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2012 Fiscal Year Final Research Report

Next generation mesoplasma SIEMENS technology for direct production of wafer-equivalent thin film solar cells

Research Project

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Project/Area Number 21226017
Research Category

Grant-in-Aid for Scientific Research (S)

Allocation TypeSingle-year Grants
Research Field Material processing/treatments
Research InstitutionThe University of Tokyo

Principal Investigator

YOSHIDA Toyonobu  東京大学, 大学院・工学系研究科, 教授 (00111477)

Co-Investigator(Kenkyū-buntansha) KAMBARA Makoto  東京大学, 大学院・工学系研究科, 准教授 (80359661)
Co-Investigator(Renkei-kenkyūsha) TANAKA Yasunori  金沢大学, 工学部, 教授 (90303263)
SHIBUTA Yasushi  東京大学, 大学院・工学系研究科, 講師 (90401124)
Project Period (FY) 2009 – 2012
Keywordsメゾプラズマ / シリコン / エピタキシャル成長 / 太陽電池 / シーメンス法
Research Abstract

This project aims at the development of next generation mesoplasma SIEMENS technology for direct production of wafer-equivalent thin film solar cells. Special attentions were paid to understanding the mechanisms of the nano-cluster assisted fast rate epitaxy and also to an in-situ measurement of the absolute density of the excited atomic hydrogen, both of which are the core of the mesoplasma, together with the technological development of the cost effective production system. Based on these knowledge and understandings, we have proved the unique characteristics of mesoplasma CVD by demonstrating the ultrafast epitaxial deposition with high material yields that exceeds beyond the kinetics limit of the SIEMENS technology.

  • Research Products

    (16 results)

All 2013 2012 2011 2010 2009 Other

All Journal Article (6 results) (of which Peer Reviewed: 6 results) Presentation (8 results) Remarks (1 results) Patent(Industrial Property Rights) (1 results)

  • [Journal Article] Cavity ring down spectroscopy measurement of H(n=2) density in Mesoplasma for high rate silicon epitaxy2013

    • Author(s)
      S.D.Wu,H.Inoue,M.Kambara,and T.Yoshida
    • Journal Title

      Jpn.J.Appl.Phys.

      Volume: (in press)

    • Peer Reviewed
  • [Journal Article] Nanocluster dynamics in fast rate epitaxy under mesoplasma condition2013

    • Author(s)
      L.W.Chen,Y.Shibuta,M.Kambara,and T.Yoshida
    • Journal Title

      Chem.Phys.Lett.

      Volume: 564 Pages: 47-53

    • URL

      http://dx.doi.org/10.1016/j.cplett.2013.02.005

    • Peer Reviewed
  • [Journal Article] Super high-Rate Epitaxial Silicon Thick Film Deposition from Trichlorosilane by Mesoplasma Chemical Vapor Deposition2013

    • Author(s)
      S.D.Wu,M.Kambara,T.Yoshida
    • Journal Title

      Plasma Chem Plasma Process

      Volume: 33 Pages: 433-451

    • URL

      http://dx.doi.org/10.1007/s11090-013-9439-7

    • Peer Reviewed
  • [Journal Article] Molecular dynamics simulation of Si nanoclusters in high rate and low temperature epitaxy2012

    • Author(s)
      L.W.Chen,Y.Shibuta,M.Kambara,and T.Yoshida
    • Journal Title

      J.Appl.Phys.

      Volume: 111 Pages: 123301-123306

    • URL

      http://dx.doi.org/10.1063/1.4729057

    • Peer Reviewed
  • [Journal Article] Low temperature silicon epitaxy from trichlorosilane via mesoplasma chemical vapor deposition2011

    • Author(s)
      J.Fukuda,M.Kambara,and T.Yoshida
    • Journal Title

      Thin Solid Films

      Volume: 519 Pages: 6759-6762

    • URL

      http://dx.doi.org/10.1016/j.tsf.2011.01.216

    • Peer Reviewed
  • [Journal Article] Evolution of surface morphology with hydrogen dilution during silicon epitaxy by mesoplasma CVD2009

    • Author(s)
      J.M.A.Diaz,M.Kambara,and T.Yoshida
    • Journal Title

      IEEE Transactions on Plasma Science

      Volume: 37 Pages: 1723-1729

    • DOI

      DOI:10.1109/TPS.2009.2024780

    • Peer Reviewed
  • [Presentation] Innovation of plasma spray technology2012

    • Author(s)
      T.Yoshida
    • Organizer
      <12>^ European Plasma Conference, HTPP-12 (Plenary lecture)
    • Place of Presentation
      Bologna,Italy.
    • Year and Date
      20120624-29
  • [Presentation] Mesoplasma CVD for fast rate and high yield Si Epitaxy (Plenary lecture)2012

    • Author(s)
      M.Kambara,L.W.Chen,S.D.Wu,T.Yoshida
    • Organizer
      IUMRS-ECEM 2012
    • Place of Presentation
      Yokohama.
    • Year and Date
      2012-09-26
  • [Presentation] Cluster assisted mesoplasma CVD for high rate and high yield silicon epitaxy (invited)2011

    • Author(s)
      M.Kambara,L.W.Chen,S.D.Wu,T.Yoshida
    • Organizer
      Thermec 2011
    • Place of Presentation
      Quebec,Canada.
    • Year and Date
      20110731-0804
  • [Presentation] Innovative Plasma Spray Technology for advanced coatings (Invited)2010

    • Author(s)
      T.Yoshida
    • Organizer
      <35>^ ICACC (Int.Conf.Adv. Ceram.Compo.)
    • Place of Presentation
      Daytona Beach,USA.
    • Year and Date
      2010-11-27
  • [Presentation] Innovation of Plasma Spray Technology (Plenary)2010

    • Author(s)
      T.Yoshida
    • Organizer
      3^ PLACIA&PLAM
    • Place of Presentation
      Nagoya.
    • Year and Date
      2010-11-17
  • [Presentation] High yield silicon deposition under mesoplasma condition for a next generation Siemens technology (oral)2010

    • Author(s)
      M.Kambara and T.Yoshida
    • Organizer
      SCSI (Silicon for Chem.Solar Ind.)
    • Place of Presentation
      Alesund, Norway.
    • Year and Date
      2010-06-28
  • [Presentation] メゾプラズマ高速エピタキシー(招待講演)2009

    • Author(s)
      神原淳
    • Organizer
      第一回薄膜太陽電池セミナー
    • Place of Presentation
      岐阜.
    • Year and Date
      2009-10-28
  • [Presentation] A new route for high rate and low temperature epitaxy by cluster assisted mesoplasma CVD (Invited)2009

    • Author(s)
      M.Kambara,J.M.A.Diaz,T.Yoshida
    • Organizer
      Thermec
    • Place of Presentation
      Berlin,Germany.
    • Year and Date
      2009-08-27
  • [Remarks] ホームページ上での成果公開

    • URL

      http://www.plasma.t.u-tokyo.ac.jp/jp/kiban-s/meso-siemens.html

  • [Patent(Industrial Property Rights)] 熱プラズマ CVD によるシリコン薄膜の堆積方法及びその装置2011

    • Inventor(s)
      吉田豊信 他 3 名
    • Industrial Property Number
      特願2000-238074,特許第4743730号
    • Filing Date
      2011-05-20

URL: 

Published: 2014-08-29  

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