic Change of the Resistance of Graphene Nano-Ribbons2018

    • Author(s)
      Takuya Kudo, Ken Suzuki, Hideo Miura
    • Organizer
      IEEE 20th International Conference on Electronic Materials And Packaging
    • Int'l Joint Research
  • [Presentation] Strain-induced Change of Electronic Band Structure of Dumbbell-Shape Graphene Nanoribbon2018

    • Author(s)
      Qinqiang Zhang, Ken Suzuki, Hideo Miura
    • Organizer
      IEEE 20th International Conference on Electronic Materials And Packaging
    • Int'l Joint Research
  • [Presentation] Development of a Flexible Tactile Sensor Using Area-Arrayed Bundle Structures of Multi-Walled Carbon Nanotubes2018

    • Author(s)
      Ryusaku Osada, Ken Suzuki
    • Organizer
      ASME International Mechanical Engineering Congress & Exposition,
    • Int'l Joint Research
  • [Presentation] Theoretical Study of Electronic Band Structure of Dumbbell-Shape Graphene Nanoribbons for Highly-Sensitive Strain Sensors2018

    • Author(s)
      Ken Suzuki
    • Organizer
      ASME International Mechanical Engineering Congress & Exposition
    • Int'l Joint Research
  • [Presentation] rea-Arrayed Graphene Nano-Ribbon-Base Strain Sensor2018

    • Author(s)
      Ryohei Nakagawa, Ken Suzuki
    • Organizer
      ASME International Mechanical Engineering Congress & Exposition
    • Int'l Joint Research
  • [Presentation] Photosensitivity of Monolayer Graphene-Base Field Effect Transistor2018

    • Author(s)
      Jowesh A. Goundar, Ken Suzuki, Hideo Miura
    • Organizer
      ASME International Mechanical Engineering Congress & Exposition
    • Int'l Joint Research
  • [Presentation] Disappearance of Strengthened Micro Texture of Modified 9Cr-1Mo Steel Caused by Stress-Induced Acceleration of Atomic Diffusion at Elevated Temperatures2018

    • Author(s)
      Hideo Miura
    • Organizer
      ASME International Mechanical Engineering Congress & Exposition
    • Int'l Joint Research
  • [Presentation] Crystallinity-Induced Variation of the Electronic Characteristics of Electroplated Gold Thin Films2018

    • Author(s)
      Yutaro Nakoshi, Hideo Miura
    • Organizer
      ASME International Mechanical Engineering Congress & Exposition
    • Int'l Joint Research
  • [Presentation] Degradation of the Strength of a Grain and a Grain Boundary Due to the Accumulation of the Structural Defects of Crystal2018

    • Author(s)
      Guoxiong Zheng, Hideo Miura
    • Organizer
      ASME International Mechanical Engineering Congress & Exposition
    • Int'l Joint Research
  • [Presentation] Development of 2D-Graphene-Based Highly Sensitive Flexible Strain Sensor Using Fine Columnar Concentration Structures2018

    • Author(s)
      Zhi Wang, Ken Suzuki, Hideo Miura
    • Organizer
      International Microsystems, Packaging, Assembly and Circuits Technology conference
    • Int'l Joint Research
  • [Presentation] Variation of the Strength and Fracture Mode of a Grain and a Grain Boundary in Polycrystalline Copper Thin Films2018

    • Author(s)
      Guoxiong Zheng, Ken Suzuki, Hideo Miura
    • Organizer
      International Microsystems, Packaging, Assembly and Circuits Technology conference
    • Int'l Joint Research
  • [Presentation] A Theoretical Study of the Effect of Strain on the Electronic Structure of Dumbbell-shape Graphene Nanoribbons2018

    • Author(s)
      Ken Suzuki
    • Organizer
      International Microsystems, Packaging, Assembly and Circuits Technology conference
    • Int'l Joint Research
  • [Presentation] Development of an Embedded Micro Scale Stress Sensor for Electronic Devices2018

    • Author(s)
      Ryota Mizuno, Ken Suzuki, Hideo Miura
    • Organizer
      5th Asia-Pacific Conference on Fracture and Strength
    • Int'l Joint Research
  • [Presentation] Evaluation of the Degradation of the Strength of Grain Boundaries in Ni-Base Superalloy under Creep-Fatigue Loadings at Elevated Temperatures2018

    • Author(s)
      Wataru Suzuki, Ken Suzuki, Hideo Miura
    • Organizer
      15th Asia-Pacific Conference on Fracture and Strength
    • Int'l Joint Research
  • [Presentation] Initial Damage Mechanism of Nickel-Based Alloy 625 Under Creep Loadings at Elevated Temperatures2018

    • Author(s)
      Yan LIANG, Ken Suzuki, Hideo Miura
    • Organizer
      15th Asia-Pacific Conference on Fracture and Strength
    • Int'l Joint Research
  • [Presentation] Development of an Evaluation Method of the Strength of a Grain in Polycrystalline Copper Thin Films Based on the Order of Atom Arrangement2018

    • Author(s)
      Yifan Luo, Ken Suzuki, Hideo Miura
    • Organizer
      15th Asia-Pacific Conference on Fracture and Strength
    • Int'l Joint Research
  • [Presentation] Effect of Defects on the Grain and Grain Boundary Strength in Polycrystalline Copper Thin Films2018

    • Author(s)
      Ken Suzuki
    • Organizer
      2018 International Conference on Simulation of Semiconductor Processes and Devices
    • Int'l Joint Research
  • [Presentation] Crystallinity Dependence of the Strength of electroplated gold thin films Used for Three-Dimensional Electronic Packaging2018

    • Author(s)
      Ken Suzuki
    • Organizer
      International Conference on Solid State Devices and Materials
    • Int'l Joint Research
  • [Presentation] Evaluation of the Grain and Grain Boundary Strength in Copper Interconnections Based on the Order of Atom Arrangement2018

    • Author(s)
      Y. Luo, Ken Suzuki, Hideo Miura
    • Organizer
      International Conference on Solid State Devices and Materials
    • Int'l Joint Research
  • [Remarks] 三浦・鈴木研究室 東北大学工学研究科附属先端材料強度科学研究センター

    • URL

      http://www.miura.rift.mech.tohoku.ac.jp

URL: 

Published: 2019-12-27  

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