ダイヤモンドマイクロアレイ工具の創成と極微細加工に関する研究

2006 Fiscal Year Final Research Report Summary

• Project/Area Number: 17560094
• Research Category: Grant-in-Aid for Scientific Research (C)
• Allocation Type: Single-year Grants
• Section: 一般
• Research Field: Production engineering/Processing studies
• Research Institution: University of Toyama
• Principal Investigator: TAKANO Noboru University of Toyama, Engineering, Research Assistant, 理工学研究部(工学), 助手 (60251881)
• Co-Investigator(Kenkyū-buntansha): MORITA Noboru University of Toyama, Engineering, Professor, 理工学研究部(工学), 教授 (30239660) ; YAMADA Shigeru University of Toyama, Engineering, Associate Professor, 理工学研究部(工学), 助教授 (00174714)
• Project Period (FY): 2005 – 2006
• Keywords: Diamond Array Tool / Silicon Mold / Anisotropic Etching / Polycrystalline Diamond / Reactive Ion Etching / Ultra Micro Machining

Research Abstract

In this study, we developed a diamond micro milling tool for micro-to-nano scale machining. This tool is manufactured by attaching a diamond cutting edge to tip of rotational axis. The diamond cutting edge with various shapes named "diamond array tool" are fabricated by depositing polycrystalline diamond using CVD on silicon molds which are made by anisotropic wet etching of the single crystal silicon or by reactive ion etching. The cutting edge has various shapes, the former is pyramidal, the latter are square, semicircle, triangle and trapezoid etc. By using this micro milling tool to machining for single crystal silicon, metallic glass and acrylic resin, the chip of these materials was observed largely by SEM image. It was found that the micro milling tool was possible to machining with high efficiency and accuracy.