Hard and brittle materials 3D ultra-precision machining using laser slicing technology

2017 Fiscal Year Final Research Report

• Project/Area Number: 16K17991
• Research Category: Grant-in-Aid for Young Scientists (B)
• Allocation Type: Multi-year Fund
• Research Field: Production engineering/Processing studies
• Research Institution: Saitama University
• Principal Investigator: YAMADA Yohei 埼玉大学, 理工学研究科, 助教 (60756899)
• Project Period (FY): 2016-04-01 – 2018-03-31
• Keywords: レーザスライシング / 半導体 / Si / SiC / 切断加工

Outline of Final Research Achievements

We proposed laser slicing technology for semiconductor materials cutting. In this technology, micro crack is created inside of the material by focusing pulse laser beam on the inside. Then, each micro crack link by scanning pulse laser. As the result, high-precision and low waste cutting process was realized. In this research, we investigated the shape of micro cracks control by controlling laser energy, clearance of the micro cracks and aberration correction. We found that influence of crystal orientation can be ignored by refinement micro cracks. Therefore, we realized high-precision and high quality cutting for semiconductor materials.

Free Research Field

レーザ加工