2020 Fiscal Year Final Research Report
Creation of a solder joint using a liquid metal, which can be assembled at a low temperature and does not have a thermal fatigue.
| Project/Area Number |
18K04272
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Multi-year Fund |
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| Section | 一般 |
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| Review Section |
Basic Section 21060:Electron device and electronic equipment-related
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| Research Institution | Chukyo University |
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Principal Investigator |
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| Co-Investigator(Kenkyū-buntansha) |
田口 博久 中京大学, 工学部, 教授 (30453830)
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| Project Period (FY) |
2018-04-01 – 2021-03-31
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| Keywords | 液体金属 / 低温実装 / はんだ接合部 / パワーモジュール / 高機能半導体 |
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| Outline of Final Research Achievements |
A thermal fatigue of solder joints is one of major failure modes in electronics products. This research aims application of Ga to solder joints as a liquid metal joint at room temperature to overcome the thermal fatigue which happens because of solid solder joints. "Temperature characteristics (-40 and 200℃) of Ga electrical resistance and its super cooling characteristics" and "Reaction characteristics between Ga and electrode metals in high temperatures" were clarified.
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| Free Research Field |
エレクトロニクス実装技術
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| Academic Significance and Societal Importance of the Research Achievements |
カーボンニュートラル社会を実現するため，自動車の電動化が加速している。モータ駆動用のパワーモジュールを，断線しない接合技術で実現するための基本的な成果を得た。また，人工知能コンピュータなどの高機能半導体デバイスは，10μm以下の微細はんだ接合が必須となる。これを実現するために必須な，省エネでもある80℃以下の低温実装技術の可能性を示した。
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