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2012 Fiscal Year Final Research Report

Nano-structure Control of Cu Interconnects by a Very High Purity Plating Processes and Its Application to Next-generation LSIs.

Research Project

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Project/Area Number 20226014
Research Category

Grant-in-Aid for Scientific Research (S)

Allocation TypeSingle-year Grants
Research Field Structural/Functional materials
Research InstitutionIbaraki University

Principal Investigator

ONUKI Jin  茨城大学, 工学部, 教授 (70315612)

Co-Investigator(Kenkyū-buntansha) MIMURA Koji  東北大学, 多元物質科学研究所, 准教授 (00091752)
ISHIKAWA Nobuhiro  独立行政法人物質・材料研究機構, 主任研究員 (00370312)
KONDO Kazuo  大阪府立大学, 工学研究科, 教授 (50250478)
INAMI Takashi  茨城大学, 工学部, 講師 (20091853)
CHONAN Yasunori  秋田県立大学, システム科学技術学部, 助教 (30363740)
ITO Shinji  独立行政法人物質・材料研究機構, 主任研究員 (50370317)
UCHIKOSHI Masahito  東北大学, 多元物質科学研究所, 助教 (60447191)
OHTA Hiromichi  茨城大学, 工学部, 教授 (70168946)
NAGANO Takatoshi  茨城大学, 工学部, 講師 (70343621)
KIMURA Takashi  独立行政法人物質・材料研究機構, 主任研究員 (70370319)
SASAJIMA Yasushi  茨城大学, 工学部, 教授 (80187137)
AOYAMA Takashi  秋田県立大学, システム科学技術学部, 教授 (80363737)
TASHIRO Suguru  茨城大学, 工学部, 講師 (90272111)
Project Period (FY) 2008 – 2012
Keywords電子 / 情報材料
Research Abstract

Grain sizes and their distribution in very narrow Cu wires (≦50nm) have a crucial influence on device performances and reliabilities of LSIs. This is because the average grain size in Cu wires becomes smaller for narrower wires and especially. Very fine grains causes substantial resistivity increase and reliability degradation of Cu wires. In order to reduce resistivity and raise reliability, with the final goal being to enhance LSI performance, we have investigated the purification process of Cu wires using high-purity plating materials and little additives and gotten Cu wires with more than 30% lower resistivity than those made with conventional purity plating materials.

  • Research Products

    (15 results)

All 2013 2012 2011 2010 Other

All Journal Article (10 results) (of which Peer Reviewed: 10 results) Presentation (2 results) Remarks (2 results) Patent(Industrial Property Rights) (1 results)

  • [Journal Article] Structural response of nano-scale damascene copper lines to annealing2013

    • Author(s)
      T.Konkova,Y.Ke,S.Mironov,and J.Onuki
    • Journal Title

      Electrochemistry

      Volume: (掲載確定)

    • Peer Reviewed
  • [Journal Article] Electron backscatter diffraction analysis of electrodeposited nano-scale copper wires2013

    • Author(s)
      T.Nagano,Y.Sasajima,K.Tamahashi, and J.Onuki
    • Journal Title

      Thin Solid Films

      Volume: (掲載確定)

    • Peer Reviewed
  • [Journal Article] Cs-corrected STEM Observation and Atomic Modeling of Grain Boundary Impurities of Very Narrow Cu interconnect2013

    • Author(s)
      Y.Ke,T.Konkova,S.Mironov,K.Tamahashi,and J.Onuki
    • Journal Title

      ECS Electrochemistry Letters

      Volume: (掲載確定)

    • Peer Reviewed
  • [Journal Article] EBSD analysis of microstructures along the depth direction in very narrow Cu wires2013

    • Author(s)
      Y.Ke, T.Namekawa, K.Tamahaashi, and J.Onuki
    • Journal Title

      Electrochemistry

      Volume: 81巻 Pages: 246-250

    • Peer Reviewed
  • [Journal Article] Influence of Additive-Free process on the Microstructure of Very Narrow Cu Wires in the Lower Region of a Trench2013

    • Author(s)
      Y.Ke,T.Namekawa,K.Tamahashi and J.Onuki
    • Journal Title

      Influence of Additive-Free process on the Microstructure of Very Narrow Cu Wires in the Lower Region of a Trench

      Volume: 54巻 Pages: 255-259

    • Peer Reviewed
  • [Journal Article] Effect of annealing temperature on a structure of electrodeposited nano-scale copper wires2012

    • Author(s)
      Y.Ke,T.Konkova,M.Sergey, J.Onuki
    • Journal Title

      Letters on Materials

      Volume: 2巻 Pages: 198-201

    • Peer Reviewed
  • [Journal Article] Void Generation Mechanism in Cu Filling Process by Electroplating for Ultra-Fine Trenches2012

    • Author(s)
      Y.Sasajima, T.Satoh,K. Tamahashi and J.Onuki
    • Journal Title

      Mater. Trans

      Volume: 53巻 Pages: 1507-1514

    • Peer Reviewed
  • [Journal Article] Effect of Additive-Free Plating and High Heating Rate Annealing on the Formation of Low Resistivity Fine Cu Wires2011

    • Author(s)
      J.Onuki, K.Tamahashi, T.Namekawa, Y.Sasajima
    • Journal Title

      Materials Trans.

      Volume: 52巻 Pages: 1818-1823

    • Peer Reviewed
  • [Journal Article] Effect of the Purity of Plating Materials on the Reduction of Resistivity of Cu Wires for Future LSIs2010

    • Author(s)
      J.Onuki, S.Tashiro, K. P. Khoo, N. Ishikawa, Y.Chonan, T.Kimura, H. Akahoshi
    • Journal Title

      J.Electrochem.Soc.

      Volume: 157巻 Pages: H857-H862

    • Peer Reviewed
  • [Journal Article] Reduction in resistivity of 50nm wide Cu wire by high heating rate and short time annealing utilizing misorientation energy2010

    • Author(s)
      J.Onuki, K.P.Khoo, Y.Sasajima, Y.Chonan, T.Kimura
    • Journal Title

      J.Appl.Phys.

      Volume: 108巻 Pages: 044302 1-044302 7

    • Peer Reviewed
  • [Presentation] 第52回谷川・ハリス賞受賞記念講演 環境対応高温半導体用独創的配線・実装材料の開発に関する研究2013

    • Author(s)
      大貫 仁
    • Organizer
      日本金属学会
    • Place of Presentation
      東京理科大学
    • Year and Date
      2013-03-27
  • [Presentation] LSI用微細Cu配線材料のナノ粒界評価技術2012

    • Author(s)
      大貫 仁
    • Organizer
      日本金属学会
    • Place of Presentation
      愛媛大学
    • Year and Date
      2012-09-18
  • [Remarks] 新聞発表2件(日刊工業新聞)

  • [Remarks] 解説記事2件

  • [Patent(Industrial Property Rights)] 半導体集積回路装置及びその製造方法並びに該半導体集積回路装置に使用する低抵抗率銅配線の探索方法2013

    • Inventor(s)
      大貫, 篠嶋, 永野, 玉橋, 千葉
    • Industrial Property Rights Holder
      茨城大学
    • Industrial Property Number
      特願2013-101708
    • Filing Date
      2013-05-13

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Published: 2014-08-29   Modified: 2015-05-13  

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