2022 Fiscal Year Final Research Report
Viscoelastic Effect of Grinding Wheel Bonding Agent in Ultra-Precision Grinding of Next-Generation Semiconductor Materials
| Project/Area Number |
20K04193
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Multi-year Fund |
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| Section | 一般 |
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| Review Section |
Basic Section 18020:Manufacturing and production engineering-related
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| Research Institution | Okayama University |
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Principal Investigator |
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| Co-Investigator(Kenkyū-buntansha) |
児玉 紘幸 岡山大学, 自然科学研究科, 講師 (60743755)
大西 孝 岡山大学, 自然科学研究科, 助教 (90630830)
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| Project Period (FY) |
2020-04-01 – 2023-03-31
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| Keywords | SiC / 研削 / 熱可塑性樹脂 / 表面粗さ |
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| Outline of Final Research Achievements |
By grinding SiC wafers with a prototype diamond grindstone with a thermoplastic resin binder, sub-nanometer surface roughness, which could not be obtained with a grindstone with an existing binder of the same grain size, can be obtained. In addition, in grinding with the prototype wheel, the temperature of the wheel surface during grinding affects the grinding characteristics. Since the trial grinding wheel is non-porous, it is necessary to consider a dressing method for forming chip pockets on the grinding wheel surface.
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| Free Research Field |
精密加工学
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| Academic Significance and Societal Importance of the Research Achievements |
熱可塑性樹脂を砥石結合剤に用いることによって，同程度の粒度の既存結合剤砥石に比べてSiCウエハの表面粗さをかなり小さくできることはこれまでに報告されておらず，次世代半導体ウエハの高能率高精度加工技術開発につながる知見である．
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