2011 Fiscal Year Final Research Report
Development of High-speed Transportation Technology of Wafer in Vacuum Process applying the ERG Chuck
| Project/Area Number |
21360066
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| Research Category |
Grant-in-Aid for Scientific Research (B)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Production engineering/Processing studies
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| Research Institution | Keio University |
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Principal Investigator |
AOYAMA Tojiro 慶應義塾大学, 理工学部, 教授 (70129302)
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| Co-Investigator(Kenkyū-buntansha) |
KAKINUMA Yasuhiro 慶應義塾大学, 理工学部, 准教授 (70407146)
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| Project Period (FY) |
2009 – 2011
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| Keywords | 精密位置決め / 加工計測 / 半導体製造 |
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| Research Abstract |
The developed "Electro-rheological gel" has the unique ability to change the surface adhesive property according to an applied electric filed. In this research, the ERG is applied to the chucking device of wafer available for vacuum process and we have aimed at the enhancement of the efficiency in semiconductor process by using the ERG chucking device. The electro-adhesive chuck(EA Chuck) which enables fast-control of the fixing force by an applied voltage is successfully developed and attached to the end-effecter of the wafer transfer robot. From the experimental results of wafer transfer test in vacuum condition, it is clear that the accumulated position error can be extremely suppressed by less-than 0. 1mm at maximum transfer acceleration of 0. 5G.
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