Optimal design method for high-performance polishing pads based on the homogenization method

2022 Fiscal Year Final Research Report

• Project/Area Number: 20K14636
• Research Category: Grant-in-Aid for Early-Career Scientists
• Allocation Type: Multi-year Fund
• Review Section: Basic Section 18030:Design engineering-related
• Research Institution: The University of Tokyo
• Principal Investigator: Noguchi Yuki 東京大学, 大学院工学系研究科(工学部), 助教 (00845448)
• Project Period (FY): 2020-04-01 – 2023-03-31
• Keywords: トポロジー最適化 / 均質化法 / トポロジー導関数 / レイノルズ方程式 / 有限要素法

Outline of Final Research Achievements

In this research, we developed an optimal design method for polishing pads in the polishing process. In particular, we proposed a homogenization method to efficiently evaluate the pressure distribution for the structures with fine surface shapes, such as the textured structure of the polishing pad. By combining the proposed homogenization method and a topology optimization method, we could conduct optimal design of microscopic surface shapes to achieve the desired macroscopic pressure response. In addition, we constructed a topology optimization method for the fluid lubrication problem based on the Reynolds equation for a situation in which fluids such as water or lubricating oil are interposed between the wafer and polishing pad to be polished to reduce friction.

Free Research Field

構造最適化

Academic Significance and Societal Importance of the Research Achievements

近年、半導体デバイスや光学レンズ等、様々な部品の高精度化が進んでいる中、超精密研磨の需要が高まっている。研磨パッドは、研磨加工機の構成要素の中でもスラリーの保持や研磨屑を除去する役割を持ち、研磨面の仕上がりに強い影響を持つ。本研究で開発したトポロジー最適化法を研磨パッドの最適設計に援用することで、研磨性能の抜本的な向上のみではなく、パッドの多機能化や研磨プロセスの高効率化を目的としたパッド形状の具体的な設計案の創出が可能となる。研磨対象である半導体デバイスの微細化や大面積化がますます進んでいく中で、研磨加工機の高性能化や高効率化は重要な課題であり、本研究はものづくりに大きく貢献できると考える。