2011 Fiscal Year Final Research Report
Development of chemical soft abrasive with high performance chemical mechanical polishing property
| Project/Area Number |
21560766
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Material processing/treatments
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| Research Institution | Kumamoto Industrial Research Institute |
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Principal Investigator |
NAGAOKA Shoji 熊本県産業技術センター, 材料・地域資源室, 研究参事 (10227994)
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| Co-Investigator(Kenkyū-buntansha) |
IHARA Hirotaka 熊本大学, 大学院・自然科学研究科, 教授 (10151648)
HORIKAWA Maki 熊本県産業技術センター, 材料・地域資源室, 研究員 (50588465)
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| Project Period (FY) |
2009 – 2011
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| Keywords | ダイヤ / セリア / 研磨材 / セルロース / 硅素系化合物 |
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| Research Abstract |
Generally, CeO_2 is utilized as abrasive for quartz glass substrate in bulk. It was hoped that the use of cerium that is rare earth, was reduced. We focused polymer-base materials as polishing materials for quartz glass substrate, and various types of cellulose/inorganic materials hybrid spherical microbeads, in order to develop reducing technique of usage of CeO_2. In addition, we developed chemical soft abrasives for transparent electrode using cationic polyacrylate spherical microbeads, in order to develop alternative materials to CeO_2. In polishing property, the polishing of substrate using conventional hard abrasive often invoked the wave, scratch and edge roll-off against a silicon and glass substrate surface. In the case of transparent electrode, the conductive layer was peeled from glass substrate. However, the developed chemical soft abrasives not only reduced usage of ceria for polishing of glass substrate, but could provide the excellent abrasive performance to quartz substrate i. e, non-wave, non-scratch and non-peeling for conductive layer.
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