2010 Fiscal Year Final Research Report
Crystallographic study of superfine step coverage in Supercritical Cu nanoplating
| Project/Area Number |
20360325
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| Research Category |
Grant-in-Aid for Scientific Research (B)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Material processing/treatments
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| Research Institution | Tokyo Institute of Technology |
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Principal Investigator |
SONE Masato Tokyo Institute of Technology, 精密工学研究所, 准教授 (30323752)
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| Co-Investigator(Kenkyū-buntansha) |
HIGO Yakichi 東京工業大学, 精密工学研究所, 教授 (30016802)
ISHIYAMA Chiemi 東京工業大学, 精密工学研究所, 助教 (00311663)
SHIBATA Akinobu 京都大学, 工学研究科, 助教 (60451994)
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| Project Period (FY) |
2008 – 2010
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| Keywords | 精密造形プロセス |
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| Research Abstract |
We developed a new electroplating technology, "Supercritical Nanoplating (SNP)" that combines the merits of traditional electroplating and supercritical CO_2 techniques and can provide high uniform metal films. Moreover, we applied nanoparticle technology into SNP in order to conduct integrated circuit wiring, and denoted it as modified-SNP (M-SNP). The aim of this project is to clarify these elemental phenomena and extend crystallographic study of superfine step coverage of integrated circuit wiring. In this project, we succeeded in wiring Cu into ・60nm hole with high aspect ratio, and found that the wired Cu formed single crystal without void.
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