2022 Fiscal Year Final Research Report
A Novel SiC Power Device Bonding Technology Using Zn/Al/Ni Functional Film
Project/Area Number |
19H02044
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Research Category |
Grant-in-Aid for Scientific Research (B)
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Allocation Type | Single-year Grants |
Section | 一般 |
Review Section |
Basic Section 18020:Manufacturing and production engineering-related
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Research Institution | Kyoto University of Advanced Science (2020-2022) Aichi Institute of Technology (2019) |
Principal Investigator |
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Co-Investigator(Kenkyū-buntansha) |
三宅 修吾 神戸市立工業高等専門学校, その他部局等, 教授 (60743953)
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Project Period (FY) |
2019-04-01 – 2022-03-31
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Keywords | Al/Ni自己伝播発熱多層膜 / 瞬間接合 / 多点同時反応誘起技術 / クラック制御 / ボイド抑制 / 高靭化 |
Outline of Final Research Achievements |
In this study, toward the realization of future crack-free die bonding for SiC power devices, we designed and developed a reaction induction system that can simultaneously irradiate multiple points using a laser, and simultaneously induced reactions in Al/Ni multilayer films from two points. The behavior of the formed cracking was investigated in detail. Specifically, Al/Ni multilayer films with different atomic ratios and different bilayer thicknesses were fabricated by sputtering, and two simultaneous reactions were induced on the films to control the reaction collision position. As a result, we succeeded in artificially forming a large crack by colliding the reaction at the target position. In addition, it was found that adding B to the Al/Ni multilayer film made it tougher, and as a result, microcracks formed other than the reaction collision position could be suppressed.
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Free Research Field |
ナノメカニクス,ナノテクノロジ,機能性材料
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Academic Significance and Societal Importance of the Research Achievements |
本研究では,2050年の自動車組み立て工程ゼロエミッション化に向けて,ほぼゼロエネルギーでゼロエミッションなAl/Ni自己伝播発熱多層膜を用いたSiCパワー素子の瞬間ダイボンディング技術の確立を目指した.この技術の問題は接合部位にボイドやクラックが形成され,機械的強度や熱的物性に悪影響が及ぶことである.問題解決のため,Al/NiにBを添加して反応後のNiAl合金を高靭化してボイドやクラックを抑制することに成功した.また,複数点同時反応誘起技術を開発してクラックを人為的に形成できることを実証した.これらの成果は上記目標達成に強力に貢献し,パワーデバイス作製の新たな標準工程になると期待できる.
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