• Search Research Projects
  • Search Researchers
  • How to Use
  1. Back to project page

2019 Fiscal Year Annual Research Report

Establishment of Scientific Basis of the Strength and Reliability of Materials Based on the Order of Atom Arrangement and Its Application to the Explication of the Degradation Process of Materials

Research Project

Project/Area Number 16H06357
Research InstitutionTohoku University

Principal Investigator

三浦 英生  東北大学, 工学研究科, 教授 (90361112)

Co-Investigator(Kenkyū-buntansha) 鈴木 研  東北大学, 工学研究科, 准教授 (40396461)
Project Period (FY) 2016-05-31 – 2021-03-31
Keywords機械材料・材料力学 / ナノマイクロ材料力学 / 材料損傷 / 原子拡散 / 結晶粒界品質
Outline of Annual Research Achievements

本研究では、地球温暖化防止対策に資する次世代エネルギー機器の高効率化に不可欠な,機器動作環境の過酷化(高温高負荷化)に起因して生じる構造材料の強化微細組織のナノスケールでの崩壊過程の可視化技術と,高温強度劣化過程の測定技術の開発を目的としている.特に原子配列の秩序性の変化に伴う材料強度の劣化という視点に基づき,応力(ひずみ)誘起異方的増速拡散現象に基づく,原子空孔や不純物原子などの点欠陥や転位の運動に代表される線欠陥の発生・増殖による原子配列の秩序性の変化を可視化するとともに,その原子配列の秩序性の変化と材料強度物性の相関性を解明する「材料強度科学」という新たな学術基盤の創成を目指している.本年度は高温クリープ環境における多結晶材料内の結晶方位差が大きく,結晶品質の低い結晶粒界近傍に原子空孔の集積が加速されることを可視化するとともに,当該粒界強度が著しく劣化することを独自に開発した二結晶試験片を用いたマイクロ引張試験システムを応用して世界に先駆け実証した.さらに粒界酸化や異種化合物の偏析や析出により生じる歪み場がこの拡散集積現象を加速し,材料の破壊寿命を著しく減少させることも実証した.この原子空孔の応力依存異方的拡散現象に基づく粒界強度の低下,脆化現象は分子動力学解析でも実証することに成功した.さrに本現象は従来のオーステナイトステンレス鋼においても発現することも実証でき,多くの多結晶材料で発現」する汎用的な高温劣化損傷機構であることをし示した.

Research Progress Status

令和元年度が最終年度であるため、記入しない。

Strategy for Future Research Activity

令和元年度が最終年度であるため、記入しない。

  • Research Products

    (25 results)

All 2020 2019 Other

All Int'l Joint Research (1 results) Journal Article (8 results) (of which Peer Reviewed: 8 results,  Open Access: 8 results) Presentation (16 results) (of which Int'l Joint Research: 16 results,  Invited: 4 results)

  • [Int'l Joint Research] 北京科学技術大学(中国)

    • Country Name
      CHINA
    • Counterpart Institution
      北京科学技術大学
  • [Journal Article] First-principles analysis of the inhibitive effect of interstitial carbon on an active dissolution of martensitic steel2020

    • Author(s)
      Mariko Kadowaki, Arkapol Saengdeejin, Izumi Muto, YingChen, Hiroyuki Masuda, Hideki Katayama, Takashi Doi, Kaori Kawano, Hideo Miura, Yu Sugawara, Nobuyoshi Hara
    • Journal Title

      Corrosion Science

      Volume: 163 Pages: 10251-1-11

    • DOI

      10.1016/j.corsci.2019.108251

    • Peer Reviewed / Open Access
  • [Journal Article] Grain Boundary Cracking of Nickel-Based Alloy 625 Under Creep Loadings at Elevated Temperatures2019

    • Author(s)
      Yan Liang , Yifan Luo , Ken Suzuki , Hideo Miura
    • Journal Title

      Mechanics of Solids, Structures, and Fluids

      Volume: 9 Pages: 11186-1-6

    • DOI

      10.1115/IMECE2019-11186

    • Peer Reviewed / Open Access
  • [Journal Article] Strain and Photovoltaic Sensitivities of Dumbbell-Shape GNR-Base Sensors2019

    • Author(s)
      Jowesh Avisheik Goundar , Takuya Kudo , Qinqiang Zhang , Ken Suzuki , Hideo Miura
    • Journal Title

      Micro- and Nano-Systems Engineering and Packaging

      Volume: 10 Pages: 11076-1-6

    • DOI

      10.1115/IMECE2019-11076

    • Peer Reviewed / Open Access
  • [Journal Article] Theoretical Study of the Edge Effect of Dumbbellshape Graphene Nanoribbon with a Dual Electronic Properties by First-principle Calculations2019

    • Author(s)
      Qinqiang Zhang ; Takuya Kudo ; Jowesh Gounder ; Ying Chen ; Ken Suzuki ; Hideo Miura
    • Journal Title

      2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

      Volume: 2019 Pages: 141-144

    • DOI

      10.1109/SISPAD.2019.8870398

    • Peer Reviewed / Open Access
  • [Journal Article] Change of the Effective Strength of Grain Boundaries in Alloy 617 Under Creep-Fatigue Loadings at 800°C2019

    • Author(s)
      Wataru Suzuki , Kenta Ishihara , Ryo Kikuchi , Ken Suzuki , Hideo Miura
    • Journal Title

      Mechanics of Solids, Structures, and Fluids

      Volume: 10 Pages: 11210-1-6

    • DOI

      10.1115/IMECE2019-11210

    • Peer Reviewed / Open Access
  • [Journal Article] First Principle Analysis of the Effect of Strain on Electronic Transport Properties of Dumbbell-Shape Graphene Nanoribbons2019

    • Author(s)
      Takuya Kudo , Qinqiang Zhang , Ken Suzuki , Hideo Miura
    • Journal Title

      Micro- and Nano-Systems Engineering and Packaging

      Volume: 10 Pages: 11107-1-6

    • DOI

      10.1115/IMECE2019-11107

    • Peer Reviewed / Open Access
  • [Journal Article] Effects of crystallinity on mechanical properties of electroplated gold thin films used for three-dimensional electronic packaging2019

    • Author(s)
      Yutaro Nakoshi, Ken Suzuki and Hideo Miura
    • Journal Title

      Japanese Journal of Applied Physics

      Volume: 58 Pages: SBBC04-1-7

    • DOI

      10.7567/1347-4065/ab00f4

    • Peer Reviewed / Open Access
  • [Journal Article] Measurement of the Residual Stress Distribution in the 3D-Stacked Electronic Modules by Embedded Strain Sensors2019

    • Author(s)
      Ryota Mizuno , Genta Nakauchi , Ken Suzuki , Hideo Miura
    • Journal Title

      Micro- and Nano-Systems Engineering and Packaging

      Volume: 10 Pages: 11106-1-6

    • DOI

      10.1115/IMECE2019-11106

    • Peer Reviewed / Open Access
  • [Presentation] Mechano-chemical Degradation Analysis of Heat-resistant Alloys at Elevated Temperatures in Nano-scale2019

    • Author(s)
      Hideo Miura
    • Organizer
      International Conference on Chemical Physics and Materials Science
    • Int'l Joint Research / Invited
  • [Presentation] Quantitative Visualization of Atomic-Scale Degradation of Heat-resistant Alloys under Creep-Fatigue Loadings at Elevated Temperature2019

    • Author(s)
      Yifan LUO, Wataru SUZUKI, Kenta ISHIHARA, Yan LIANG, Ken SUZUKI, Hideo MIURA
    • Organizer
      2019 Global Research Efforts on Energy and Nanomaterials
    • Int'l Joint Research / Invited
  • [Presentation] Initial grain-boundary cracking of Ni-base superalloys under creep-fatigue loadings at 750℃2019

    • Author(s)
      K.Ishihara, W.Suzuki, Y.Luo, K.Suzuki, and H.Miura
    • Organizer
      International Conference on the Mechanical Behavior of Materials
    • Int'l Joint Research / Invited
  • [Presentation] Development of a flexible pressure distribution sensor using multi-walled carbon nanotubes2019

    • Author(s)
      K.Suzuki, R.Osada, H.Miura
    • Organizer
      30th International Conference on Diamond and Carbon Materials
    • Int'l Joint Research
  • [Presentation] Non-destructive Measurement of the Change of Micro Texture of Alloys Using Reflectance Spectrum Analysis of Visible lights2019

    • Author(s)
      Kasama,S, Suzuki,K, Miura,H
    • Organizer
      International Conference of Advanced Technology in Experimental Mechanics 2019
    • Int'l Joint Research
  • [Presentation] Grain Boundary Cracking in Ni-base Alloy 617 Under Creep-fatigue Loading at Elevated Temperatures2019

    • Author(s)
      Ishihara,K, Suzuki,W, Luo,Y, Suzuki,K, Miura,H
    • Organizer
      International Conference of Advanced Technology in Experimental Mechanics 2019
    • Int'l Joint Research
  • [Presentation] Degradation Mechanism of Grain Boundaries in Nickel-Based Alloy 625 Under Creep-Fatigue Loadings at Elevated Temperatures2019

    • Author(s)
      Luo,Y, Suzuki,K, Miura,H
    • Organizer
      International Conference of Advanced Technology in Experimental Mechanics 2019
    • Int'l Joint Research
  • [Presentation] Multi-Channel Dumb-bell shaped Graphene Nanonribbon Structure to Elucidate Electronic Fluctuations for an Enhanced Performance2019

    • Author(s)
      Jowesh Goundar, Takuya Kudo, Qinqiang Zhang, Ken Suzuki, Hideo Miura
    • Organizer
      IEEE 2019 International 3D Systems Integration Conference
    • Int'l Joint Research
  • [Presentation] Grain Boundary Cracking of SUS316L under Creep Loading at Elevated Temperatures2019

    • Author(s)
      Yukako Takahasi, Ken Suzuki and Hideo Miura
    • Organizer
      10th Japan-China Bilateral Symposium on High Temperature Strength of Materials
    • Int'l Joint Research
  • [Presentation] Clarification of the Degradation Mechanism of Grain Boundaries in Nickel-Based Alloy 625 Under Temperature2019

    • Author(s)
      Yifan Luo, Ken Suzuki and Hideo Miura
    • Organizer
      10th Japan-China Bilateral Symposium on High Temperature Strength of Materials
    • Int'l Joint Research
  • [Presentation] Molecular Analysis of Accumulation of Vacancies and Dislocations around a Grain Boundary under Creep Loading at Elevated Temperature2019

    • Author(s)
      Yiqing Fan, Ryo Kikuchi, Ken Suzuki, and Hideo Miura
    • Organizer
      10th Japan-China Bilateral Symposium on High Temperature Strength of Materials
    • Int'l Joint Research
  • [Presentation] Molecular Dynamics Analysis of Grain Boundary Cracking Caused by Accumulation of Vacancies and Dislocations2019

    • Author(s)
      Ryo KIKUCHI, Yiqing FAN, Ken SUZUKI and Hideo MIURA
    • Organizer
      10th Japan-China Bilateral Symposium on High Temperature Strength of Materials
    • Int'l Joint Research
  • [Presentation] Crystallinity Dependence of Grain and Grain Boundary Strength in Polycrystalline Copper Interconnections2019

    • Author(s)
      Ken Suzuki
    • Organizer
      ISMP-EMAP2019
    • Int'l Joint Research / Invited
  • [Presentation] A First Principle Study on the Localized Electronic Band Structure of a Single Long Graphene Nanoribbon with Graphene Electrodes2019

    • Author(s)
      Qinqiang Zhang, Ken Suzuki, Hideo Miura
    • Organizer
      ISMP-EMAP2019
    • Int'l Joint Research
  • [Presentation] Photoresponsivity of a Graphene Nanoribbon based Field Effect Transistor for the Development of a Multi-Junction Solar Cell using a Single Material2019

    • Author(s)
      Jowesh Goundar, Ken Suzuki, Hideo Miura
    • Organizer
      ISMP-EMAP2019
    • Int'l Joint Research
  • [Presentation] Micro texture Dependence of Mechanical Damage Mechanism of Electroplated Gold Thin Film Used for Semiconductor Device Interconnections2019

    • Author(s)
      Genta Nakauchi, Ken Suzuki, Hideo Miura
    • Organizer
      ISMP-EMAP2019
    • Int'l Joint Research

URL: 

Published: 2021-01-27  

Information User Guide FAQ News Terms of Use Attribution of KAKENHI

Powered by NII kakenhi