2021 Fiscal Year Annual Research Report
全印刷フレキシブル電子デバイスの実現に向けたナノ材料の機能性制御
| Project/Area Number |
21J13108
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| Research Institution | University of Tsukuba |
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Principal Investigator |
李 玲穎 筑波大学, 数理物質科学研究科, 特別研究員(DC2)
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| Project Period (FY) |
2021-04-28 – 2023-03-31
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| Keywords | ソフトエレクトロニクス / 自己組織化リソグラフィ / 表面・界面物性 / パターニング / 付加製造 / 有機トランジスタ / 透明導電フィルム / プリンテッドエレクトロニクス |
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| Outline of Annual Research Achievements |
An ultrahigh-resolution directed self-assembly strategy named dual surface architectonics (DSA) has been proposed for manufacturing high-performance soft electronics. The DSA strategy endows submicrometer-scale surface regions with strong adsorbing and pinning effect toward functional inks via simple photoirradiation and chemical polarization, which enables spontaneous patterning of metal nanoparticle-based and nanowire-based electrodes with ultrahigh resolution, prominent electrical conductivity, outstanding mechanical flexibility, and a high degree of circuit design freedom. The DSA strategy exhibits broad application prospects in soft electronic manufacturing, such as large-scale flexible transparent conductors and fully printed short-channel organic thin-film transistors.
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| Current Status of Research Progress |
Current Status of Research Progress
1: Research has progressed more than it was originally planned.
Reason
According to the research plan, the directed self-assembly techniques have been developed for patterning high-resolution soft complex circuits spontaneously with prominent conductivity and flexibility. Notably, benefitted by the significantly optimized patterning capacity, ultrahigh resolution (600 nm) of the self-assembled electrodes has been first achieved via non-lithographic liquid-mediated technology. Moreover, the fully printed organic thin film transistors with short channel length (1μm) have been manufactured successfully with large on-off ratio and high mobility, which not only accomplish the task ahead of schedule but also exhibit a broad application prospect of directed self-assembly techniques in the future field of additively manufactured electronics.
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| Strategy for Future Research Activity |
In conventional directed self-assembly, the functional circuits are generally patterned on the modified hydrophilic regions of the hydrophobic substrate, resulting in a high contact resistance between electrode circuits and semiconductor layers and thus hindering the practical applications. The newly proposed directed self-assembly strategy offers a reversed processability, which generates functional patterns on the hydrophobic regions and provides high-surface-free-energy states. Hence, the issues of high contact resistance will be explored by laminating the semiconductors onto the homogenous electrode circuits. More varieties of one-dimensional functional materials will be used to pattern different functional layers toward facile manufacture of stretchable organic thin-film transistors.
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