Development of reversible joining process of CFRP using oxide semiconductor and electrical heating and its joining behavior evaluation

2021 Fiscal Year Final Research Report

• Project/Area Number: 19K14852
• Research Category: Grant-in-Aid for Early-Career Scientists
• Allocation Type: Multi-year Fund
• Review Section: Basic Section 18010:Mechanics of materials and materials-related
• Research Institution: Kobe City College of Technology (2020-2021); Wakayama National College of Technology (2019)
• Principal Investigator: Tanabe Daiki 神戸市立工業高等専門学校, その他部局等, 准教授 (70792216)
• Project Period (FY): 2019-04-01 – 2022-03-31
• Keywords: CFRP / 金属酸化物半導体 / 接合 / 引張せん断強度 / マルチマテリアル

Outline of Final Research Achievements

This study aims to develop the reversible joining process of CFRP using oxide semiconductor and electrical heating. As a result of thermal decomposition of the matrix polymer of CFRP using chromium oxide powder as a metal oxide semiconductor, it was found that thermal decomposition of the matrix polymer is feasible. Moreover,as the result of applying the catalytic effect of chromium oxide powder to the CFRP joining process, it was confirmed that the tensile shear strength was improved significantly.

Free Research Field

機械材料，材料力学，複合材料製造学

Academic Significance and Societal Importance of the Research Achievements

金属と熱可塑性CFRPや熱硬化性CFRPのマルチマテリアル化を実現するためには，融着接合や接着接合について探求する必要がある．特に，熱硬化性CFRPは融着接合が困難であり，熱可塑性樹脂のホットメルトによる接着接合も接合強度が低いことから，エポキシ等の熱硬化性接着剤による接着接合が不可欠だからである．また，熱硬化性樹脂は硬化後に再溶融できないため，易解体性等の機能性を付与した可逆的接着接合プロセスの開発が求められる．本研究開発の成果により，高い接合強度でCFRPを接合可能となり，CFRPのマルチマテリアル化にも貢献できる．