The development of a high-efficiency polishing technology using small tool under electric field

2022 Fiscal Year Final Research Report

• Project/Area Number: 19K04118
• Research Category: Grant-in-Aid for Scientific Research (C)
• Allocation Type: Multi-year Fund
• Section: 一般
• Review Section: Basic Section 18020:Manufacturing and production engineering-related
• Research Institution: Akita National College of Technology
• Principal Investigator: Ikeda Hiroshi 秋田工業高等専門学校, その他部局等, 教授 (90573098)
• Project Period (FY): 2019-04-01 – 2023-03-31
• Keywords: 電界 / 砥粒 / スラリー / 研磨 / 非球面レンズ / 半導体ウエハ

Outline of Final Research Achievements

The correction polishing using a small tool is expected to be a technology for achieving highly efficient polishing of semiconductor wafers. However, in correction polishing, high-precision control of the polishing pressure is required to prevent excessive removal in the planarization.
Therefore, we have started to develop a new polishing load control system using an electric actuators. Furthermore, we have attempted to enhance a polishing removal amount using the electric slurry control technique. As the result, it was found that the variation of the removal amount decreased by 1/4 compared to the conventional load control system. Furthermore, the polishing removal amount was increased by 45 % at applied voltage 4kV. Therefore, we clarified that the proposed polishing technology has the capability to obtain the high precision and rapid polishing.

Free Research Field

精密加工プロセス

Academic Significance and Societal Importance of the Research Achievements

本研究は，次世代半導体材料の製造コスト削減，および製造リードタイムの短縮を実現できる技術として開発を進めており，昨今の半導体不足解消に貢献できるものと考えられる．
また，スモールツールによる研磨は非球面レンズの仕上げ加工として採用されているが，半導体基板の部分修正による平坦化確保，さらに電界を付与しながら研磨加工量と表面粗さを予測し，迅速に工作物表面を加工する技術は他に類似する事例は存在しない．本研究で提案する研磨技術の適用範囲は平面基板の他，非球面レンズなど工作物の形状に依存しないことから，光学分野など様々な分野における高効率製造技術の構築に貢献できる技術である．