2009 Fiscal Year Final Research Report
Three-Dimensionally Stacked Hetero-Chip Fabrication by Self-Assembly
| Project/Area Number |
19686022
|
|---|
| Research Category |
Grant-in-Aid for Young Scientists (A)
|
| Allocation Type | Single-year Grants |
|---|
| Research Field |
Electron device/Electronic equipment
|
|---|
| Research Institution | Tohoku University |
|---|
Principal Investigator |
FUKUSHIMA Takafumi Tohoku University, 大学院・工学研究科, 助教 (10374969)
|
|---|
| Co-Investigator(Renkei-kenkyūsha) |
KOYANAGI Mitsumasa 東北大学, 大学院・工学研究科, 教授 (60205531)
TANAKA Tetsu 東北大学, 大学院・医工学研究科, 教授 (40417382)
|
|---|
| Project Period (FY) |
2007 – 2009
|
| Keywords | インターコネクト・パッケージのシステム化・応用 / 自己組織化 / マイクロ・ナノデバイス / 流体 / 微細接続 / システムオンチップ |
|---|
| Research Abstract |
We have provided new three-dimensional integration technology based on high-precision multi-chip self-assembly using surface tension of liquid droplets. We have successfully fabricated heterogeneous multi-chip test module using the self-assembly technology. The alignment accuracy was found to be within 1 micron, and more than 500 chips can be self-assembled on substrates in batch. In addition, the chips were tightly bonded to the substrates at room temperature without thermal compression.
|
Research Products
(54 results)
-
-
-
-
-
-
-
[Journal Article] New Heterogeneous Multi-Chip Module Integration Technology Using Self-Assembly Method2008
Author(s)
T. Fukushima, T. Konno, K. Kiyoyama, M. Murugesan, K. Sato, W. -C. Jeong, Y. Ohara, Noriki, S. Kanno, Y. Kaiho, H. Kino, K. Makita, R. Kobayashi, C. -K. Yin, K. Inamura, K. -W. Lee, J. -C. Bea, T. Tanaka, M. Koyanagi
-
Journal Title
International Electron Devices Meeting (IEDM) Technical Digest
Pages: 499-502
Peer Reviewed
-
[Journal Article] Low-Loss Optical Interposer with Recessed Vertical-Cavity Surface-Emitting Laser Diode and Photodiode Chips into Si Substrate2008
Author(s)
Makoto Fujiwara, Shinsuke Terada, Yoji Shirato, Hiroshi Owari, Kei Watanabe, Mutsuhiro Matsuyama, Keizo Takahama, Tetsuya. Mori, Kenji Miyao, Koji Choki, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
-
Journal Title
Japanese Journal of Applied Physics Vol.47
Pages: 2936-2940
Peer Reviewed
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
[Presentation] Cu lateral interconnects formed between 100-um-thick self-assembled chips on flexible substrates2009
Author(s)
M. Murugesan, J.C. Bea, T. Fukushima, T. Konno, K. Kiyoyama, W.C. Jeong, H. Kino, A. Noriki, K.W. Lee, T. Tanaka, M. Koyanagi
Organizer
2009 Electronics Components and Technology Conference (ECTC)
Place of Presentation
サンディエゴ(USA)
Year and Date
2009-05-29
-
-
-
-
-
[Presentation] New Heterogeneous Multi-Chip Module Integration Technology Using Self-Assembly Method2008
Author(s)
T. Fukushima, T. Konno, K. Kiyoyama, M. Murugesan, K. Sato, W. -C. Jeong, Y. Ohara, Noriki, S. Kanno, Y. Kaiho, H. Kino, K. Makita, R. Kobayashi, C. -K. Yin, K. Inamura, K. -W. Lee, J. -C. Bea, T. Tanaka, M. Koyanagi
Organizer
International Electron Devices Meeting (IEDM)
Place of Presentation
サンフランシスコ(米国)
Year and Date
2008-12-16
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
[Presentation] Thermal Issues of 3D ICs2007
Author(s)
Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Organizer
Workshop on Driving the future of interconnect in 3D: Thermal and Design Issues in 3D ICs
Place of Presentation
Albany (USA)
Year and Date
2007-10-11
-
-
-
-
[Remarks] 2010年2月ドイツ・イノベーション・アワード「ゴットフリード・ワグネル賞2009」the 2nd Prize
-
[Remarks] 2008年12月Material Research Society (MRS) fall meeting Invited Speaker Award
-
[Remarks] 2008年2月財団法人青葉工学振興会第13回研究奨励賞
-
[Remarks] 2007年4月International Conference on Electronics Packaging / Outstanding Technical Paper Award
-
-
