2018 Fiscal Year Final Research Report
A study on process and mold design to obtain quick bubble removal and residual layer uniformity on whole imprinting area
| Project/Area Number |
16K06035
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Multi-year Fund |
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| Section | 一般 |
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| Research Field |
Production engineering/Processing studies
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| Research Institution | National Institute of Advanced Industrial Science and Technology |
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Principal Investigator |
Youn Sung-Won 国立研究開発法人産業技術総合研究所, エレクトロニクス・製造領域, 主任研究員 (80510065)
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| Co-Investigator(Kenkyū-buntansha) |
鈴木 健太 国立研究開発法人産業技術総合研究所, エレクトロニクス・製造領域, 主任研究員 (60709509)
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| Research Collaborator |
Hiroshima Hiroshi
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| Project Period (FY) |
2016-04-01 – 2019-03-31
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| Keywords | ナノインプリントリソグラフィ / モールド設計 / 残膜均一化 / 凝縮性ガス |
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| Outline of Final Research Achievements |
A design method of a mold that enables to obtain quick bubble removal and uniform distribution of residual layer thickness (RLT) was studied in UV-nanoimprint lithography (UV-NIL) using a condensable gas. Through UV-NIL experiments with a real-time monitoring system, a quick bubble removal (< 1 s) was demonstrated for micro/nano square patterns with the different cavity sizes. A software module for modifying a mold design to obtain uniform RLT distribution has been developed, and the effect of the modified pattern designs on the RLT distribution and filling characteristics were investigated. The feasibility of the proposed method was verified by chip-scale UV-NIL simulation and experiments, and the results for modified mold designs showed a marked improvement (standard deviation decrease in the range from 1/3 to 1/5) in RLT uniformity. Based on the results obtained, some test patterns such as an interconnection substrate and a holographic pattern were fabricated successfully.
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| Free Research Field |
工学
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| Academic Significance and Societal Importance of the Research Achievements |
リソグラフィ用モールドの設計技術が確立されていないことはUV-NILのデバイス作製への適用において大きな障害になっており、UV-NILの産業利用の観点から、適用範囲を拡張する本技術の重要性は非常に高い。本研究で得られた知見は、適用容積均一化モールドの設計に汎用的に用いることができ、産業界での適用が期待される。
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