Technology platform for implantation of CMOS microchip with transparent hermetic package

2020 Fiscal Year Final Research Report

• Project/Area Number: 18K04265
• Research Category: Grant-in-Aid for Scientific Research (C)
• Allocation Type: Multi-year Fund
• Section: 一般
• Review Section: Basic Section 21060:Electron device and electronic equipment-related
• Research Institution: Toyohashi University of Technology
• Principal Investigator: Noda Toshihiko 豊橋技術科学大学, エレクトロニクス先端融合研究所, 准教授 (20464159)
• Project Period (FY): 2018-04-01 – 2021-03-31
• Keywords: 体内埋め込み型機器 / CMOS集積回路 / パッケージ技術

Outline of Final Research Achievements

Implantable medical devices are expected to become more important for maintaining a high quality of life (QOL) while living with various diseases. In this study, an ultra-small hermetically sealed package technology that ensures high reliability and durability for implantable medical devices has been developed. A highly durable assembly method using inorganic materials was proposed and completed a proof-of-concept device capable of nerve stimulation. Functional demonstration of the prototype device was performed successfully.

Free Research Field

CMOS集積回路

Academic Significance and Societal Importance of the Research Achievements

CMOS集積回路は体内埋込み型機器の高度な制御や高品質な信号計測に不可欠である。本研究では，超小型のCMOS集積回路を安全かつ長期安定的に体内に埋め込む方法の一例を示す事ができ，本技術に基づく体内埋め込み型機器の発展が期待できる。