2010 Fiscal Year Final Research Report
PRECISION MICROPROCESSING OF PERMEABLE HARD BRITTLE MATERIAL BY NANOSECOND- OR CW-LASER AND ITS INTELLECTUALIZATION
| Project/Area Number |
19360065
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| Research Category |
Grant-in-Aid for Scientific Research (B)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Production engineering/Processing studies
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| Research Institution | Osaka University |
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Principal Investigator |
OHMURA Etsuji Osaka University, 工学研究科, 教授 (90144435)
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| Co-Investigator(Kenkyū-buntansha) |
NAKANO Notohiro 大阪大学, 工学研究科, 准教授 (40164256)
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| Project Period (FY) |
2007 – 2010
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| Keywords | レーザ加工 / 硬脆材料 / レーザスクライブ / レーザ内部加工 / 吸収係数 / 亀裂 |
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| Research Abstract |
The precision microprocessing of a hard and brittle materials such as a dielectric or a semiconductor was tried by focusing a permeable nanosecond pulse or CW laser beam in the material surface or the inside. The following matters about elucidation of the processing mechanism and investigation and control of parameters about processing quality were examined from the scientific situation : (1) The measurement of the temperature dependency of the absorption coefficient. (2) Surface or inside processings of permeable materials, and their processing quality assessment. (3) The analysis of a temperature history and a thermal shock phenomenon by the heat transfer analysis and the thermo-elastic-plastic analysis. (4) Fracture mechanics analysis
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