Elucidating the deposition and film formation mechanism of plasma-assisted aerosol deposition (PAD) process

2020 Fiscal Year Research-status Report

• Project/Area Number: 20K05161
• Research Institution: National Institute of Advanced Industrial Science and Technology
• Principal Investigator: SHAHIEN Mohammed 国立研究開発法人産業技術総合研究所, エレクトロニクス・製造領域, 研究員 (90868746)
• Project Period (FY): 2020-04-01 – 2023-03-31
• Keywords: Deposition mechanism / Plasma assistance AD / Single particle

Outline of Annual Research Achievements

Ｐｌａｓｍａ　ａｓｓｉｓｔａｎｃｅ　ａｅｒｏｓｏｌ　ｄｅｐｏｓｉｔｉｏｎ　（ＰＡＤ）　ｉｓ　ａ　ｃｏａｔｉｎｇ　ｔｅｃｈｎｏｌｏｇｙ　ｃｏｎｓｉｓｔ　ｏｆ　ｐｌａｓｍａ　ａｓｓｉｓｔａｎｃｅ　ａｎｄ　ｆｉｎｅ　ｐａｒｔｉｃｌｅｓ　ｄｅｐｏｓｉｔｉｏｎ　ｕｎｄｅｒ　ｖｅｒｙ　ｈｉｇｈ　ｓｐｅｅｄ．　Ｔｈｅ　ｍｅｃｈａｎｉｓｍ　ｏｆ　ＰＡＤ　ｐｒｏｃｅｓｓ　ｉｓ　ｓｉｇｎｉｆｉｃａｎｔｌｙ　ｒｅｌａｔｅｄ　ｔｏ　ｔｈｅ　ｒｅｌａｔｉｏｎ　ｂｅｔｗｅｅｎ　ｔｈｅ　ｐｌａｓｍａ　ｓｐｅｃｉｅｓ　ａｎｄ　ｔｈｅ　ｆｉｎｅ　ｐａｒｔｉｃｌｅｓ．　Ｔｏ　ｅｌｕｃｉｄａｔｅ　ｔｈｅ　ＰＡＤ　ｍｅｃｈａｎｉｓｍ　２　ｓｙｓｔｅｍｓ　ｈａｄ　ｂｅｅｎ　ｓｕｃｃｅｓｓｆｕｌｌｙ　ｄｅｖｅｌｏｐｅｄ：　１－　Ｏｐｔｉｃａｌ　ｅｍｉｓｓｉｏｎ　ｓｐｅｃｔｒｏｓｃｏｐｙ　ａｎａｌｙｓｉｓ　ｆｏｒ　ｅｌｕｃｉｄａｔｉｎｇ　ｔｈｅ　ｐｌａｓｍａ　ｄｉａｇｎｏｓｔｉｃｓ　（ｔｅｍｐｅｒａｔｕｒｅ　ａｎｄ　ｐｌａｓｍａ　ａｃｔｉｖｅ　ｓｐｅｃｉｅｓ）　ａｎｄ　ｉｎｖｅｓｔｉｇａｔｅ　ｔｈｅ　ｉｎｆｌｕｅｎｃｅ　ｏｆ　Ｐｌａｓｍａ　ｐｏｗｅｒ　ｏｎ　ｔｈｅ　ｐｌａｓｍａ　ｄｉａｇｎｏｓｔｉｃｓ．
２－　Ｄｅｖｅｌｏｐｍｅｎｔ　ｏｆ　ａｎ　ｅｌｅｃｔｒｏｓｔａｔｉｃ　ｐｒｅｃｉｐｉｔａｔｏｒ　ｓｙｓｔｅｍ　ｕｎｄｅｒ　ｔｈｅ　ｖａｃｕｕｍ　ｔｏ　ｃｏｌｌｅｃｔ　ｔｈｅ　Ｓｉｎｇｌｅ　ｆｉｎｅ　ｐａｒｔｉｃｌｅｓ　ｄｕｒｉｎｇ　ｆｌｉｇｈｔ　ｂｅｆｏｒｅ　ｉｍｐａｃｔ　ｏｎ　ｓｕｂｓｔｒａｔｅ．　Ｔｈｅ　ｐｌａｓｍａ　ｉｎｔｅｒａｃｔｉｏｎ　ｗｉｔｈ　ｆｉｎｅ　ｐａｒｔｉｃｌｅ　ｋｉｎｅｔｉｃｓ　ａｎｄ　ｃｈａｒａｃｔｅｒｉｓｔｉｃｓ　ｄｕｒｉｎｇ　ｉｎｆｌｉｇｈｔ　ｃａｎ　ｂｅ　ｉｎｖｅｓｔｉｇａｔｅｄ．

Current Status of Research Progress

2: Research has progressed on the whole more than it was originally planned.

Reason

The processing is going steady to clarify the PAD mechanism by elucidating the inflight plasma-assistance and adhesion mechanisms of the individual single particle (starting coating build-up unit). The single particles picked up inflight by using the developed electrostatic precipitator system before impact on substrate and investigate plasma interaction with inflight particle kinetics and characteristics

Strategy for Future Research Activity

Elucidating the deformability of the collected single particle after PAD spraying by using in-situ compression.
Investigating the adhesion phenomenon, bonding mechanism of the 1st single particle with the substrate via deposition of only single particle on the substrate by using multi-layer high speed shutter. Followed by quantitative evaluation of the deposited particle Adhesion strength and peeling behavior by using a nano scratch test. Microstructure observation of the cross-section of the deposited single particle. Investigating the particle-substrate interface at atomic level to investigate the factors of interfacial bonding of solid ceramic particle. Chemical analysis of substrate surface before and after particle impacting to fully elucidate the adhesion phenomenon and bonding.

Causes of Carryover

The order was postponed by the maker to next year.