2011 Fiscal Year Final Research Report
Development of Health Monitoring Technique for Thermal Fatigue Evaluation in High Density PCBs by Synchrotron Radiation CT
| Project/Area Number |
21560108
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Materials/Mechanics of materials
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| Research Institution | Toyama Industrial Technology Center, |
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Principal Investigator |
SAYAMA Toshihiko 富山県工業技術センター, 企画管理部企画情報課, 主幹研究員 (40416128)
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| Co-Investigator(Kenkyū-buntansha) |
TSURITANI Hiroyuki 富山県工業技術センター, 機械電子研究所機械システム課, 主任研究員 (70416147)
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| Co-Investigator(Renkei-kenkyūsha) |
UESUGI Kentaro 財団法人高輝度光科学研究センター, 利用研究促進部門イメージングチーム, 研究員 (80344399)
MORI Takao 富山県立大学, 工学部, 教授 (30275078)
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| Project Period (FY) |
2009 – 2011
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| Keywords | 信頼性設計 / 高密度実装 / マイクロ接合部 / X線マイクロCT / 放射光 / はんだ / 熱疲労 / 寿命評価 |
|---|
| Research Abstract |
In this work, synchrotron radiation CT technique was first applied to the nondestructive evaluation of the reliability in high density printed circuit boards. The developed technology helps nondestructive monitoring all the process, in which cracks in micro-joints initiate, propagate, and reach to fracture, in addition, helps estimating the lifetime to failure. This result will widely contribute to the improvement of the reliability and the development of electronic equipment.
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Research Products
(12 results)
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[Journal Article] Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects2011
Author(s)
Turitani, H., Sayama, T., Takayanagi, T., Okamoto, Y., Uesugi, K., and Mori, T
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Journal Title
Trans. ASME J. Electronic Packaging
Volume: Vol.133, No.2
Pages: 021007 1-9
Peer Reviewed
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[Presentation] Three-dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-shapedSolder Joints by Synchrotron Radiation X-ray Micro-tomography2011
Author(s)
Turitani, H., Sayama, T., Takayanagi, T., Okamoto, Y., Uesugi, K., and Mori, T
Organizer
Proc. of Inter PACK2011
Year and Date
20110000
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[Presentation] Phase Growth Process of Sn-3.0Ag-0.5Cu Solder Joints under Mechanical Cyclic Loading at the Same Temperature2009
Author(s)
Okamoto, Y., Takayanagi, T., Sayama, T., Ejiri, Y., Nakano, H., and Mori, T
Organizer
Proc. of InterPACK2009, ASME
Year and Date
20090000
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[Presentation] Nondestructive Evaluation of Thermal Fatigue Crack Propagationin Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-ray Micro-tomography2009
Author(s)
Turitani, H., Sayama, T., Takayanagi, T., Okamoto, Y., Uesugi, K., and Mori, T
Organizer
Proc. of InterPACK2009, ASME
Year and Date
20090000
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