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2010 Fiscal Year Final Research Report

Clarification and Emergence of Self-replication Phenomena in Microelectronic Materials

Research Project

  • PDF
Project/Area Number 20560671
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeSingle-year Grants
Section一般
Research Field Material processing/treatments
Research InstitutionOsaka University

Principal Investigator

YASUDA Kiyokazu  Osaka University, 工学研究科, 講師 (00210253)

Co-Investigator(Kenkyū-buntansha) FUJIMOTO Kozo  大阪大学, 大学院・工学研究科, 教授 (70135664)
MATSUSHIMA Michiya  大阪大学, 大学院・工学研究科, 助教 (90403154)
Project Period (FY) 2008 – 2010
Keywords微細加工 / 微細接続 / マイクロ接合 / ぬれ / 表面張力 / 自己形成 / 自己組織化 / はんだ
Research Abstract

In order to make a batch of multi-point fine bumps (protruding electrodes) as the fundamental electrode structure of electronic devices, self-formation method was conducted. With a micro optical recording by a CCD camera, the observation of the wetting behavior of fine molten droplets on metal electrodes and morphological evaluation of bumps were conducted for the proper condition of the self-formation process.

  • Research Products

    (12 results)

All 2011 2010 2009 2008 Other

All Journal Article (3 results) (of which Peer Reviewed: 3 results) Presentation (8 results) Remarks (1 results)

  • [Journal Article] Self-replicating process for micro interconnect array pattern using solder/polymer hybrid materials, Transactions on Components2011

    • Author(s)
      安田清和
    • Journal Title

      Packaging and Manufacturing technology (accepted)

    • Peer Reviewed
  • [Journal Article] Sn-Biはんだ粒子-シリコーン混合系による自己形成マイクロバンブの観察2011

    • Author(s)
      雨森則人, 安田清和, 高井治
    • Journal Title

      第17回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 17

      Pages: 253-256

    • Peer Reviewed
  • [Journal Article] Solder Filler Motion Driven by Interfacial Tension in Self-Organization Assembly Process2009

    • Author(s)
      安田清和
    • Journal Title

      J.Solid Mechanics and Materials Engineering 3,12

      Pages: 1356-1362

    • Peer Reviewed
  • [Presentation] はんだ-高分子ハイブリッド材によるマイクロ接続のための自己形成プロセス2011

    • Author(s)
      安田清和
    • Organizer
      第25回エレクトロニクス実装学会講演大会
    • Place of Presentation
      横浜国立大学(横浜市)
    • Year and Date
      2011-03-10
  • [Presentation] Smart Processing for Micro Interconnects by Self-Replication2010

    • Author(s)
      安田清和
    • Organizer
      Proceedings of Materials Science and Technology (MS&T2010)
    • Place of Presentation
      Houston
    • Year and Date
      2010-10-21
  • [Presentation] 低融点はんだ-高分子混合系における巨視的自己形成プロセスの解析2010

    • Author(s)
      雨森則人, 高井治, 安田清和
    • Organizer
      第20回マイクロエレクトロニクスシンポジウム
    • Place of Presentation
      立命館大学(草津市)
    • Year and Date
      2010-09-10
  • [Presentation] Process Design of Self-Replication for Micro Bump Formation2010

    • Author(s)
      安田清和
    • Organizer
      IEEE CPMT Symposium Japan (10th VLSI Packaging Workshop in Japan)
    • Place of Presentation
      Tokyo
    • Year and Date
      2010-08-25
  • [Presentation] Self-Replicating Process for Micro Interconnect Array Pattern Using Solder/Polymer Hybrid Materials2010

    • Author(s)
      安田清和
    • Organizer
      The 60th Electronic (3 Components & Technology Conference 2010 (ECTC2010)
    • Place of Presentation
      Las Vegas
    • Year and Date
      2010-06-04
  • [Presentation] Micro Bump Formation by Self-Replication Method2010

    • Author(s)
      安田清和
    • Organizer
      International Conference on Electronics Packaging 2010 (ICEP2010)
    • Place of Presentation
      Sapporo
    • Year and Date
      2010-05-13
  • [Presentation] Filler Motion Dynamics in Resin for Flip Chip Micro Interconnects2009

    • Author(s)
      K.Ohta, K.Fuiimoto, M.Matsushima, K.Yasuda
    • Organizer
      International Conference on Electronics Packaging 2009 (ICEP2009)
    • Place of Presentation
      Kyoto
    • Year and Date
      20090415-20090416
  • [Presentation] Effect of Fluxing Activation on the Formation of Bubbles in Self-Organization Joining (invited)2008

    • Author(s)
      Kiyokazu Yasuda, Masao Toya, Michiva Matsushima, Kozo Fuiimoto
    • Organizer
      The 8th International Welding Symposium
    • Place of Presentation
      Kyoto
    • Year and Date
      2008-11-17
  • [Remarks] ホームページ等

    • URL

      http://kenpro.mynu.jp:8001/Profiles/006_3/0006300/profile.html

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Published: 2012-01-26   Modified: 2016-04-21  

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