2023 Fiscal Year Final Research Report
3-dimensional photolithography
Project/Area Number |
20K05289
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Research Category |
Grant-in-Aid for Scientific Research (C)
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Allocation Type | Multi-year Fund |
Section | 一般 |
Review Section |
Basic Section 28050:Nano/micro-systems-related
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Research Institution | Osaka Metropolitan University (2022-2023) Osaka Prefecture University (2020-2021) |
Principal Investigator |
Sasago Masaru 大阪公立大学, 大学院工学研究科, 客員研究員 (40727145)
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Co-Investigator(Kenkyū-buntansha) |
平井 義彦 大阪公立大学, 大学院工学研究科, 客員研究員 (50285300)
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Project Period (FY) |
2020-04-01 – 2024-03-31
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Keywords | フォトリソグラフィ / 3次元加工 / 波面 / 複素振幅 / マスク |
Outline of Final Research Achievements |
The three-dimensional structure was divided into seed elements, and complex amplitude wavefronts for imaging each element were calculated. The mask is irradiated with light to realize three-dimensional photolithography in which three-dimensional image structures are baked into the resist. A system was constructed to optimize the seed arrangement and complex amplitude distribution. As a result, the system was effective in reducing mutual interference in three-dimensionally intersecting patterns and in suppressing the generation of axial structures in ring and spiral structures. Based on this, exposure and development experiments of three-dimensional structures were conducted. As a result, three-dimensional structures were obtained in structures such as pyramid frame structures that were simply inclined without intersecting structuers.
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Free Research Field |
半導体微細加工
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Academic Significance and Societal Importance of the Research Achievements |
これまでの三次元微細加工では、一括露光による加工が不可能であったが、本研究で開発・検証した新しいフォトリソグラフィでは、従来の半導体リソグラフィとの整合性が図られた一括露光方式である。 従来のフーリエ光学理論を光学的に応用した新しい三次元結像方法を検証できた学術的意義とともに、現在欧米で研究開発が熾烈に展開されている半導体チップレット技術の中でも、このコアとなる半導体後工程、三次元半導体製造プロセスへの実装への産業応用が期待できる
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