2009 Fiscal Year Final Research Report

Development of high-speed cutting technology of brittle materials by laser

Research Project

Project/Area Number	19560739
Research Category	Grant-in-Aid for Scientific Research (C)
Allocation Type	Single-year Grants
Section	一般
Research Field	Material processing/treatments
Research Institution	Sasebo National College of Technology
Principal Investigator	HARA Youichiro Sasebo National College of Technology, 機械工学科, 教授 (70099886)
Project Period (FY)	2007 – 2009
Keywords	レーザ加工 / スクライブ加工 / 熱応力割断 / 脆性材料
Research Abstract	The scribing process is necessary for cutting glass, and a wheel cutter is used for it. Recently, however, the scribing process that guides a crack only on the surface is using the thermal stress generated by laser irradiation. Compared with the conventional method, there is no micro crack and flatness in a cross section. Furthermore, since the chips of glass are not generated, it is the method whose manufacturing efficiency is high. This research describes about the laser scribing method using the new heating point by CO_2 laser, experiments the laser scribing processing in this method, and examines the possibility of a new laser scribe process based on the result.

(3 results)