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2011 Fiscal Year Final Research Report

Tin whisker growth mechanism in aerospace electronics and its mitigation

Research Project

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Project/Area Number 21246109
Research Category

Grant-in-Aid for Scientific Research (A)

Allocation TypeSingle-year Grants
Section一般
Research Field Material processing/treatments
Research InstitutionOsaka University

Principal Investigator

SUGANUMA Katsuaki  大阪大学, 産業科学研究所, 教授 (10154444)

Co-Investigator(Kenkyū-buntansha) KIM Keun-soo  大阪大学, 産業科学研究所, 助教 (90304857)
Research Collaborator NEMOTO Norio  独立行政法人宇宙航空研究開発機構, 安全信頼性推進部技術開発室, 技術領域リーダ
NAKAGAWA Tsuyoshi  日本アビオニクス株式会社, 情報システム事業部第二技術部, エキスパート
Project Period (FY) 2009-04-01 – 2013-03-31
Keywords電気接続・配線
Research Abstract

Tin whiskers is one of the serious issues for aeronautics and the growth mechanism has not been understood yet. In the present work, the influence of vacuum environment on whisker formation in thermal cycling was examined. It was found that whiskers grow thinner and longer in vacuum than in air and that oxidation of tin has great influence. The whisker growth mechanism not only in vacuum but also in air was clearly clarified.

  • Research Products

    (34 results)

All 2012 2011 2010 2009 Other

All Journal Article (16 results) (of which Peer Reviewed: 16 results) Presentation (14 results) Book (3 results) Remarks (1 results)

  • [Journal Article] Effect of crystal orientation on mechanically induced Sn whiskers on Sn-Cu plating2012

    • Author(s)
      Y. Mizuguchi, Y. Murakami, S. Tomiya, T. Asai, T. Kiga, K. Suganuma
    • Journal Title

      J. Electron. Mater

      Volume: 53[12](in press)

    • Peer Reviewed
  • [Journal Article] コンフォーマルコーティングによるウィスカ成長性抑制効果の評価2012

    • Author(s)
      中川 剛, 根本規生, 山田敏行, 菅沼克昭
    • Journal Title

      電子情報通信学会論文誌

      Volume: J95-C [11](in press)

    • Peer Reviewed
  • [Journal Article] 機械的応力により発生する Sn ウィスカにおける屈曲・湾曲部の形成と結晶方位の関係性2012

    • Author(s)
      水口由紀子, 村上洋介, 冨谷茂隆, 浅井正, 気賀智也, 菅沼克昭
    • Journal Title

      電子情報通信学会論文誌

      Volume: J95-C [11](in press)

    • Peer Reviewed
  • [Journal Article] Effect of crystal orientation on Sn whisker-free Sn-Ag-Cu plating2012

    • Author(s)
      Y . Mizuguchi, Y . Murakami, S. Tomiya, T .Asai, T . Kiga, K. Suganuma
    • Journal Title

      Mater. Trans

      Volume: (in press)

    • Peer Reviewed
  • [Journal Article] Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn-Ag-Cu/ Cu ball joints2012

    • Author(s)
      K. Lee, K.-S. Kim, K. Suganuma, Y . Tsukada, K.Yamanaka, S. Kuritani, M. Ueshima
    • Journal Title

      J.Mater.Res

      Volume: 26[3] Pages: 467-474

    • Peer Reviewed
  • [Journal Article] Effect of i ntermetallic growth rate on spontaneous whisker growth from a t in coating on copper2011

    • Author(s)
      A. Baated, K.-S. Kim, K. Suganuma
    • Journal Title

      J. Mater. Sci.Mater. Electron.

    • DOI

      doi:10.1007/s10854-011-0346-5.

    • Peer Reviewed
  • [Journal Article] Whiskergrowth behavior of Sn and Sn alloy lead-free finishes2011

    • Author(s)
      A. Baated, K.-S. Kim, K. Suganuma
    • Journal Title

      J. Electron. Mater.

      Volume: 40[11] Pages: 2278-2289

    • Peer Reviewed
  • [Journal Article] Sn whisker growth during thermal cycling2011

    • Author(s)
      K. Suganuma, A. Baated, K. -S. Kim, K.Hamasaki, N. Nemoto, T . Nakagawa, T . Yamada
    • Journal Title

      Acta Materialia

      Volume: 59[1] Pages: 7255-7267

    • Peer Reviewed
  • [Journal Article] Influence of crystallographic orientation of Sn-Ag- Cu on electromigration in flip-chip joint2011

    • Author(s)
      K. Lee, K.-S. Kim, K. Suganuma
    • Journal Title

      Microelectron. Reliab.

      Volume: 51[12] Pages: 2290-2297

    • Peer Reviewed
  • [Journal Article] Influence of indium addition on electromigration behavior of solder joint2011

    • Author(s)
      K. Lee, K.-S. Kim, K. Suganuma
    • Journal Title

      J. Mater. Res.

      Volume: 26[20] Pages: 2624-2631

    • Peer Reviewed
  • [Journal Article] 鉛フリーはんだ実装技術の高付加価値化、2011

    • Author(s)
      菅沼克昭
    • Journal Title

      ロボット

      Volume: No.203 Pages: 34-37

    • Peer Reviewed
  • [Journal Article] Whisker growth from an e lectroplated zinc coating2010

    • Author(s)
      A. Baated, K. -S. Kim, K. Suganuma
    • Journal Title

      J. Mater. Res.

      Volume: 25[11] Pages: 2175-2182

    • Peer Reviewed
  • [Journal Article] Effects of reflow atmosphere and flux on Sn whisker growth of Sn-Ag-Cu solders2010

    • Author(s)
      A. Baated, K.- S. Kim, K. Suganuma, S. Huang, B.Ju rcik , S. Nozawa, M. Ueshima
    • Journal Title

      J. Mater. Sci. Mater. Electron.

      Volume: 21 Pages: 1066-1075

    • Peer Reviewed
  • [Journal Article] 錫ウィスカ成長に及ぼす端子材の影響2010

    • Author(s)
      金 槿銖,菅沼克昭,寄門雄飛,李奇柱,阿龍恒,辻本雅宣
    • Journal Title

      銅と銅合金

      Volume: 49 Pages: 122-115

    • Peer Reviewed
  • [Journal Article] 宇宙分野におけるすずウィスカの影響2010

    • Author(s)
      根本規生、鈴木浩一、 中川 剛、山田敏行、菅沼克昭
    • Journal Title

      第23回秋季信頼性シンポジウム発表報文集、東京

      Pages: 15-18

    • Peer Reviewed
  • [Journal Article] 錫ウィスカ抑制技術2010

    • Author(s)
      金 槿銖、 菅沼克昭
    • Journal Title

      生産と技術

      Volume: Vol.62、No.3 Pages: 16-19

    • Peer Reviewed
  • [Presentation] Effect of crystal orientation on mechanically induced Sn whiskers of Sn-Cu platings2012

    • Author(s)
      Y. Mizuguchi, Y. Murakami, S Tomiya, T. Asai, T. Kiga, K. Suganuma
    • Organizer
      2012TMS Annual Meeting & Exhibition
    • Place of Presentation
      Orlando, FL, USA
    • Year and Date
      20120311-15
  • [Presentation] Behaviors of Sn surface with whisker generation after thermal cycle2011

    • Author(s)
      J.-L. Jo, K. Lee, K. Suganuma
    • Organizer
      International Symposium on materials Science and Innovation for Sustainable Society, Eco-Materials and Eco-innovation for Global Sustainability
    • Place of Presentation
      Osaka
    • Year and Date
      20111128-30
  • [Presentation] Growth mechanism of Sn whiskers in a vacuum and air with thermal cycling2011

    • Author(s)
      J.-L. Jo, K.-S. Kim, K. Suganuma
    • Organizer
      MS&T 2011, Ohio USA
    • Place of Presentation
      Ohio, USA
    • Year and Date
      20111016-20
  • [Presentation] Electromigration behavior of Sn-In lead-free solder alloy under high current stress2011

    • Author(s)
      K. Lee, K.-S. Kim, K. Suganuma
    • Organizer
      2011 TMS Annual Meeting & Exhibition
    • Place of Presentation
      San Diego, CA, USA
    • Year and Date
      20110227-0303
  • [Presentation] Whisker growth behavior in a high vacuum with thermal cycling2011

    • Author(s)
      K.-S. Kim, J.-L. Jo, K.-J. Lee, A. Baated, K.Suganuma, N. Nemoto, T. Nakagawa, Toshiyuki Yamada
    • Organizer
      2011 TMS Annual Meeting & Exhibition
    • Place of Presentation
      San Diego, CA, USA
    • Year and Date
      20110227-0303
  • [Presentation] Pb 微量添加による室温 Sn ウィスカ発生の抑制と組織的特徴2011

    • Author(s)
      趙 亭來, 濱崎 恭子, 菅沼克昭, 辻本 雅宣
    • Organizer
      日本金属学会2011 年秋季大会
    • Place of Presentation
      沖縄コンベンションセンター(沖縄)
    • Year and Date
      2011-11-07
  • [Presentation] whisker evaluation status for space applicatio2010

    • Author(s)
      T. Nakagawa, T. Yamada, N. Nemoto, K.Suganuma
    • Organizer
      4th International Symposium on Tin Whiskers
    • Place of Presentation
      Maryland
    • Year and Date
      20100623-24
  • [Presentation] Tin whisker evaluation status for space application2010

    • Author(s)
      N. Nemoto, T. Nakagawa, T. Yamada, K.Suganuma
    • Organizer
      4th International Symposium on Tin Whiskers
    • Place of Presentation
      Maryland
    • Year and Date
      20100623-24
  • [Presentation] Prevention technologies of whisker growth for reliable electronic products2010

    • Author(s)
      K. Suganuma
    • Organizer
      11thJIC meeting (Jisso International Council)
    • Place of Presentation
      Kyoto Japan
    • Year and Date
      20100326-28
  • [Presentation] 錫ウィスカ発生メカニズムと抑制策(招待講演)2010

    • Author(s)
      菅沼克昭
    • Organizer
      日本航空宇宙工業会素材専門委員会
    • Place of Presentation
      日本航空宇宙工業会(東京)
    • Year and Date
      2010-09-30
  • [Presentation] 鉛フリー実装は新たなステージへ~高信頼化のためのキーワード:ウィスカ、耐熱、更に高温/低温化へ~(招待講演)2010

    • Author(s)
      菅沼克昭
    • Organizer
      京都実装技術・信頼性研究会第五回例会
    • Place of Presentation
      京都府産業支援センター(京都)
    • Year and Date
      2010-03-16
  • [Presentation] めっき膜と界面の微細構造とウィスカ発生の関連、 電子実装ウィスカ防止技術フォーラム2010

    • Author(s)
      菅沼克昭
    • Organizer
      電子情報技術産業協会
    • Place of Presentation
      芝浦工業大学豊洲キャンパス(東京)
    • Year and Date
      2010-03-02
  • [Presentation] Effects of alloying on tin whisker growth and some finding on fatigue mechanism2010

    • Author(s)
      K. Suganuma
    • Organizer
      6th Lead-Free Solder and Technology Workshop:139th Annual Meeting & Exhibition
    • Place of Presentation
      Seattle
    • Year and Date
      2010-02-14
  • [Presentation] Room temperature whiskers, thermal cycling whiskers and alloying effects2009

    • Author(s)
      K. Suganuma, K.S. Kim, Y. Shimada, K. Yamamoto, T. Kudoh, N. Nakamura, H. Oshima, S. Hayashi
    • Organizer
      3rd International Symposium on Tin Whiskers
    • Place of Presentation
      Lyngby
    • Year and Date
      2009-06-23
  • [Book] Lead-Free Solders; Materials Reliability for Electronics, ed.by K. N. Subramanian2012

    • Author(s)
      K. Suganuma, Tin whiskers
    • Total Pages
      323-335
    • Publisher
      John Wiley and Sons Ltd
  • [Book] Sn ウィスカによる機器故障の歴史、フレキシブルプリント配線板の最新応用技術2009

    • Author(s)
      菅沼克昭
    • Total Pages
      133-142
    • Publisher
      CMC 出版
  • [Book] 環境調和型エレクトロニクスの信頼性向上2009

    • Author(s)
      菅沼克昭(監修)
    • Total Pages
      344
    • Publisher
      シーエムシー出版
  • [Remarks] ホームページ「鉛フリー相談室」において、ウィスカ現象など様々な技術相談を実施している。

    • URL

      http://www.eco.sanken.osaka-u.ac.jp/PbFree/

URL: 

Published: 2014-08-29  

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