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2010 Fiscal Year Final Research Report

Development of High Response Shape Memory Alloy Micro-Actuator Material

Research Project

  • PDF
Project/Area Number 20560083
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeSingle-year Grants
Section一般
Research Field Materials/Mechanics of materials
Research InstitutionUniversity of Hyogo

Principal Investigator

INOUE Shozo  University of Hyogo, 大学院・工学研究科, 教授 (50193587)

Co-Investigator(Renkei-kenkyūsha) NAMAZU Takahiro  兵庫県立大学, 大学院・工学研究科, 准教授 (90347526)
Project Period (FY) 2008 – 2010
Keywords形状記憶合金 / 薄膜 / マイクロアクチュエータ / スパッタリング
Research Abstract

In order to improve the response speed of Ti-Ni shape memory alloy micro-actuator, we have investigated the mechanical properties of Ti-Ni-X ternary alloy thin films prepared by sputtering. It is confirmed that the 15at% addition of Cu into Ti-Ni alloy is effective to increase their critical stress against plastic deformation and to have a faster actuator response. Furthermore, the diaphragm type micro-actuator using this material showed an actuation response to a pulse current of more than 200Hz.

  • Research Products

    (8 results)

All 2011 2010 2009 2008

All Journal Article (3 results) Presentation (5 results)

  • [Journal Article] Effect of Cu content on the shapememory behavior of Ti-Ni-Cu alloy thinfilms prepared by triple-source dcmagnetron sputtering, Thin Solid2010

    • Author(s)
      K. Hori, T.Namazu, S.Inoue
    • Journal Title

      Films Vol.518

      Pages: S26-S28

  • [Journal Article] Shape Memory Behavior of Ti-Ni-X (X= Pd, Cu) Ternary Alloy Thin Films Prepared by Triple-Source DC Magnetron Sputtering2010

    • Author(s)
      S.Inoue, K. Hori, N. Sawada, N. Nakamoto, T.Namazu
    • Journal Title

      Materials Science Forum Vol.638-642

      Pages: 2068-2073

  • [Journal Article] 非平衡スパッタリング法によるTi-Ni 形状記憶合金薄膜の作製とその通電加熱に伴う形状記憶挙動2008

    • Author(s)
      井上尚三, 生津資大, 小寺澤啓司
    • Journal Title

      J.Vac.Soc.Jpn. Vol.51

      Pages: 312-315

  • [Presentation] Effect of Substrate Temperature on the Shape Memory Behavior of Ti-Ni-Cu Ternary Alloy Sputtered Films2011

    • Author(s)
      井上尚三, 森野勝, 吉木啓介, 生津資大
    • Organizer
      Thermec '2011
    • Place of Presentation
      Quebec, Canada(Invited)(Accepted)
    • Year and Date
      2011-08-04
  • [Presentation] Ti-Ni-Cu 合金薄膜をアクチュエータとして用いたマイクロデバイスの作製とその動作評価2011

    • Author(s)
      森野勝, 工藤史明, 陣内耕太, 吉木啓介, 生津資大, 井上尚三
    • Organizer
      精密工学会2011年度春季学術講演会
    • Place of Presentation
      東洋大学(ただし、東日本大震災のため中止)
    • Year and Date
      2011-03-16
  • [Presentation] Ti-Ni-Cu スパッタ薄膜の結晶性と形状記憶挙動におよぼす成膜時の基板温度の影響2010

    • Author(s)
      森野勝也, 吉木啓介, 生津資大, 井上尚三
    • Organizer
      精密工学会2010 年度秋季学術講演会
    • Place of Presentation
      名古屋大学
    • Year and Date
      2010-09-27
  • [Presentation] Ti-Ni 系形状記憶合金薄膜の抵抗加熱によるアクチュエータ特性の評価2009

    • Author(s)
      中本直希, 澤田直樹, 堀晃輔, 生津資大,井上尚三
    • Organizer
      精密工学会2009年度春季学術講演会
    • Place of Presentation
      中央大学
    • Year and Date
      2009-03-11
  • [Presentation] Ti-Ni-Cu合金スパッタ薄膜の形状記憶特性に及ぼすCu 組成の影響2008

    • Author(s)
      堀晃輔, 生津資大, 井上尚三
    • Organizer
      精密工学会2008年度秋季学術講演会
    • Place of Presentation
      東北大学
    • Year and Date
      2008-09-17

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Published: 2012-01-26   Modified: 2016-04-21  

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