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2010 Fiscal Year Annual Research Report

ナノ組織制御薄膜応用遠隔動ひずみ分布計測システム

Research Project

Project/Area Number 21246021
Research InstitutionTohoku University

Principal Investigator

三浦 英生  東北大学, 大学院・工学研究科, 教授 (90361112)

Co-Investigator(Kenkyū-buntansha) 鈴木 研  東北大学, 大学院・工学研究科, 助教 (40396461)
Keywordsひずみ / 計測 / 非破壊検査 / カーボンナノチューブ / 電気伝導 / 分子動力学 / 第一原理
Research Abstract

本研究では,実社会の多様な構造物,特に回転体や運動体の動ひずみのオンラインモニタリングを可能とし,安全で安心な社会基盤の構築とその健全性評価の実現を目的に,多層カーボンナノチューブ(Multi-Walled Carbon Nano Tube:MWCNT)のみを使用し,その配向性を制御して樹脂薄膜中に分散させる技術を開発し,安定した高感度(ゲージ率>1000)の実現と,動ひずみを10ppm以下の分解能で実時間非接触測定する技術とその具体的な測定システムを開発することを目的としている.
本年度は,超高感度(ゲージ率>1000)を実現するための多層カーボンナノチューブ(MWCNT)の配列制御して成長させる薄膜作製技術の確立を目標とし,アークプラズマ法を用いた成長核形成技術と,化学気相蒸着(CVD)法応用したMWCNT成長技術を開発した.MWCNTを成長させる結晶核と成長法の組み合わせを実験的に検討し,1)一軸超高感度ひずみセンサに好適な直線型MWCNTと,等方的ひずみセンサに好適なランダム形状屈曲型MWCNTを成長させる環境条件(初期の核種元素とその膜厚,CVDガス圧,流量と反応基板温度等)を定量的に明らかにするとともに,2)ひずみ負荷環境において樹脂分散型MWCNTの複素インピーダンスの周波数依存性を測定し,数10kHzから数100kHzの範囲で虚数項が高いひずみ感度を有することなどを定量的に明らかにした.
また,遠隔ひずみ計測法として,半導体レーザ素子の発光スペクトル(発光中心波長とその半価幅)のひずみ依存性に着目した動ひずみ計測システムの開発にも成功するなど,今年度の当初目標を達成した.

  • Research Products

    (16 results)

All 2011 2010 Other

All Journal Article (7 results) (of which Peer Reviewed: 7 results) Presentation (8 results) Remarks (1 results)

  • [Journal Article] Nanostructure Dependence of the Electronic Conductivity of Carbon Nanotubes and Grapheme Sheets2011

    • Author(s)
      Masato Ohnishi, Katsuya Ohsaki, Yusuke Suzuki, Ken Suzuki, Hideo Miura
    • Journal Title

      Proc.of 2010 ASME International Mechanical Engineering Congress and Exposition

      Volume: IMECE2010-37277 Pages: 1-6

    • Peer Reviewed
  • [Journal Article] Quantum Chemical Molecular Dynamics Study of Chemical Reaction Dynamics on Ni-base Alloy Surfaces in Gas-cooled Reactors2010

    • Author(s)
      Ken SUZUKI, Yoichi TAKEDA, Hideo MIURA
    • Journal Title

      Journal of Solid Mechanics and Materials Engineering

      Volume: 4 Pages: 1644-1653

    • Peer Reviewed
  • [Journal Article] Effect of the Mechanical Properties of Underfill on the Local Deformation and Residual Stress in a Chip Mounted by Area-Arrayed Flip Chip Structures2010

    • Author(s)
      Kohta Nakahira, Yuki Sato, Hiroki Kishi, Ken Suzuki, Hideo Miura
    • Journal Title

      Proc.of 11tn International conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro/Nanoelectronics and Systems

      Pages: 641-646

    • Peer Reviewed
  • [Journal Article] Nondestructive Evaluation of the Delamination of Fine Bumps in Three-Dimensionally Stacked Flip Chip Structures2010

    • Author(s)
      Yuhki Sato, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
    • Journal Title

      Proc.of the 60^<th> Electronic Components and Technology Conference

      Pages: 1951-1956

    • Peer Reviewed
  • [Journal Article] Remote Non-contact Strain Sensor Using Carbon Nanotube-dispersed Resin2010

    • Author(s)
      Yusuke Suzuki, Masato Ohnishi, Ken Suzuki, Hideo Miura
    • Journal Title

      Proc.of IMPACT Conference 2010

      Volume: AS015 Pages: 1-4

    • Peer Reviewed
  • [Journal Article] NONDESTRUCTIVE DETECTION OF OPEN FAILURES IN THREE-DIMENSIONALLY STACKED CHIPS MOUNTED BY AREA-ARRAYED FINE BUMPS2010

    • Author(s)
      Yuki Sato, Kohta Nakahira, Naokazu Murata, Ken Suzuki, Hideo Miura
    • Journal Title

      Proc.of 12^<th> International Conference on Electronics Materials and Packaging

      Pages: 117-123

    • Peer Reviewed
  • [Journal Article] REMOTE DYNAMIC STRAIN MEASUREMENT USING VERTICAL CAVITY SURFACE EMITTING LASER2010

    • Author(s)
      Yusuke Ohashi, Aya Kaisumi, Atsushi Kitamura, Ken Suzuki, Hideo Miura
    • Journal Title

      Proc.of 12^<th> International Conference on Electronics Materials and Packaging

      Pages: 131-136

    • Peer Reviewed
  • [Presentation] マイクロひずみ分布センサチップによる実装応力(ひずみ)の評価2010

    • Author(s)
      三浦英生
    • Organizer
      エレクトロニクス実装学会2010ワークショップ
    • Place of Presentation
      静岡
    • Year and Date
      2010-10-29
  • [Presentation] NONDESTRUCTIVE DETECTION OF OPEN FAILURES IN THREE-DIMENSIONALLY STACKED CHIPS MOUNTED BY AREA-ARRAYED FINE BUMPS2010

    • Author(s)
      Yuki Sato, Kohta Nakahira, Naokazu Murata, Ken Suzuki, Hideo Miura
    • Organizer
      12^<th> International Conference on Electronics Materials and Packaging, Proceedings
    • Place of Presentation
      Singapore Singapore
    • Year and Date
      2010-10-27
  • [Presentation] Mechanical Reliability of 3D Stacked Silicon Chips2010

    • Author(s)
      Hideo Miura
    • Organizer
      The 9^<th> International Symposium on Microelectronics and Packaging
    • Place of Presentation
      Seoul.Korea
    • Year and Date
      2010-10-04
  • [Presentation] Improvement of the Interface Integrity between a High-k Dielectric Film and a Metal Gate Electrode by Controlling Point Defects and Residual Stress2010

    • Author(s)
      Ken Suzuki, Tatsuya Inoue, Hideo Miura
    • Organizer
      15^<th> International Conference on Simulation of Semiconductor Processes and Devices
    • Place of Presentation
      Bologna, Italy
    • Year and Date
      2010-09-05
  • [Presentation] 異相界面の環境誘起劣化損傷の原子レベルシミュレーション2010

    • Author(s)
      三浦英生, 鈴木研
    • Organizer
      日本材料学会破壊力学部門公開委員会
    • Place of Presentation
      札幌
    • Year and Date
      2010-05-21
  • [Presentation] Dominant Structural Factors of the Local Deformation and Residual Stress of a Silicon Chip Mounted on Area-Arrayed Flip Chip Structures2010

    • Author(s)
      Kohta Nakahira, Naokazu Murata, Yuhki Sato, Ken Suzuki, Hideo Miura
    • Organizer
      International Conference on Electronics Packaging 2010
    • Place of Presentation
      札幌
    • Year and Date
      2010-05-13
  • [Presentation] Quantum Chemical Molecular Dynamics Simulation of Oxidation Process on Clean Metal Surface in High Temperature Water2010

    • Author(s)
      Ken Suzuki, Hideo Miura
    • Organizer
      第133回破壊力学部門委員会講演会
    • Place of Presentation
      札幌
    • Year and Date
      2010-05-12
  • [Presentation] Effect of the Mechanical Properties of Underfill on the Local Deformation and Residual Stress in a Chip Mounted by Area-Arrayed Flip Chip Structures2010

    • Author(s)
      Kohta Nakahira, Yuki Sato, Hiroki Kishi, Ken Suzuki, Hideo Miura
    • Organizer
      11tn International conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro/Nanoelectronics and Systems
    • Place of Presentation
      Bordeaux, France
    • Year and Date
      2010-04-28
  • [Remarks]

    • URL

      http://www.miura.rift.mech.tohoku.ac.jp/home.htm

URL: 

Published: 2013-06-26  

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