2011 Fiscal Year Final Research Report
The void and mechanism of heat conduction by thermal phonon in liquids
| Project/Area Number |
21540382
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Mathematical physics/Fundamental condensed matter physics
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| Research Institution | Niigata University |
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Principal Investigator |
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| Project Period (FY) |
2009 – 2011
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| Keywords | 物性基礎論 |
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| Research Abstract |
The mean free path of thermal carrier in liquid argon has successfully been expressed with number density and packing fraction on the basis of the evaluated results of the dependences of heat capacity, thermal conductivity, and sound velocity on temperature, number density, atomic mass, and packing fraction. The results of evaluation using the WCA potentials reveal that the origin of dependences of the calculated thermal conductivity of simple liquids and molten salts on temperature and packing fraction is traceable to the softness of repulsive part in the potentials.
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