2023 Fiscal Year Final Research Report
Evaluation of Interfacial strength based on peeling mechanism along adhesive interface
| Project/Area Number |
21K03765
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Multi-year Fund |
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| Section | 一般 |
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| Review Section |
Basic Section 18010:Mechanics of materials and materials-related
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| Research Institution | Hokkaido University |
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Principal Investigator |
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| Project Period (FY) |
2021-04-01 – 2024-03-31
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| Keywords | Adhesive / Interfacial strength / Peel test |
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| Outline of Final Research Achievements |
In this study, the contribution of the adhesive layer and backing of the adhesive tape to the peel strength was clarified. First, an adhesive tape was modeled using the hyperelastic gel sheet and the steel pins on the magnet, which represent the adhesive layer and the interfacial bonding force, respectively. Their contribution to the peel force was successfully quantified. Next, a testing machine was developed to measure the stress distribution in the peeling region where the adhesive layer stretches. By comparing the results of samples with different tape thicknesses, the effect of the backing thickness on the peeling force was also quantified.
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| Free Research Field |
Fracture mechanics, Adhesive bonding
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| Academic Significance and Societal Importance of the Research Achievements |
粘着製品は，エレクトロニクスや医療分野を中心として新しい用途が拡大しており，従来の化学的，材料科学的な知見に基づく試行錯誤的な粘着製品設計のアプローチでは立ち行かなくなってきている．本研究によって力と変形量の関係に基づく材料力学的な解釈が構築されることで，機械製品で行われているようなコンピュータシミュレーションに基づく応力解析を活用した効率的な製品設計手法へと結び付けることが期待される．
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