2010 Fiscal Year Final Research Report
Development of a new Chemical Mechanical Polishing (CMP) machine, assisted by the photocatalytic reactions and electrolytic actions in the atmosphere controlled sealed CMP chamber
Project/Area Number |
20246033
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Research Category |
Grant-in-Aid for Scientific Research (A)
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Allocation Type | Single-year Grants |
Section | 一般 |
Research Field |
Production engineering/Processing studies
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Research Institution | Kyushu University |
Principal Investigator |
DOI Toshiro Kyushu University, 大学院・工学研究院, 教授 (30207675)
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Co-Investigator(Kenkyū-buntansha) |
KUROKAWA Syuhei 九州大学, 大学院・工学研究院, 准教授 (90243899)
UMEZAKI Yoji 九州大学, 大学院・工学研究院, 助教 (70038066)
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Project Period (FY) |
2008 – 2010
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Keywords | CMP / 密閉型加工 / 密閉雰囲気 / 光触媒反応 / Si / SiC / 加工レート |
Research Abstract |
Based on the characteristics and mechanism of CMP (Chemical Mechanical Polishing) obtained through the experiments, we have designed and manufactured a prototype of a sealed, bell-jar shaped, both-side simultaneous CMP machine. This innovative machine, assisted by the photocatalytic reactions inside the sealed Bell-Jar chamber while ultra-violet being applied, has realized integration of high efficiency CMP and both-side simultaneous polishing into one machine. This integrated machine provides 4.5 times higher polishing efficiency with hard-to-process SiC wafers than that of the conventional machine, and consequently, is drawing attentions from the industries as next generation CMP machine.
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[Journal Article] Basic Characteristics of a Simultaneous Double-side CMP Machine, Housed in a Sealed,Pressure-Resistance Container2010
Author(s)
K.Kitamura, T.Doi, S.Kurokawa, Y.Umezaki, Y.Matsukawa, Y.Ooki, T.Hasegawa, I.Koshiyama, K.Ichikawa, Y.Nakamura
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Journal Title
Key Engineering Materials Vols.447-448
Pages: 61-65
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[Presentation] Si CMP with a Sealed "Bell-Jar" Type CMP Machine -Proc. Characteristics of Si-CMP, Influenced by the Processing Atmosphere and Additives Dispersed in the Slurry-2008
Author(s)
T.Kihara, T.Doi, S.Kurokawa, Y.Ooki, Y.Umezaki, Y.Matsukawa, K.Ichikawa, I.Koshiyama, H.Kohno
Organizer
The 5^<th> International Symposium on Advanced Science and Technology of Silicon Materials
Place of Presentation
Kona, Hawaii (USA)
Year and Date
20081110-20081114
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