2010 Fiscal Year Final Research Report
STUDY ON ELECTRONIC EQUIPMENT COOLING WITH MICROENCAPSULATED PHASE CHANGE MATERIAL SUSPENSIONS FLOWING IN MINI-PIPE
| Project/Area Number |
21760160
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| Research Category |
Grant-in-Aid for Young Scientists (B)
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| Allocation Type | Single-year Grants |
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| Research Field |
Thermal engineering
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| Research Institution | Toyama Prefectural University |
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Principal Investigator |
NAKAGAWA Shinji Toyama Prefectural University, 工学部・機械システム工学科, 准教授 (30337878)
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| Project Period (FY) |
2009 – 2010
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| Keywords | 伝熱機器 |
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| Research Abstract |
Fundamental thermal performance of a liquid cooling system for small electronic equipment has been examined. A liquid cooling system is attracting attention because an increase of heat generation density in electronic components requires effective cooling. The cooling system proposed in this study uses a mini-pipe and a microencapsulated phase change material (MEPCM). The coolant including the MEPCM with an average diameter of 3μm was supplied into the mini-pipe having a diameter of 1mm. The mass concentration of MEPCM was changed from 0 to 5%. The increase of the mass concentration reduces the temperature rise of the heated pipe wall.
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