Study on polishing phenomenon with AFM tip scratch machining

2022 Fiscal Year Final Research Report

• Project/Area Number: 19K04130
• Research Category: Grant-in-Aid for Scientific Research (C)
• Allocation Type: Multi-year Fund
• Section: 一般
• Review Section: Basic Section 18020:Manufacturing and production engineering-related
• Research Institution: Chiba Institute of Technology
• Principal Investigator: Matsui Shinsuke 千葉工業大学, 工学部, 教授 (50612769)
• Project Period (FY): 2019-04-01 – 2023-03-31
• Keywords: AFM / 切れ刃 / 研磨加工 / アルミナ / SiC

Outline of Final Research Achievements

We aim to clarify the mechanism of polishing that combines various elements for the purpose of advancing polishing technology. Each element is examined individually, and it leads to clarification by synthesizing them. As one of the major factors, we investigated the action of each abrasive grain as a cutting edge using AFM. The AFM stylus was regarded as an abrasive cutting edge, and the load and trajectory were controlled by the AFM system, and the basic characteristics of scratch processing were investigated. In particular, we investigated hard and brittle materials that will become important in the future. As a result, when the stylus made of SiC and alumina, which has hardness second only to diamond, was used to process quartz optical fibers, almost no processing damage occurred. As far as processing is performed in the ductile mode, it seems that the processing progresses with chemical action on quartz.

Free Research Field

生産加工

Academic Significance and Societal Importance of the Research Achievements

次世代パワーデバイス用の硬脆な半導体材料基板の研磨、電子部品として高品質化が望まれる難加工誘電体材料の研磨、半導体デバイス、光通信部品等での異種材料の平面研磨、複雑形状研磨等研磨加工は新たな段階を迎え高度化が要求されている。ところが研磨技術は、複雑な要素からなっているために、そのメカニズムの究明を難しくしている。そこでその要素を分離し、個々に検討した。AFM触針を砥粒の非常に小さな切れ刃に見立てその加工特性を検討することは、研磨における重要な要素の検討一つである。本研究における結果は、研磨における機械的、化学的側面を直接的に明らかにする重要な点の追及の端緒となった。