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2011 Fiscal Year Final Research Report

Development of ultra-precision cutting method for composite material with thermosetting resin and electric conductor

Research Project

  • PDF
Project/Area Number 21560111
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeSingle-year Grants
Section一般
Research Field Production engineering/Processing studies
Research InstitutionSaitama University

Principal Investigator

HORIO Kenichiro  埼玉大学, 大学院・理工学研究科, 教授 (60201761)

Co-Investigator(Kenkyū-buntansha) KANEKO Jun'ichi  埼玉大学, 大学院・理工学研究科, 助教 (80375584)
Project Period (FY) 2009 – 2011
Keywords切削 / ダイヤモンド工具 / 樹脂 / 半導体 / 熱硬化性樹脂 / 基板材料
Research Abstract

This study deals development of a new precision cutting method for composite material with thermosetting resin and electric conductor. In manufacturing process of a large scale integrated circuit, a pasting process between two ceramic substrates with thermosetting resin is required. In this study, a new cutting method with single crystal diamond byte to realize high flatness of machined resin surfaces is developed.

  • Research Products

    (2 results)

All 2011 2010

All Presentation (2 results)

  • [Presentation] 電子基板用プラスチック材料における微細溝形状の創成2011

    • Author(s)
      三輪直彦, 金子順一, 堀尾健一郎
    • Organizer
      2011年度精密工学会春季大会学術講演会講演論文集
    • Place of Presentation
      岡山大学
    • Year and Date
      20111119-20
  • [Presentation] 電子基板用プラスチック材料における選択的立体形状切削2010

    • Author(s)
      三輪直彦, 金子順一, 堀尾健一郎
    • Organizer
      第8回日本機械学会生産加工・工作機械部門講演会講演論文集
    • Year and Date
      20100000

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Published: 2013-07-31  

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