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2011 Fiscal Year Final Research Report

Novel High Frequency-compatible Low-CTE and Low-CHE Heat-resistant Dielectric Materials

Research Project

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Project/Area Number 21550212
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeSingle-year Grants
Section一般
Research Field Polymer/Textile materials
Research InstitutionToho University

Principal Investigator

HASEGAWA Masatoshi  東邦大学, 理学部, 教授 (40237988)

Project Period (FY) 2009 – 2011
Keywords耐熱性絶縁材料 / フレキシブルプリント配線基板
Research Abstract

Flexible printed circuit boards(FPC) are frequently used in various electronic devices such as mobile phones, TVs, cameras, personal computers. Recent trends to lightening, thinning, and miniaturizing for their devices also bring about strong demands toward further improved performances and functionalization of high-temperature polymeric materials used in FPCs, e. g., good dielectric properties at GHz ranges and excellent dimensional stability against thermal cycles and water absorption. The present research project successfully provided novel heat-resistant dielectric materials possessing excellent combined properties. The products obtained in this work are expected to be applied to various electronic devices.

  • Research Products

    (14 results)

All 2012 2011 2010 2009

All Journal Article (3 results) (of which Peer Reviewed: 3 results) Presentation (10 results) Book (1 results)

  • [Journal Article] γ-Butyrolactone-processable high-modulus poly(ester imide) s2012

    • Author(s)
      M. Hasegawa, Y. Tanaka, A. Tominaga
    • Journal Title

      Polym. Int.

      Volume: 61 Pages: 466-476

    • Peer Reviewed
  • [Journal Article] Thermal-and solution-processable polyimides based on mellophanic dianhydride. Applications as heat-resistant adhesives for copper-clad laminates2011

    • Author(s)
      M. Hasegawa, R. Nomura
    • Journal Title

      React. Funct. Polym.

      Volume: 71 Pages: 109-120

    • Peer Reviewed
  • [Journal Article] Poly(ester imide) s Possessing Low Coefficients of Thermal Expansion(CTE) and Low Water Absorption(III). Use of bis(4-aminophenyl) terephthalate and effect of substituents2010

    • Author(s)
      M. Hasegawa, Y. Sakamoto, Y. Tanaka, Y. Kobayashi
    • Journal Title

      Eur. Polym. J.

      Volume: 46 Pages: 1510-1524

    • Peer Reviewed
  • [Presentation] 低熱膨張・低吸水性ポリエステルイミド(36)更なる低弾性率化の方策2011

    • Author(s)
      堀敦史、石井淳一、長谷川匡俊
    • Organizer
      第60回高分子討論会
    • Place of Presentation
      岡山
    • Year and Date
      20110900
  • [Presentation] 低熱膨張・低吸水性ポリエステルイミド(34)更なる低弾性率化の方策2011

    • Author(s)
      堀敦史、石井淳一、長谷川匡俊
    • Organizer
      第60回高分子年次大会
    • Place of Presentation
      大阪
    • Year and Date
      20110500
  • [Presentation] 低熱膨張・低吸水性ポリエステルイミド(33)低熱膨張・低吸水性ポリエステルイミド(32)銅箔密着性改善の検討2010

    • Author(s)
      長谷川匡俊、岡美幸、秋元泰香
    • Organizer
      第59回高分子討論会
    • Place of Presentation
      札幌
    • Year and Date
      20100900
  • [Presentation] 低熱膨張・低吸水性ポリエステルイミド(32)低熱膨張・低吸水性ポリエステルイミド(32)低弾性率化および難燃化の検討2010

    • Author(s)
      長谷川匡俊、保坂千里、斎藤隆之
    • Organizer
      第59回高分子討論会
    • Place of Presentation
      札幌
    • Year and Date
      20100900
  • [Presentation] 低熱膨張・低吸水性ポリエステルイミド(31)非対称構造を有する剛直ユニットの導入効果2010

    • Author(s)
      長谷川匡俊、保坂千里、斎藤隆之、岡美幸
    • Organizer
      第59回高分子年次大会
    • Place of Presentation
      横浜
    • Year and Date
      20100500
  • [Presentation] 低熱膨張・低吸水性ポリエステルイミド(23)銅箔密着性改善モノマーの使用2009

    • Author(s)
      岡美幸、竹内雄太、長谷川匡俊
    • Organizer
      第58回高分子討論会
    • Place of Presentation
      熊本
    • Year and Date
      20090900
  • [Presentation] 低熱膨張・低吸水性ポリエステルイミド(24)リン含有モノマーを用いた難燃性改善の検討2009

    • Author(s)
      齋藤隆之、長谷川匡俊
    • Organizer
      第58回高分子討論会
    • Place of Presentation
      熊本
    • Year and Date
      20090900
  • [Presentation] 低熱膨張・低吸水性ポリエステルイミド(25)ナフタレン環導入の効果2009

    • Author(s)
      齋藤隆之、下倉剛、日紫喜智昭、長谷川匡俊
    • Organizer
      第58回高分子討論会
    • Place of Presentation
      熊本
    • Year and Date
      20090900
  • [Presentation] 低熱膨張・低吸水性ポリエステルイミド(29)銅箔密着性改善モノマーの使用2009

    • Author(s)
      岡美幸、長谷川匡俊
    • Organizer
      第18回ポリマー材料フォーラム
    • Place of Presentation
      船堀
    • Year and Date
      2009-11-27
  • [Presentation] 低熱膨張・低吸水性ポリエステルイミド(30)リン含有モノマーを用いた難燃性改善の検討2009

    • Author(s)
      齋藤隆之、長谷川匡俊
    • Organizer
      第18回ポリマー材料フォーラム
    • Place of Presentation
      船堀
    • Year and Date
      2009-11-27
  • [Book] 最新ポリイミド-基礎と応用-2010

    • Author(s)
      長谷川匡俊
    • Total Pages
      287-304
    • Publisher
      エヌ・ティー・エス

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Published: 2013-07-31  

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