2009 Fiscal Year Final Research Report
Slicing of silicon by direct irradiation of laser beam transmitted through optical fiber
| Project/Area Number |
20760082
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| Research Category |
Grant-in-Aid for Young Scientists (B)
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| Allocation Type | Single-year Grants |
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| Research Field |
Production engineering/Processing studies
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| Research Institution | Tokyo Institute of Technology |
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Principal Investigator |
HIDAI Hirofumi Tokyo Institute of Technology, 大学院・理工学研究科, 助教 (60313334)
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| Project Period (FY) |
2008 – 2009
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| Keywords | レーザ / ファイバ / スライス |
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| Research Abstract |
Solar cells and semiconductor substrates are manufactured by sliding ingots. Nowadays ingots are sliced by wire saw. Kerf loss by the slicing was approximately half of the ingots and the reduction of kerf loss is strongly required. In this project the reduction of karf loss was tried by using the laser light delivered through optical fibers.
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