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2009 Fiscal Year Final Research Report

Basic study on development of micro- and nano-machining processes for semiconductors using catalytic effects of metals

Research Project

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Project/Area Number 19310073
Research Category

Grant-in-Aid for Scientific Research (B)

Allocation TypeSingle-year Grants
Section一般
Research Field Nanomaterials/Nanobioscience
Research InstitutionOsaka University

Principal Investigator

MATSUMURA Michio  Osaka University, 太陽エネルギー化学研究センター, 教授 (20107080)

Co-Investigator(Kenkyū-buntansha) IKEDE Shigeru  大阪大学, 太陽エネルギー化学研究センター, 准教授 (40312417)
Project Period (FY) 2007 – 2009
Keywords半導体超微細加工 / 触媒・化学プロセス / ナノ加工 / マイクロ加工 / シリコン
Research Abstract

Fine pores were formed in silicon wafers by processing them in a mixed solution containing hydrofluoric acid and hydrogen peroxide after loading fine metal particles such as platinum and gold on the surface. The similar phenomenon occurred by using needle electrodes made of these metals, by bringing the electrodes into contact with silicon wafers in a hydrofluoric acid solution. From the analysis of the relationship between current and pores formed, we found that pores or grooves are formed in a controlled manner in n-type silicon or highly resistive p-type silicon without causing corrosion at places not being in contact with the electrodes. The results will provide a basis for the development of novel micro- and nano-machining process for semiconductors.

  • Research Products

    (14 results)

All 2010 2009 2008

All Journal Article (5 results) (of which Peer Reviewed: 4 results) Presentation (9 results)

  • [Journal Article] Acceleration of groove formation in silicon using catalytic wire electrodes for development of a slicing technique2010

    • Author(s)
      M.S. Salem, C.-L. Lee, S. Ikeda, M. Matsumura
    • Journal Title

      J. Mater. Process. Technol Vol.210,No.2

      Pages: 330-334

    • Peer Reviewed
  • [Journal Article] 触媒を利用したシリコンのエッチングと太陽電池製造工程への応用2009

    • Author(s)
      李佳龍、池田茂、松村道雄
    • Journal Title

      生産技術 Vol.61,No.1

      Pages: 27-31

  • [Journal Article] Formation of 100-μm-deep Vertical Pores in Si Wafers by Wet Etching and Cu Electrodeposition2009

    • Author(s)
      C.-L. Lee, S. Tsuru, Y. Kanda, S. Ikeda, M. Matsumura
    • Journal Title

      Electrochem. Soc Vol.156,No.12

      Pages: D543-D547

    • Peer Reviewed
  • [Journal Article] Electrochemical Grooving of Si Wafers Using Catalytic Wire Electrodes in HF Solution2009

    • Author(s)
      C.-L. Lee, Y. Kanda, T. Hirai, S. Ikeda, M. Matsumura
    • Journal Title

      J. Electrochem. Soc Vol.156,No.3

      Pages: H134-H137

    • Peer Reviewed
  • [Journal Article] Pore Formation in Silicon by Wet Etching Using Micrometer-sized Metal Particles as Catalysts2008

    • Author(s)
      C.-L. Lee, K. Tsujino, Y. Kanda, S. Ikeda, M. Matsumura
    • Journal Title

      J. Mater. Chem Vol.18,No.9

      Pages: 1015-1020

    • Peer Reviewed
  • [Presentation] Micromachining of Silicon Wafers with Catalytic Needle Electrodes in HF solution2010

    • Author(s)
      T. Sugita, T. Hirai, S. Ikeda, M. Matsumura
    • Organizer
      The 217th Meeting of The Electrochemical Society (ECS)
    • Place of Presentation
      Vancouver, Canada (The Fairmont Hotel Vancouver)
    • Year and Date
      2010-04-27
  • [Presentation] アノード分極した金属針によるシリコンウェハへの微細孔の形成2010

    • Author(s)
      杉田智彦, 平井豪, 松村道雄
    • Organizer
      第57回応用物理学関係連合講演会
    • Place of Presentation
      平塚(東海大学湘南キャンパス)
    • Year and Date
      2010-03-20
  • [Presentation] 触媒粒子を用いたエッチングにより形成されるシリコンの新規表面構造2009

    • Author(s)
      神田裕士, 原田隆史, 松村道雄
    • Organizer
      電気化学秋季大会
    • Place of Presentation
      小金井(東京農工大学工学部)
    • Year and Date
      2009-09-10
  • [Presentation] 触媒針電極を用いたシリコン基板への微細加工2009

    • Author(s)
      杉田智彦, 平井豪, 松村道雄
    • Organizer
      第70回応用物理学会学術講演会
    • Place of Presentation
      富山(富山大学五福キャンパス)
    • Year and Date
      2009-09-10
  • [Presentation] 水素プラズマ処理により多結晶シリコン中に取り込まれた水素の状態について2009

    • Author(s)
      水田紘平, 池田茂, 松村道雄
    • Organizer
      第70回応用物理学会学術講演会
    • Place of Presentation
      富山(富山大学五福キャンパス)
    • Year and Date
      2009-09-09
  • [Presentation] Wet Processes for Boring, Grooving and Slicing Silicon Using Metal Catalysts2009

    • Author(s)
      Chia-Long Lee, Yuji Kanda, Mohamed Shaker Salem, Takeshi Hirai, Shigeru Ikeda, Michio Matsumura
    • Organizer
      2009 Material Research Society (MRS) Spring Meeting
    • Place of Presentation
      San Francisco, USA (San Francisco Marriott Hotel
    • Year and Date
      2009-04-15
  • [Presentation] 電気化学的エッチング反応を利用したシリコンブロックのスライシング2009

    • Author(s)
      李佳龍, 神田裕士, Mohamed Shaker Salem, 池田茂, 松村道雄
    • Organizer
      電気化学会第76回大会
    • Place of Presentation
      京都(京都大学吉田キャンパス)
    • Year and Date
      2009-03-29
  • [Presentation] 触媒針電極を用いたシリコン基板への貫通孔の形成2009

    • Author(s)
      杉田智彦, 平井豪, 池田茂, 松村道雄
    • Organizer
      電気化学会第76回大会
    • Place of Presentation
      京都(京都大学吉田キャンパス)
    • Year and Date
      2009-03-29
  • [Presentation] Electrochemical Grooving of Slicing Silicon Wafers Using Catalytic Wires2008

    • Author(s)
      Chia-Long L S alem, Takeshi Hirai, Shigeru Ikeda, Michio Matsumura
    • Organizer
      電気化学日米合同大会
    • Place of Presentation
      Honolulu, USA(ヒルトン・ハワイアンヴィレッジ)
    • Year and Date
      2008-10-14

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Published: 2011-06-18   Modified: 2016-04-21  

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