Development of electrochemical dry polishing method for GaN surface using solid polymer electrolyte

2022 Fiscal Year Final Research Report

• Project/Area Number: 19K04117
• Research Category: Grant-in-Aid for Scientific Research (C)
• Allocation Type: Multi-year Fund
• Section: 一般
• Review Section: Basic Section 18020:Manufacturing and production engineering-related
• Research Institution: Ritsumeikan University
• Principal Investigator: Murata Junji 立命館大学, 理工学部, 准教授 (70531474)
• Project Period (FY): 2019-04-01 – 2023-03-31
• Keywords: 研磨加工 / 陽極酸化 / 固体電解質

Outline of Final Research Achievements

In this research, we proposed a novel environment-friendly electrochemical mechanical polishing using solid polymer electrolytes for high-efficiency finishing of wide-gap semiconductor materials. The ion conductive polishing pad that contains the solid polymer electrolyte and abrasive particles allows the polishing conducted without the use of harsh chemicals. The proposed method yields a 10-times higher material removal rate than the conventional polishing method and can reduce the surface roughness from approximately 50 nm to less than 1 nm within several minutes of polishing.

Free Research Field

精密加工

Academic Significance and Societal Importance of the Research Achievements

研究では、固体高分子電解質を用いた環境調和型電気化学機械研磨（ECMP）について提唱し、ワイドギャップ半導体の高効率な研磨法を実現した．本加工法は、高い加工速度が得られるためウェハ表面のダメージを高速に除去し、表面粗さも短時間で低減することができる。そのため、従来技術に比べて加工時間を大幅に短縮できる。また、薬液を一切用いないことから、廃液処理のコストも低減でき、環境負荷の少ないウェハ製造技術として期待できる。